Re: [PATCH linux-next] thermal/drivers/qcom-spmi-mbg-tm: Add module namespace import for IIO_CONSUMER

["Uwe Kleine-König" <u.kleine-koenig@baylibre.com>]

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Hello,

On Thu, Aug 13, 2026 at 05:05:05PM -0700, Nathan Chancellor wrote:
> On Thu, Aug 13, 2026 at 02:35:43AM +0100, Jonathan Cameron wrote:
> > I did plan for this being a possible issue:
> > 
> > Ideal is merge 
> > https://git.kernel.org/pub/scm/linux/kernel/git/jic23/iio.git #iio-inkern-namespace-ib
> > to the thermal tree.  If I'd called that out originally (or a thermal
> > rebase is a possibility) it would be cleaner to do this before the
> > qcom patch adds another user then squash what you have here in the appropriate
> > patch.  Alternative is do it as a merge conflict resolution whilst merging
> > in that tree.  If the second, I'd also mention that in the thermal pull request to
> > Linus given it's a little unusual.
> 
> Ah, I did not realize that you had a stable branch with the module
> namespace patch. Merging that in then applying this to the thermal tree
> seems like the best course of action. If rebasing is possible, I do not
> mind this patch being squashed into the original.

FTR, this issue is still present as of next-20260820. Assuming that
c3dce117333c ("thermal/drivers/qcom: Add support for Qualcomm MBG
thermal monitoring") is supposed to go into v7.3-rc1, it would be
awesome to address this before the commit hits Linus' tree.

Best regards
Uwe

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