From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751835AbdJCV7K (ORCPT ); Tue, 3 Oct 2017 17:59:10 -0400 Received: from mail-oi0-f65.google.com ([209.85.218.65]:38711 "EHLO mail-oi0-f65.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751642AbdJCV7I (ORCPT ); Tue, 3 Oct 2017 17:59:08 -0400 X-Google-Smtp-Source: AOwi7QAITFZKk1xDYLdGiti872edzSpP0/oo+aNZHg+vgunoaDOBdG8IYN6OtG1YEljeNXIrTzu5Tg== Date: Tue, 3 Oct 2017 16:59:06 -0500 From: Rob Herring To: Tao Wang Cc: rui.zhang@intel.com, edubezval@gmail.com, mark.rutland@arm.com, xuwei5@hisilicon.com, catalin.marinas@arm.com, will.deacon@arm.com, leo.yan@linaro.org, lonela.Voinescu@arm.com, Valentin.Schneider@arm.com, vincent.guittot@linaro.org, daniel.lezcano@linaro.org, sunzhaosheng@hisilicon.com, gengyanping@hisilicon.com, linux-pm@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, linux-arm-kernel@lists.infradead.org, Kevin Wangtao Subject: Re: [PATCH 7/9] dt-bindings: Document the hi3660 thermal sensor binding Message-ID: <20171003215906.aokygmdsftqkkogs@rob-hp-laptop> References: <1506073332-92438-1-git-send-email-kevin.wangtao@hisilicon.com> <1506073332-92438-8-git-send-email-kevin.wangtao@hisilicon.com> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <1506073332-92438-8-git-send-email-kevin.wangtao@hisilicon.com> User-Agent: NeoMutt/20170113 (1.7.2) Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Fri, Sep 22, 2017 at 05:42:10PM +0800, Tao Wang wrote: > From: Kevin Wangtao > > This adds documentation of device tree bindings for the > thermal sensor controller of hi3660 SoC. > > Signed-off-by: Kevin Wangtao > --- > Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt | 9 +++++++++ > 1 file changed, 9 insertions(+) Acked-by: Rob Herring