Re: [PATCH V10 3/7] interconnect: qcom: Add multidev EPSS L3 support

[Georgi Djakov <djakov@kernel.org>]

On 24.03.25 20:31, Raviteja Laggyshetty wrote:
> EPSS on SA8775P has two instances, necessitating the creation of two
> device nodes with different compatibles due to the unique ICC node ID
> and name limitations in the interconnect framework. Add multidevice
> support for the OSM-L3 provider to dynamically obtain unique node IDs
> and register with the framework.
> EPSS topology includes a single master-slave pair within the same
> provider, the node linking logic is simplified by directly connecting
> the master node to the slave node.
> 
> Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
> ---
>   drivers/interconnect/qcom/osm-l3.c | 36 ++++++++++--------------------
>   1 file changed, 12 insertions(+), 24 deletions(-)
> 
> diff --git a/drivers/interconnect/qcom/osm-l3.c b/drivers/interconnect/qcom/osm-l3.c
> index 6a656ed44d49..43e67d2116b9 100644
> --- a/drivers/interconnect/qcom/osm-l3.c
> +++ b/drivers/interconnect/qcom/osm-l3.c
> @@ -1,6 +1,7 @@
>   // SPDX-License-Identifier: GPL-2.0
>   /*
>    * Copyright (c) 2020-2021, The Linux Foundation. All rights reserved.
> + * Copyright (c) 2025 Qualcomm Innovation Center, Inc. All rights reserved.
>    */
>   
>   #include <linux/args.h>
> @@ -48,16 +49,10 @@ struct qcom_osm_l3_icc_provider {
>   /**
>    * struct qcom_osm_l3_node - Qualcomm specific interconnect nodes
>    * @name: the node name used in debugfs
> - * @links: an array of nodes where we can go next while traversing
> - * @id: a unique node identifier
> - * @num_links: the total number of @links
>    * @buswidth: width of the interconnect between a node and the bus
>    */
>   struct qcom_osm_l3_node {
>   	const char *name;
> -	u16 links[OSM_L3_MAX_LINKS];

Please remove also the #define for OSM_L3_MAX_LINKS, as it's unused now.

> -	u16 id;
> -	u16 num_links;
>   	u16 buswidth;
>   };
>

BR,
Georgi