From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: Stephan Gerhold <stephan.gerhold@linaro.org>
Cc: andersson@kernel.org, konradybcio@kernel.org, robh@kernel.org,
krzk+dt@kernel.org, johannes.goede@oss.qualcomm.com,
conor+dt@kernel.org, linux-arm-msm@vger.kernel.org,
devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
Mark Pearson <mpearson-lenovo@squebb.ca>
Subject: Re: [PATCH v3] arm64: dts: qcom: x1e78100-thinkpad-t14s: Add thermal zones for PMICs
Date: Wed, 21 Oct 2026 18:20:55 +0200 [thread overview]
Message-ID: <2d885d41-7d05-458c-8364-e206dab12792@oss.qualcomm.com> (raw)
In-Reply-To: <ath8tHxHOdA7G-Bx@linaro.org>
On 10/21/26 10:49, Stephan Gerhold wrote:
> On Tue, Oct 20, 2026 at 06:08:56PM +0200, Daniel Lezcano wrote:
>>
>> Thanks Stephan for the additional information, that's very helpful.
>>
>> We currently have an urgent thermal issue on this platform, and getting this
>> thermal mitigation upstream is important to prevent overheating under
>> sustained workloads.
>>
>> Would it be acceptable to address the sensor naming and description
>> improvements in a follow-up patch, so that we can get the thermal protection
>> in place first?
>>
>> Of course, if any of these changes are critical for the correctness of the
>> thermal mitigation, we should address them now.
>>
>
> I have no intention to delay this patch. In fact, since I'm using the
> latest unmodified stable kernel on my T14s, I'm also suffering from
> these thermal issues. :-)
>
> On the other hand, we are at the beginning of the merge window and Bjorn
> is unlikely to queue patches until that ends. The changes that
> I suggested are purely cosmetic (the names of the thermal zones), there
> is no need to repeat the thermal validation. The throttling behavior
> will be identical no matter which name is used for the thermal zones.
>
> IMO we should use the remaining time until the merge window ends to
> correct the naming to avoid any confusion for people reading the patch
> once it lands.
Ok, fair enough
I propose the following names for the thermal zone:
dram-board-thermal
gpu-board-thermal
fan-board-thermal
wwan-board-thermal
chg-board-thermal
cpu-board-thermal
typec-board-thermal
so we can capture with the name the ones related to the non-on-die sensors
Sounds good ?
next prev parent reply other threads:[~2026-10-21 16:21 UTC|newest]
Thread overview: 7+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-10-14 19:35 Daniel Lezcano
2026-10-14 19:36 ` johannes.goede
2026-10-16 9:56 ` Stephan Gerhold
2026-10-20 16:08 ` Daniel Lezcano
2026-10-21 8:49 ` Stephan Gerhold
2026-10-21 16:20 ` Daniel Lezcano [this message]
2026-10-21 17:14 ` Stephan Gerhold
Reply instructions:
You may reply publicly to this message via plain-text email
using any one of the following methods:
* Save the following mbox file, import it into your mail client,
and reply-to-all from there: mbox
Avoid top-posting and favor interleaved quoting:
https://en.wikipedia.org/wiki/Posting_style#Interleaved_style
* Reply using the --to, --cc, and --in-reply-to
switches of git-send-email(1):
git send-email \
--in-reply-to=2d885d41-7d05-458c-8364-e206dab12792@oss.qualcomm.com \
--to=daniel.lezcano@oss.qualcomm.com \
--cc=andersson@kernel.org \
--cc=conor+dt@kernel.org \
--cc=devicetree@vger.kernel.org \
--cc=johannes.goede@oss.qualcomm.com \
--cc=konradybcio@kernel.org \
--cc=krzk+dt@kernel.org \
--cc=linux-arm-msm@vger.kernel.org \
--cc=linux-kernel@vger.kernel.org \
--cc=mpearson-lenovo@squebb.ca \
--cc=robh@kernel.org \
--cc=stephan.gerhold@linaro.org \
/path/to/YOUR_REPLY
https://kernel.org/pub/software/scm/git/docs/git-send-email.html
* If your mail client supports setting the In-Reply-To header
via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line
before the message body.
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox
all inboxes | Powered by JetHome®