From: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
To: Anup Vishwakarma <anup.vishwakarma@oss.qualcomm.com>,
Bjorn Andersson <andersson@kernel.org>,
Mathieu Poirier <mathieu.poirier@linaro.org>
Cc: linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
linux-kernel@vger.kernel.org
Subject: Re: [PATCH] remoteproc: qcom_wcnss: Clean up subdevices on probe failure
Date: Thu, 5 Nov 2026 16:56:11 +0100 [thread overview]
Message-ID: <076f0e7b-8fe6-4e9e-a0bc-a80ee83f879d@oss.qualcomm.com> (raw)
In-Reply-To: <20261105-b4-wcnss_unwind_send-v1-1-ad94209143da@oss.qualcomm.com>
On 11/5/26 1:31 PM, Anup Vishwakarma wrote:
> wcnss_probe() registers the SMD and sysmon subdevices before the iris
> probe and rproc_add(), but the error paths after them only release the
> power domains. A failure there, such as a deferred probe of the iris
> clock or regulators, leaves the SMD subdevice registered with its
> smd-edge node reference held, and leaves the sysmon instance on the
> global sysmon list.
>
> Unwind in reverse order of registration. The sysmon failure path skips
> qcom_remove_sysmon_subdev(), as wcnss->sysmon is an error pointer there.
>
> Fixes: 5a856bc63ce9 ("remoteproc: wcnss: Bond SMD edge to remoteproc")
> Fixes: 1fb82ee806d1 ("remoteproc: qcom: Introduce sysmon")
> Signed-off-by: Anup Vishwakarma <anup.vishwakarma@oss.qualcomm.com>
> ---
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Konrad
prev parent reply other threads:[~2026-11-05 15:56 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-11-05 12:31 Anup Vishwakarma
2026-11-05 15:56 ` Konrad Dybcio [this message]
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