From: Francesco Lavra <francescolavra.fl@gmail.com>
To: Zhang Rui <rui.zhang@intel.com>
Cc: "hongbo.zhang" <hongbo.zhang@linaro.org>,
linaro-kernel@lists.linaro.org, linaro-dev@lists.linaro.org,
patches@linaro.org, linux-pm@vger.kernel.org,
linux-kernel@vger.kernel.org, amit.kachhap@linaro.org,
STEricsson_nomadik_linux@list.st.com, kernel@igloocommunity.org,
"hongbo.zhang" <hongbo.zhang@linaro.com>
Subject: Re: [PATCH V6 1/2] Thermal: Add ST-Ericsson DB8500 thermal driver.
Date: Sun, 18 Nov 2012 15:29:51 +0100 [thread overview]
Message-ID: <50A8F0DF.8040509@gmail.com> (raw)
In-Reply-To: <1352983878.2080.25.camel@rzhang1-mobl4>
On 11/15/2012 01:51 PM, Zhang Rui wrote:
> On Thu, 2012-11-15 at 18:56 +0800, hongbo.zhang wrote:
>> From: "hongbo.zhang" <hongbo.zhang@linaro.com>
>>
>> This driver is based on the thermal management framework in thermal_sys.c. A
>> thermal zone device is created with the trip points to which cooling devices
>> can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
>> clipped down to cool the CPU, and other cooling devices can be added and bound
>> to the trip points dynamically. The platform specific PRCMU interrupts are
>> used to active thermal update when trip points are reached.
>>
>> Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
>> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
>> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
>
> Patch is refreshed and applied to thermal next.
> refreshed patch attached.
[...]
> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
> index 99b6587..d96da07 100644
> --- a/drivers/thermal/Kconfig
> +++ b/drivers/thermal/Kconfig
> @@ -101,5 +101,25 @@ config EXYNOS_THERMAL
> If you say yes here you get support for TMU (Thermal Managment
> Unit) on SAMSUNG EXYNOS series of SoC.
>
> +config DB8500_THERMAL
> + bool "DB8500 thermal management"
> + depends on ARCH_U8500
Shouldn't it depend on THERMAL as well, as in Hongbo's original patch?
> + default y
> + help
> + Adds DB8500 thermal management implementation according to the thermal
> + management framework. A thermal zone with several trip points will be
> + created. Cooling devices can be bound to the trip points to cool this
> + thermal zone if trip points reached.
> +
> +config DB8500_CPUFREQ_COOLING
> + tristate "DB8500 cpufreq cooling"
> + depends on ARCH_U8500
> + depends on CPU_THERMAL
> + default y
> + help
> + Adds DB8500 cpufreq cooling devices, and these cooling devices can be
> + bound to thermal zone trip points. When a trip point reached, the
> + bound cpufreq cooling device turns active to set CPU frequency low to
> + cool down the CPU.
>
> endif
--
Francesco
next prev parent reply other threads:[~2012-11-18 14:31 UTC|newest]
Thread overview: 7+ messages / expand[flat|nested] mbox.gz Atom feed top
2012-11-15 10:56 [PATCH V6 0/2] Upstream ST-Ericsson " hongbo.zhang
2012-11-15 10:56 ` [PATCH V6 1/2] Thermal: Add ST-Ericsson DB8500 " hongbo.zhang
2012-11-15 12:51 ` Zhang Rui
2012-11-18 14:29 ` Francesco Lavra [this message]
2012-11-19 0:42 ` Zhang Rui
2012-11-15 10:56 ` [PATCH V6 2/2] Thermal: Add ST-Ericsson DB8500 thermal properties and platform data hongbo.zhang
2012-11-15 12:51 ` Zhang Rui
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