Re: [PATCH v3] usb: dwc3: qcom: Remove extcon functionality from glue

[Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>]

On 7/14/25 6:47 AM, Krishna Kurapati wrote:
> Deprecate usage of extcon functionality from the glue driver. Now
> that the glue driver is a flattened implementation, all existing
> DTs would eventually move to new bindings. While doing so let them
> make use of role-switch/ typec frameworks to provide role data
> rather than using extcon.
> 
> On upstream, summary of targets/platforms using extcon is as follows:
> 
> 1. MSM8916 and MSM8939 use Chipidea controller, hence the changes have no
> effect on them.
> 
> 2. Of the other extcon users, most of them use "linux,extcon-usb-gpio"
> driver which relies on id/vbus gpios to inform role changes. This can be
> transitioned to role switch based driver (usb-conn-gpio) while flattening
> those platforms to move away from extcon and rely on role
> switching.
> 
> 3. The one target that uses dwc3 controller and extcon and is not based
> on reading gpios is "arch/arm64/boot/dts/qcom/msm8996-xiaomi-common.dtsi".
> This platform uses TI chip to provide extcon. If usb on this platform is
> being flattneed, then effort should be put in to define a usb-c-connector
> device in DT and make use of role switch functionality in TUSB320L driver.
> 
> Signed-off-by: Krishna Kurapati <krishna.kurapati@oss.qualcomm.com>
> ---

Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>

Konrad