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[78.88.45.245]) by smtp.gmail.com with ESMTPSA id a640c23a62f3a-b8ddcf8aa7csm723665066b.9.2026.02.02.01.53.32 (version=TLS1_3 cipher=TLS_AES_128_GCM_SHA256 bits=128/128); Mon, 02 Feb 2026 01:53:34 -0800 (PST) Message-ID: Date: Mon, 2 Feb 2026 10:53:31 +0100 Precedence: bulk X-Mailing-List: linux-kernel@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 User-Agent: Mozilla Thunderbird Subject: Re: [PATCH v1 0/8] Add RemoteProc cooling support To: Trilok Soni , Gaurav Kohli , Casey Connolly , andersson@kernel.org, mathieu.poirier@linaro.org, robh@kernel.org, krzk+dt@kernel.org, conor+dt@kernel.org, rafael@kernel.org, daniel.lezcano@linaro.org, rui.zhang@intel.com, lukasz.luba@arm.com, konradybcio@kernel.org, amitk@kernel.org, mani@kernel.org Cc: linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org References: <20251223123227.1317244-1-gaurav.kohli@oss.qualcomm.com> <2a39719e-e73b-4558-95fa-d54f94c43220@linaro.org> <6ae95761-6428-4a01-8c60-54df5e54b71f@oss.qualcomm.com> Content-Language: en-US From: Konrad Dybcio In-Reply-To: Content-Type: text/plain; charset=UTF-8 Content-Transfer-Encoding: 8bit X-Proofpoint-Spam-Details-Enc: AW1haW4tMjYwMjAyMDA4NCBTYWx0ZWRfX7vV17peSQxZq zXonBnz7IPzXpJHCx2lTReOIEKJZu4+LaVPvrtlflZwL/PkJ5AYsV6XSUHR/JYtiyut3z/SfQPK AVzizvrGLZ77dzbLcUOREM8E7+7C8//CJ6faR8yfgD2SWKS0YO9svN3T+WvXzGXGqqdFrIhUFlp kYbeUuSKAiiPkRm6SH3VCx379CklEAvlaK6f8BdA4DVxtWGnEvicJs11WjjcFhupC6U2x2r1bPh LGYE30BhWLgrJdk7VP+6DvqeujYKEQWcgbWS6n+Vqjy0Rk6PbjCWoITGDgjDh+sAFFvbBnSoYFW WyXGPsl1QAnrsi/JvXhj4P0ghBznCB5F2DGuCDpqzFh8lkI4G5dPDadu5zx4/ksJZ8J+LgARKaa en634RGtPZQcuNznxcvnKQnLz+iLLGUxu3aE8Q1zUdoh24nfzJhQrrBzK/tI1AOadpojPQZHzHr WuF/av3mTCwy8pq0/Sg== X-Proofpoint-ORIG-GUID: _NfA7YhS5UQyRqsIsrmPW83mgvP4IWc7 X-Proofpoint-GUID: _NfA7YhS5UQyRqsIsrmPW83mgvP4IWc7 X-Authority-Analysis: v=2.4 cv=MYthep/f c=1 sm=1 tr=0 ts=69807420 cx=c_pps a=hnmNkyzTK/kJ09Xio7VxxA==:117 a=FpWmc02/iXfjRdCD7H54yg==:17 a=IkcTkHD0fZMA:10 a=HzLeVaNsDn8A:10 a=s4-Qcg_JpJYA:10 a=VkNPw1HP01LnGYTKEx00:22 a=VwQbUJbxAAAA:8 a=KKAkSRfTAAAA:8 a=COk6AnOGAAAA:8 a=8BWbUoxn-aILMCT19TQA:9 a=3ZKOabzyN94A:10 a=QEXdDO2ut3YA:10 a=PEH46H7Ffwr30OY-TuGO:22 a=cvBusfyB2V15izCimMoJ:22 a=TjNXssC_j7lpFel5tvFf:22 X-Proofpoint-Virus-Version: vendor=baseguard engine=ICAP:2.0.293,Aquarius:18.0.1121,Hydra:6.1.51,FMLib:17.12.100.49 definitions=2026-02-02_03,2026-01-30_04,2025-10-01_01 X-Proofpoint-Spam-Details: rule=outbound_notspam policy=outbound score=0 malwarescore=0 phishscore=0 adultscore=0 impostorscore=0 suspectscore=0 clxscore=1015 bulkscore=0 spamscore=0 priorityscore=1501 lowpriorityscore=0 classifier=typeunknown authscore=0 authtc= authcc= route=outbound adjust=0 reason=mlx scancount=1 engine=8.22.0-2601150000 definitions=main-2602020084 On 2/1/26 9:20 PM, Trilok Soni wrote: > On 1/13/2026 1:33 AM, Gaurav Kohli wrote: >> >> On 1/10/2026 9:43 PM, Casey Connolly wrote: >>> >>> >>> On 12/23/25 13:32, Gaurav Kohli wrote: >>>> This series introduces a generic remote proc cooling framework to control >>>> thermal sensors located on remote subsystem like modem, dsp etc. >>>> Communications with these subsystems occurs through various channels, for example, >>>> QMI interface for Qualcomm. >>>>   The Framework provides an abstraction layer between thermal subsytem and vendor >>>> specific remote subsystem. Vendor drivers are expected to implement callback >>>> and registration mechanisms with cooling framework to control cooling >>>> devices. >>>> >>>> This patchset also revives earlier discussions of QMI based TMD cooling >>>> devices discussion posted on below series by Casey: >>>> https://lore.kernel.org/linux-devicetree/20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org/ >>>> >>>> That series introduced Qualcomm QMI-based TMD cooling devices which used >>>> to mitigate thermal conditions across multiple remote subsystems. These >>>> devices operate based on junction temperature sensors (TSENS) associated >>>> with thermal zones for each subsystem and registering with remoteproc >>>> cooling framework for cooling registration. >>>> >>>> This patch series has a compilation/runtime dependency on another series [1]. >>>> >>>> [1] https://lore.kernel.org/linux-devicetree/20250822042316.1762153-1-quic_gkohli@quicinc.com/ >>>> >>>> Casey Connolly (2): >>>>    remoteproc: qcom: probe all child devices >>>>    thermal: qcom: add qmi-cooling driver >>> >>> I'm glad this series is getting revived. It would be good if you could explain what changes you made to my patches somewhere. >>> >>> I also remember one of my patches adding the DT parts for SDM845, would you be willing to pick that up for the next revision? I'd be happy to provide my Tested-by. >>> >>> Kind regards, >>> >> Hi Casey, >> >> With this remoeproc cooling abstraction layer, we have integrated your patches for subsystem cooling. As lot of comments came for qmi-cooling driver, so need to send v2 with cleanup. > > Gaurav - the question somewhere in the series was that why you had marked your patch series > to v1, when you had revived the original (v1?) series from Casey? Should we consider > current patch series as v2 then? I don't know if that comment was concluded. Because we have effectively 2 'v1's, there's already a certain mess, but the msgid is different between them so the tools won't be confused (i.e. just go with v2 for the next revision) The outstanding request is to include a high-level changelog of what is different as compared to the original series (as well as picking up the original 845 DT commit if still relevant) Konrad