Re: [PATCH v14 0/3] mtd: Add support for stacked memories

[Miquel Raynal <miquel.raynal@bootlin.com>]

On Mon, 23 Jun 2025 16:24:42 +0530, Amit Kumar Mahapatra wrote:
> This patch series adds stacked support by enhancing the existing mtd-concat
> driver to be more generic.
> 
> As background, a few years ago, Bernhard Frauendienst initiated an effort
> [2] to achieve the same, which was later adapted by Miquel [1] to introduce
> stacked mode support. In this approach, partitions to be concatenated were
> specified using a DT property "part-concat" within the partitions
> definition, allowing two MTD devices to function as a single larger one in
> order to be able to define partitions across chip boundaries. However, the
> bindings were not accepted. As a result, the mtd-concat approach was
> dropped, and alternative DT bindings were introduced [3][4][5], describing
> the two flash devices as one. Corresponding SPI core changes to support
> these bindings were later added [6].
> 
> [...]

Applied to mtd/next, thanks!

[1/3] dt-bindings: mtd: Describe MTD partitions concatenation
      commit: a7c81ac328a6dddf51588ecc7a94f56da34c7875
[2/3] mtd: Move struct mtd_concat definition to header file
      commit: 08be224e3965dc716460ee62ddf1f30421049bed
[3/3] mtd: Add driver for concatenating devices
      commit: fa47dc8295194a03c9182945805b617b01447ae9

Patche(s) should be available on mtd/linux.git and will be
part of the next PR (provided that no robot complains by then).

Kind regards,
Miquèl