mirror of https://lore.kernel.org/lkml/
 help / color / mirror / Atom feed
From: Eduardo Valentin <eduardo.valentin@ti.com>
To: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: <swarren@wwwdotorg.org>, <pawel.moll@arm.com>,
	<mark.rutland@arm.com>, <ian.campbell@citrix.com>,
	<rob.herring@calxeda.com>, <linux@roeck-us.net>,
	<rui.zhang@intel.com>, <wni@nvidia.com>,
	<grant.likely@linaro.org>, <durgadoss.r@intel.com>,
	<linux-pm@vger.kernel.org>, <devicetree@vger.kernel.org>,
	<lm-sensors@lm-sensors.org>, <linux-kernel@vger.kernel.org>
Subject: Re: [PATCHv4 00/18] device thermal limits represented in device tree nodes (v4)
Date: Thu, 26 Sep 2013 23:15:02 -0400	[thread overview]
Message-ID: <5244F836.3070102@ti.com> (raw)
In-Reply-To: <1380251605-3804-1-git-send-email-eduardo.valentin@ti.com>

[-- Attachment #1: Type: text/plain, Size: 4305 bytes --]

On 26-09-2013 23:13, Eduardo Valentin wrote:
> Hello all,
> 
> Here is the continuation of work of representing hardware thermal properties
> in device tree infrastructure. The present patch series is the fourth version
> of this work. Previous versions were sent as RFCs and can be found here:
> V3: 

Too fast, hit send too early. For those interested, here is the link to V3:
https://lkml.org/lkml/2013/9/15/122

> RFCv2: http://lkml.org/lkml/2013/8/23/594
> RFCv1: http://lkml.org/lkml/2013/7/22/319
> 
> Major difference from V3 is on the parser itself. I have updated the binding
> documentation and improved the code accordingly to previous comments mainly
> from Mark R. and Joe P.
> 
> The changes on hwmon drivers have been accepted by Guenter, and in this
> series I am including his Acked-by, as I didn't change anything on that side.
> 
> I also found a bug while using all involved code built as modules, thus
> I have reworked a bit the cooling device registration part. This is why
> there are two new patches in this series (patches 02 and 04).
> 
> Tests were done, just like in V3, on TI OMAP4430, OMAP4460, OMAP5430 and DRA7,
> although this series is not including the DRA7 part (I will be sending separately).
> 
> Thanks all who have been contributing reviewing this code.
> 
> All best,
> 
> Eduardo Valentin (18):
>   thermal: allow registering without .get_temp
>   thermal: core: allow binding via .bind when tzp is present
>   thermal: introduce device tree parser
>   thermal: core: introduce thermal_of_cooling_device_register
>   thermal: cpu_cooling: introduce of_cpufreq_cooling_register
>   cpufreq: cpufreq-cpu0: add dt node parsing for cooling device
>     properties
>   hwmon: lm75: expose to thermal fw via DT nodes
>   hwmon: tmp102: expose to thermal fw via DT nodes
>   thermal: ti-soc-thermal: use thermal DT infrastructure
>   arm: dts: add omap4 CPU thermal data
>   arm: dts: add omap4430 thermal data
>   arm: dts: add omap4460 thermal data
>   arm: dts: add cooling properties on omap4430 cpu node
>   arm: dts: add cooling properties on omap4460 cpu node
>   arm: dts: add omap5 GPU thermal data
>   arm: dts: add omap5 CORE thermal data
>   arm: dts: add omap5 thermal data
>   arm: dts: add cooling properties on omap5 cpu node
> 
>  .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt   |   7 +
>  .../devicetree/bindings/thermal/thermal.txt        | 537 +++++++++++++
>  arch/arm/boot/dts/omap4-cpu-thermal.dtsi           |  41 +
>  arch/arm/boot/dts/omap443x.dtsi                    |  15 +-
>  arch/arm/boot/dts/omap4460.dtsi                    |  15 +-
>  arch/arm/boot/dts/omap5-core-thermal.dtsi          |  28 +
>  arch/arm/boot/dts/omap5-gpu-thermal.dtsi           |  28 +
>  arch/arm/boot/dts/omap5.dtsi                       |  15 +-
>  drivers/cpufreq/Kconfig                            |   2 +-
>  drivers/cpufreq/cpufreq-cpu0.c                     |  16 +
>  drivers/hwmon/lm75.c                               |  35 +-
>  drivers/hwmon/tmp102.c                             |  19 +
>  drivers/thermal/Kconfig                            |  14 +
>  drivers/thermal/Makefile                           |   1 +
>  drivers/thermal/cpu_cooling.c                      |  56 +-
>  drivers/thermal/of-thermal.c                       | 845 +++++++++++++++++++++
>  drivers/thermal/thermal_core.c                     |  79 +-
>  drivers/thermal/thermal_core.h                     |   9 +
>  drivers/thermal/ti-soc-thermal/ti-thermal-common.c |  77 +-
>  include/dt-bindings/thermal/thermal.h              |  27 +
>  include/linux/cpu_cooling.h                        |  25 +
>  include/linux/thermal.h                            |  32 +-
>  22 files changed, 1880 insertions(+), 43 deletions(-)
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt
>  create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi
>  create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi
>  create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi
>  create mode 100644 drivers/thermal/of-thermal.c
>  create mode 100644 include/dt-bindings/thermal/thermal.h
> 


-- 
You have got to be excited about what you are doing. (L. Lamport)

Eduardo Valentin


[-- Attachment #2: OpenPGP digital signature --]
[-- Type: application/pgp-signature, Size: 295 bytes --]

      parent reply	other threads:[~2013-09-27  3:16 UTC|newest]

Thread overview: 31+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2013-09-27  3:13 Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 01/18] thermal: allow registering without .get_temp Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 02/18] thermal: core: allow binding via .bind when tzp is present Eduardo Valentin
2013-11-06  2:56   ` Wei Ni
2013-09-27  3:13 ` [PATCHv7 03/18] thermal: introduce device tree parser Eduardo Valentin
2013-09-30 15:36   ` Mark Rutland
2013-09-30 20:47     ` Eduardo Valentin
2013-10-01  2:39   ` [PATCHv8 " Eduardo Valentin
2013-10-07 20:51     ` Mark Rutland
2013-10-08 14:59       ` Eduardo Valentin
2013-11-05 18:08       ` Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 04/18] thermal: core: introduce thermal_of_cooling_device_register Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 05/18] thermal: cpu_cooling: introduce of_cpufreq_cooling_register Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 06/18] cpufreq: cpufreq-cpu0: add dt node parsing for cooling device properties Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 07/18] hwmon: lm75: expose to thermal fw via DT nodes Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 08/18] hwmon: tmp102: " Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 09/18] thermal: ti-soc-thermal: use thermal DT infrastructure Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 10/18] arm: dts: add omap4 CPU thermal data Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 11/18] arm: dts: add omap4430 " Eduardo Valentin
2013-09-27 12:24   ` Nishanth Menon
2013-09-27 13:20     ` Eduardo Valentin
2013-09-27 13:26       ` Nishanth Menon
2013-09-27 13:42         ` Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 12/18] arm: dts: add omap4460 " Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 13/18] arm: dts: add cooling properties on omap4430 cpu node Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 14/18] arm: dts: add cooling properties on omap4460 " Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 15/18] arm: dts: add omap5 GPU thermal data Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 16/18] arm: dts: add omap5 CORE " Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 17/18] arm: dts: add omap5 " Eduardo Valentin
2013-09-27  3:13 ` [PATCHv4 18/18] arm: dts: add cooling properties on omap5 cpu node Eduardo Valentin
2013-09-27  3:15 ` Eduardo Valentin [this message]

Reply instructions:

You may reply publicly to this message via plain-text email
using any one of the following methods:

* Save the following mbox file, import it into your mail client,
  and reply-to-all from there: mbox

  Avoid top-posting and favor interleaved quoting:
  https://en.wikipedia.org/wiki/Posting_style#Interleaved_style

* Reply using the --to, --cc, and --in-reply-to
  switches of git-send-email(1):

  git send-email \
    --in-reply-to=5244F836.3070102@ti.com \
    --to=eduardo.valentin@ti.com \
    --cc=devicetree@vger.kernel.org \
    --cc=durgadoss.r@intel.com \
    --cc=grant.likely@linaro.org \
    --cc=ian.campbell@citrix.com \
    --cc=linux-kernel@vger.kernel.org \
    --cc=linux-pm@vger.kernel.org \
    --cc=linux@roeck-us.net \
    --cc=lm-sensors@lm-sensors.org \
    --cc=mark.rutland@arm.com \
    --cc=pawel.moll@arm.com \
    --cc=rob.herring@calxeda.com \
    --cc=rui.zhang@intel.com \
    --cc=swarren@wwwdotorg.org \
    --cc=wni@nvidia.com \
    /path/to/YOUR_REPLY

  https://kernel.org/pub/software/scm/git/docs/git-send-email.html

* If your mail client supports setting the In-Reply-To header
  via mailto: links, try the mailto: link
Be sure your reply has a Subject: header at the top and a blank line before the message body.
This is a public inbox, see mirroring instructions
for how to clone and mirror all data and code used for this inbox

Powered by JetHome