From: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
To: Sachin Gupta <sachin.gupta@oss.qualcomm.com>,
Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konradybcio@kernel.org>,
Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>
Cc: Ajit Pandey <ajit.pandey@oss.qualcomm.com>,
Imran Shaik <imran.shaik@oss.qualcomm.com>,
Taniya Das <taniya.das@oss.qualcomm.com>,
Jagadeesh Kona <jagadeesh.kona@oss.qualcomm.com>,
Jishnu Prakash <jishnu.prakash@oss.qualcomm.com>,
Kamal Wadhwa <kamal.wadhwa@oss.qualcomm.com>,
linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org,
linux-kernel@vger.kernel.org
Subject: Re: [PATCH 1/2] arm64: dts: qcom: lemans-pmics: Enable PMIC MBG thermal monitor
Date: Mon, 24 Aug 2026 11:45:27 +0200 [thread overview]
Message-ID: <b68a12fb-e39b-43a9-91ef-f45db6d391cc@oss.qualcomm.com> (raw)
In-Reply-To: <6a7ee538.797536ea.65c65.28c0@mx.google.com>
On 8/14/26 11:51 AM, Sachin Gupta wrote:
> Lemans boards use PM8654AU PMIC instances that expose MBG thermal monitor
> blocks handled by the existing qcom-spmi-mbg-tm driver.
>
> Add MBG temperature-sensor nodes for the PMIC instances and wire them into
> dedicated thermal zones with passive trips, so PMIC die temperature
> monitoring is available through the thermal framework.
>
> Signed-off-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
> ---
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Konrad
prev parent reply other threads:[~2026-08-24 9:45 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-08-14 9:51 Sachin Gupta
2026-08-24 9:45 ` Konrad Dybcio [this message]
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