From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: Florian Fainelli <florian.fainelli@broadcom.com>,
linux-kernel@vger.kernel.org
Cc: Markus Mayer <mmayer@broadcom.com>,
Broadcom internal kernel review list
<bcm-kernel-feedback-list@broadcom.com>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Zhang Rui <rui.zhang@intel.com>,
Lukasz Luba <lukasz.luba@arm.com>, Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>,
"open list:BROADCOM STB AVS TMON DRIVER"
<linux-pm@vger.kernel.org>,
"open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS"
<devicetree@vger.kernel.org>,
"moderated list:BROADCOM BCM7XXX ARM ARCHITECTURE"
<linux-arm-kernel@lists.infradead.org>
Subject: Re: [PATCH 0/2] Thermal support for BCM74110
Date: Tue, 11 Feb 2025 09:53:52 +0100 [thread overview]
Message-ID: <843953fe-4c81-4176-845b-0ce9ecb0f84e@linaro.org> (raw)
In-Reply-To: <20250116193842.758788-1-florian.fainelli@broadcom.com>
On 16/01/2025 20:38, Florian Fainelli wrote:
> This small patch series updates the existing brcmstb_thermal driver to
> support the BCM74110 chip which uses a different process node requiring
> an update to the thermal equation.
>
> Florian Fainelli (2):
> dt-bindings: thermal: Update for BCM74110
> thermal: brcmstb_thermal: Add support for BCM74110
>
> .../devicetree/bindings/thermal/brcm,avs-tmon.yaml | 1 +
> drivers/thermal/broadcom/brcmstb_thermal.c | 11 +++++++++--
> 2 files changed, 10 insertions(+), 2 deletions(-)
>
Applied, thanks
-- D.
--
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prev parent reply other threads:[~2025-02-11 8:53 UTC|newest]
Thread overview: 5+ messages / expand[flat|nested] mbox.gz Atom feed top
2025-01-16 19:38 Florian Fainelli
2025-01-16 19:38 ` [PATCH 1/2] dt-bindings: thermal: Update " Florian Fainelli
2025-01-18 16:12 ` Krzysztof Kozlowski
2025-01-16 19:38 ` [PATCH 2/2] thermal: brcmstb_thermal: Add support " Florian Fainelli
2025-02-11 8:53 ` Daniel Lezcano [this message]
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