Re: Re: [PATCH] USB: Gadget: Composite: Added error handling codes to prevent a memory leak case when the configuration's bind function failed

[Yong-Sul Oh <yongsul96.oh@samsung.com>]

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Dear Sergei Shtylyov

I appreciate your guideline.
(i will check again the "submittingpatches & submitchecklist")
I will fix it & try to send it soundly again.

Best regards,  
Yongsul Oh

------- Original Message -------
Sender : Sergei Shtylyov
Date : 2012-03-15 22:57 (GMT+09:00)
Title : Re: [PATCH] USB: Gadget: Composite: Added error handling codes to prevent a memory leak case when the configuration's bind function failed

Hello.

On 15-03-2012 5:23, Yongsul@vger.kernel.org wrote:

> From: yongsul96.oh@samsung.com

>   In some usb gadget driver, for example usb gadget serial driver(serial.c),
> multifunction composite driver(multi,c), nokia composite gadget driver(nokia.c),
> HID composite driver(hid.c), CDC composite driver(cdc2.c).., the configuration's
> bind function by called the 'usb_add_config()' has multiple bind config functions
> for each functionality, for example cdc2 configuration bind function -'cdc_do_config()'
> has two functionality bind config functions -'ecm_bind_config()'&  'acm_bind_config()'
> in CDC composite driver.
>   In each functionality bind config function, new instance for each functionality is
> allocated&  initialized by 'kzalloc()' ,and finally the new instance is added by
> 'usb_add_function()'. After 'usb_add_function' state, already created the instance
> is only handled by its configuration&  freed from functionality unbind function.
>   So, If an error occurred during the second functionality bind config state, for example
> an error occurred at 'acm_bind_config()' after succeeding 'ecm_bind_function()',
> The created instance by 'acm_bind_config()' cannot be freed.
> And it makes memory leak situation.

> This patch fixes this issue.

> Signed-off-by: yongsul96.oh@samsung.com 

    Real name is required on the left, not another copy of email.

WBR, Sergei






Oh, Yong-Sul
Engineer

Mobile S/W Platform Lab.
Telecommunication R&D Center
Telecommunication Network Business

SAMSUNG ELECTRONICS CO.,LTD

Tel : +82-31-279-0284
Mobile : +82-10-9530-0284
Fax : +82-31-279-5521
E-mail : yongsul96.oh@samsung.com




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