From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: Hemanth Selam <hemanth.selam@gmail.com>,
"Rafael J . Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>,
Lukasz Luba <lukasz.luba@arm.com>,
Randy Dunlap <rdunlap@infradead.org>,
linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org
Subject: Re: [PATCH v2] tools/thermal: fix typo "binded" in comments
Date: Fri, 18 Sep 2026 11:06:49 +0200 [thread overview]
Message-ID: <7f2ab477-15c1-4ff6-a249-71ce07a2afe0@oss.qualcomm.com> (raw)
In-Reply-To: <20260917080002.23952-1-hemanth.selam@gmail.com>
On 9/17/26 10:00, Hemanth Selam wrote:
> "binded" is not a word; the past participle of "bind" is "bound".
>
> The tmon.h comment counts cooling devices, so the noun is plural there,
> matching the wording already used for MAX_NR_CDEV_TRIP. The tui.c clause
> needs "is" to read as a sentence.
>
> Only touches comments, no code changes.
>
> Reviewed-by: Randy Dunlap <rdunlap@infradead.org>
> Signed-off-by: Hemanth Selam <hemanth.selam@gmail.com>
> ---
Applied, thanks
prev parent reply other threads:[~2026-09-18 9:06 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-09-17 8:00 Hemanth Selam
2026-09-18 9:06 ` Daniel Lezcano [this message]
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