Re: [PATCH 3/3] thermal/drivers/cpuidle_cooling: Use device name instead of auto-numbering

[Lukasz Luba <lukasz.luba@arm.com>]

On 3/10/21 11:46 AM, Daniel Lezcano wrote:
> Currently the naming of a cooling device is just a cooling technique
> followed by a number. When there are multiple cooling devices using
> the same technique, it is impossible to clearly identify the related
> device as this one is just a number.
> 
> For instance:
> 
>   thermal-idle-0
>   thermal-idle-1
>   thermal-idle-2
>   thermal-idle-3
>   etc ...
> 
> The 'thermal' prefix is redundant with the subsystem namespace. This
> patch removes the 'thermal prefix and changes the number by the device

missing ' after 'thermal

> name. So the naming above becomes:
> 
>   idle-cpu0
>   idle-cpu1
>   idle-cpu2
>   idle-cpu3
>   etc ...
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
>   drivers/thermal/cpuidle_cooling.c | 26 ++++++++++----------------
>   1 file changed, 10 insertions(+), 16 deletions(-)
> 
> diff --git a/drivers/thermal/cpuidle_cooling.c b/drivers/thermal/cpuidle_cooling.c
> index 7ecab4b16b29..8bc0a9b46358 100644
> --- a/drivers/thermal/cpuidle_cooling.c
> +++ b/drivers/thermal/cpuidle_cooling.c
> @@ -9,6 +9,7 @@
>   
>   #include <linux/cpu_cooling.h>
>   #include <linux/cpuidle.h>
> +#include <linux/device.h>
>   #include <linux/err.h>
>   #include <linux/idle_inject.h>
>   #include <linux/idr.h>

idr.h not needed any more


other than that LGTM

Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>