Re: [PATCH 2/3] dt-bindings: usb: Introduce samsung,snps-dwc3

[Krzysztof Kozlowski <krzk@kernel.org>]

On 07/09/2026 08:04, Selvarasu Ganesan wrote:
> 
> On 9/5/2026 12:52 PM, Krzysztof Kozlowski wrote:
>> On 03/09/2026 09:12, Selvarasu Ganesan wrote:
>>> The Samsung Exynos8855 USB glue is not separate from the Synopsys DWC3
>>> core, using a flattened model where the DWC3 controller is directly
>>> addressable rather than nested as a child node of a glue layer.
>>>
>>> Describe the Exynos USB block as a single node, referencing the split
>>> out Synopsys DWC3 core properties via snps,dwc3-common.yaml. The new
>>> binding follows the same approach as qcom,snps-dwc3.
>>>
>>> A generic fallback compatible "samsung,snps-dwc3" is introduced to
>>> describe this binding, selected by the validator based on the presence
>>> of the fallback string in the compatible list. Future Exynos SoCs
>> This is AI slop text. Over longish useless sentence describing diff
>> without actual information WHY.
>>
>> Don't send AI generated slop messages.
> 
> Sorry for the misleading info on this commit message. We were trying to 
> explain why a separate flattened representation is being introduced with 
> using generic fallback string, and follow the style of some other DWC3 
> flattened refactors (like the Qualcomm : 
> https://lore.kernel.org/all/20250414-dwc3-refactor-v7-2-f015b358722d@oss.qualcomm.com) 
> to justify the separate binding, but it became too long. We'll simplify 
> it and keep only the technical reasoning.

Flattened node is the right approach, so just say this is the first
Samsung Exynos binding using flattened node.


Best regards,
Krzysztof