Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
> Hi Daniel,
> 
> On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
> <daniel.lezcano@oss.qualcomm.com> wrote:
>>
>>
>> Hi Rafael,
>>
>> please ignore this PR because there is a missing SoB.
>>
>> I'll fix it and meanwhile update the linux-next branch so it will fix
>> the build issue.
> 
> Well, the build issue is still there in my thermal branch though.
> 
> I've now remerged my linux-next branch to avoid exposing the thermal
> drivers merge I did previously and I'll wait for another PR from you.
> Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
> thermal PR.
There are 3 fixes on top of the PR.

One is obviously to be folded with the existing series as it is my fault 
I forgot to add the file after fixing a conflict [1] which led to the 
linux-next build failure.

But two were reported by lkp [2][3]. May I take the opportunity to fold 
them with the patches they fix and shall I keep them as is ?

[1] 
https://lore.kernel.org/all/20260811145427.3089426-1-daniel.lezcano@kernel.org/

[2] 
https://lore.kernel.org/all/20260811094935.2941313-1-daniel.lezcano@kernel.org/

[3] 
https://lore.kernel.org/all/20260811094747.2940616-1-daniel.lezcano@kernel.org/