From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751660AbeA2JtW (ORCPT ); Mon, 29 Jan 2018 04:49:22 -0500 Received: from mail.free-electrons.com ([62.4.15.54]:59001 "EHLO mail.free-electrons.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751296AbeA2JtU (ORCPT ); Mon, 29 Jan 2018 04:49:20 -0500 Date: Mon, 29 Jan 2018 10:49:18 +0100 From: Maxime Ripard To: Philipp Rossak Cc: lee.jones@linaro.org, robh+dt@kernel.org, mark.rutland@arm.com, wens@csie.org, linux@armlinux.org.uk, jic23@kernel.org, knaack.h@gmx.de, lars@metafoo.de, pmeerw@pmeerw.net, davem@davemloft.net, hans.verkuil@cisco.com, mchehab@kernel.org, rask@formelder.dk, clabbe.montjoie@gmail.com, sean@mess.org, krzk@kernel.org, quentin.schulz@free-electrons.com, icenowy@aosc.io, edu.molinas@gmail.com, singhalsimran0@gmail.com, linux-iio@vger.kernel.org, devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org, linux-sunxi@googlegroups.com Subject: Re: [PATCH v2 11/16] arm: dts: sunxi-h3-h5: add support for the thermal sensor in H3 and H5 Message-ID: <20180129094918.4fvxpmoftgxxkqg3@flea.lan> References: <20180128232919.12639-1-embed3d@gmail.com> <20180128232919.12639-12-embed3d@gmail.com> MIME-Version: 1.0 Content-Type: multipart/signed; micalg=pgp-sha256; protocol="application/pgp-signature"; boundary="zram63ggkfbahhak" Content-Disposition: inline In-Reply-To: <20180128232919.12639-12-embed3d@gmail.com> User-Agent: NeoMutt/20171215 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org --zram63ggkfbahhak Content-Type: text/plain; charset=us-ascii Content-Disposition: inline Content-Transfer-Encoding: quoted-printable Hi, On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote: > As we have gained the support for the thermal sensor in H3 and H5, > we can now add its device nodes to the device tree. The H3 and H5 share > most of its compatible. The compatible and the thermal sensor cells > will be added in an additional patch per device. >=20 > Signed-off-by: Philipp Rossak > --- > arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ > 1 file changed, 9 insertions(+) >=20 > diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi= -h3-h5.dtsi > index 7a83b15225c7..413c789b588d 100644 > --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi > +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi > @@ -426,6 +426,15 @@ > }; > }; > =20 > + ths: thermal-sensor@1c25000 { > + reg =3D <0x01c25000 0x100>; The size is 0x400 Maxime --=20 Maxime Ripard, Free Electrons Embedded Linux and Kernel engineering http://free-electrons.com --zram63ggkfbahhak Content-Type: application/pgp-signature; name="signature.asc" -----BEGIN PGP SIGNATURE----- iQIzBAABCAAdFiEE0VqZU19dR2zEVaqr0rTAlCFNr3QFAlpu7h0ACgkQ0rTAlCFN r3T7sQ/+L4rNSNcOG+zXTvgEk2ZTZjst3MhthNWCBtAMwxp474PgJjiDAsbZShg/ 6FxW43ytU08kOKu8V5hmuv/7QF9bpfTW8XHpOVIw5Co9GW4bGsfkeGWDQ34rrFn1 sG9jUWNCqqxiTj5UxMjxpmk3YYJvKXXl9GW6CxINAAKcDY05/Oo43+FXaE67P01v tAeI1k1MMJEJh4zXfp4BMFp1F8GDGbn9LTX18Qh0HaXwntgZXIrD1UqDDVi5wM// u/QSFjjQuSV0plaYtNN2rblvMgq+62/juCHHf1JiwDQvQIS9TVbq4tlRuVNvJpwb we+LuwQMNlEsYGu4cugpX3mgkl+9LxYpGeLV7EK/YlyglNcMyR6x/8cuZ6svl0l+ sj4cgwu3eu2oa28y0GTFrvQhvliD3+su8V6emcp9NhZ0OjjBkzz9+xgygM9ojIoX QJVFFn+KNl2LuwjJL4zVQNGdloTLdHfbxpOQkNJacL74CbJY5mDnjjsQCvumzBnx 7tdIzgpEowXh4Vx0JeY4yAqLMO7Y4YZdcVIRzCoBOvwNw5d4c1xkQrUPvvHjsUVj GTQq/yparJ44sVpQmK8Y+aUdAmLlqqHZtE1OCF27RZjAjT7uxAYsf+XoJak25Rpa 2cyFo7Qjh1s70YrWy6hScYveFavtNiharshosBWPbwAItwxq1mQ= =L5Rl -----END PGP SIGNATURE----- --zram63ggkfbahhak--