From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: X-Spam-Checker-Version: SpamAssassin 3.4.0 (2014-02-07) on aws-us-west-2-korg-lkml-1.web.codeaurora.org Received: from vger.kernel.org (vger.kernel.org [23.128.96.18]) by smtp.lore.kernel.org (Postfix) with ESMTP id AACF0C61D9D for ; Wed, 22 Nov 2023 12:25:35 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1344052AbjKVMZh (ORCPT ); Wed, 22 Nov 2023 07:25:37 -0500 Received: from lindbergh.monkeyblade.net ([23.128.96.19]:50584 "EHLO lindbergh.monkeyblade.net" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1344032AbjKVMZf (ORCPT ); Wed, 22 Nov 2023 07:25:35 -0500 Received: from smtp.kernel.org (relay.kernel.org [52.25.139.140]) by lindbergh.monkeyblade.net (Postfix) with ESMTPS id E8E8510F2 for ; Wed, 22 Nov 2023 04:25:27 -0800 (PST) Received: by smtp.kernel.org (Postfix) with ESMTPSA id 59990C43142; Wed, 22 Nov 2023 12:25:27 +0000 (UTC) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/simple; d=kernel.org; s=k20201202; t=1700655927; bh=oqJMUoWJEhPsBbu0gDpzxXA6F0uFWKXoqQOh+lSyF7k=; h=Date:From:To:Cc:Subject:References:In-Reply-To:From; b=l0oXtWwQNk8JD/VG0PZ0PYNh8N9rB9rW5vX7MchrKQMxU8DtlWNmmOVFGivQ2cmnH w9Syh1QLRSPtZe9ZXT31po9IuEsHHyUkMjp+lU/7QIwVFfMrl492faNk4Gdl9edWbj yVZtrahi59PwxeQjLB5u2yZTaiRxP5/5d021OmnlW1vWJAO2UdZJmkrHjDImeRNd6b HgcN65AwvzDhQI3zfZHfO9FFBpoM8tPLUOPuWGyRjQKDC5ggitn9qHN2wff5vB1hPX iL2J7YinckVEwBVTgvBGSP79/yL2E55vYbQYvN73x5zcpbskEinI7yTumfLuObY1v2 Z82tmE9TgGvaQ== Received: from johan by xi.lan with local (Exim 4.96.2) (envelope-from ) id 1r5mIY-0000CO-0V; Wed, 22 Nov 2023 13:25:42 +0100 Date: Wed, 22 Nov 2023 13:25:42 +0100 From: Johan Hovold To: Bjorn Andersson Cc: Bjorn Andersson , Konrad Dybcio , Greg Kroah-Hartman , Rob Herring , Krzysztof Kozlowski , Conor Dooley , Wesley Cheng , Thinh Nguyen , Felipe Balbi , Philipp Zabel , linux-arm-msm@vger.kernel.org, linux-usb@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, Krishna Kurapati PSSNV Subject: Re: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue" Message-ID: References: <20231016-dwc3-refactor-v1-0-ab4a84165470@quicinc.com> <20231016-dwc3-refactor-v1-9-ab4a84165470@quicinc.com> MIME-Version: 1.0 Content-Type: text/plain; charset=us-ascii Content-Disposition: inline In-Reply-To: <20231016-dwc3-refactor-v1-9-ab4a84165470@quicinc.com> Precedence: bulk List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Mon, Oct 16, 2023 at 08:11:17PM -0700, Bjorn Andersson wrote: > The Qualcomm USB block consists of three intertwined parts, the XHCI, > the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents > the Qualcomm glue part, with the other two represented as in a child > node. > > Rename the qcom,dwc3 binding, to represent that this is indeed only the > glue part, to make room for a combined binding. > > The large "select" is included to avoid the schema to be selected for > validation with the upcoming flattened binding - which includes > snps,dwc3 in the compatible. > > Signed-off-by: Bjorn Andersson > --- > -title: Qualcomm SuperSpeed DWC3 USB SoC controller > +title: Qualcomm SuperSpeed DWC3 USB SoC controller glue > + > +description: > + This describes the Qualcomm glue-section of the SuperSpeed DWC3 USB > + controller found in many Qualcomm platforms, with the XHCI and DWC3 core This should be "xHCI" throughout the series. > + portions described as a separate child device. > + The combined representation, defined by qcom,dwc3.yaml is preferred. Johan