* [PATCH 0/7] thermal: ti-soc-thermal: fixes and DRA752 support
@ 2013-05-29 15:07 Eduardo Valentin
0 siblings, 0 replies; 3+ messages in thread
From: Eduardo Valentin @ 2013-05-29 15:07 UTC (permalink / raw)
To: rui.zhang; +Cc: linux-pm, linux-kernel, Eduardo Valentin
Hello Rui,
Here is a patch set for your consideration on ti-soc-thermal driver.
This patch set is mix of:
(a) patches that were added to the staging tree post 3.10-rc1 but
were not included after the move from staging to thermal. This is
because your thermal tree is based of 3.10-rc1 and not staging/next
or linux-next/master. Thus the first two patches make sure the driver
under drivers/thermal/ti-soc-thermal has also the needed fixes.
(b) patches containing fixes found during the addition of DRA752
chip support.
(c) patches adding the support to DRA752 chips.
Please consider these too for 3.11.
For those people interested in testing this patch set, it is based
on thermal/next and can also be found here:
https://git.gitorious.org/thermal-framework/thermal-framework.git thermal_work/ti-soc-thermal/fixes+dra752
All best,
Eduardo Valentin (7):
thermal: ti-soc-thermal: update DT reference for OMAP5430
thermal: ti-soc-thermal: remove external heat while extrapolating
hotspot
thermal: ti-soc-thermal: freeze FSM while computing trend
thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
thermal: ti-soc-thermal: add thermal data for DRA752 chips
thermal: ti-soc-thermal: add dra752 chip to device table
thermal: ti-soc-thermal: add DT example for DRA752 chip
.../devicetree/bindings/thermal/ti_soc_thermal.txt | 13 +
drivers/staging/ti-soc-thermal/dra752-bandgap.h | 280 ++++++++++++
.../staging/ti-soc-thermal/dra752-thermal-data.c | 476 +++++++++++++++++++++
drivers/thermal/ti-soc-thermal/Kconfig | 12 +
drivers/thermal/ti-soc-thermal/Makefile | 1 +
drivers/thermal/ti-soc-thermal/ti-bandgap.c | 29 +-
drivers/thermal/ti-soc-thermal/ti-bandgap.h | 5 +
drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 43 +-
drivers/thermal/ti-soc-thermal/ti-thermal.h | 6 +
9 files changed, 842 insertions(+), 23 deletions(-)
create mode 100644 drivers/staging/ti-soc-thermal/dra752-bandgap.h
create mode 100644 drivers/staging/ti-soc-thermal/dra752-thermal-data.c
--
1.8.2.1.342.gfa7285d
^ permalink raw reply [flat|nested] 3+ messages in thread* [PATCH 0/7] thermal: ti-soc-thermal: fixes and DRA752 support
@ 2013-05-29 15:07 Eduardo Valentin
2013-06-13 2:20 ` Zhang Rui
0 siblings, 1 reply; 3+ messages in thread
From: Eduardo Valentin @ 2013-05-29 15:07 UTC (permalink / raw)
To: rui.zhang; +Cc: linux-pm, linux-kernel, Eduardo Valentin
Hello Rui,
Here is a patch set for your consideration on ti-soc-thermal driver.
This patch set is mix of:
(a) patches that were added to the staging tree post 3.10-rc1 but
were not included after the move from staging to thermal. This is
because your thermal tree is based of 3.10-rc1 and not staging/next
or linux-next/master. Thus the first two patches make sure the driver
under drivers/thermal/ti-soc-thermal has also the needed fixes.
(b) patches containing fixes found during the addition of DRA752
chip support.
(c) patches adding the support to DRA752 chips.
Please consider these too for 3.11.
For those people interested in testing this patch set, it is based
on thermal/next and can also be found here:
https://git.gitorious.org/thermal-framework/thermal-framework.git thermal_work/ti-soc-thermal/fixes+dra752
All best,
Eduardo Valentin (7):
thermal: ti-soc-thermal: update DT reference for OMAP5430
thermal: ti-soc-thermal: remove external heat while extrapolating
hotspot
thermal: ti-soc-thermal: freeze FSM while computing trend
thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
thermal: ti-soc-thermal: add thermal data for DRA752 chips
thermal: ti-soc-thermal: add dra752 chip to device table
thermal: ti-soc-thermal: add DT example for DRA752 chip
.../devicetree/bindings/thermal/ti_soc_thermal.txt | 13 +
drivers/staging/ti-soc-thermal/dra752-bandgap.h | 280 ++++++++++++
.../staging/ti-soc-thermal/dra752-thermal-data.c | 476 +++++++++++++++++++++
drivers/thermal/ti-soc-thermal/Kconfig | 12 +
drivers/thermal/ti-soc-thermal/Makefile | 1 +
drivers/thermal/ti-soc-thermal/ti-bandgap.c | 29 +-
drivers/thermal/ti-soc-thermal/ti-bandgap.h | 5 +
drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 43 +-
drivers/thermal/ti-soc-thermal/ti-thermal.h | 6 +
9 files changed, 842 insertions(+), 23 deletions(-)
create mode 100644 drivers/staging/ti-soc-thermal/dra752-bandgap.h
create mode 100644 drivers/staging/ti-soc-thermal/dra752-thermal-data.c
--
1.8.2.1.342.gfa7285d
^ permalink raw reply [flat|nested] 3+ messages in thread* Re: [PATCH 0/7] thermal: ti-soc-thermal: fixes and DRA752 support
2013-05-29 15:07 Eduardo Valentin
@ 2013-06-13 2:20 ` Zhang Rui
0 siblings, 0 replies; 3+ messages in thread
From: Zhang Rui @ 2013-06-13 2:20 UTC (permalink / raw)
To: Eduardo Valentin; +Cc: linux-pm, linux-kernel
On Wed, 2013-05-29 at 11:07 -0400, Eduardo Valentin wrote:
> Hello Rui,
>
> Here is a patch set for your consideration on ti-soc-thermal driver.
>
the whole patch set has been applied.
thanks,
rui
> This patch set is mix of:
>
> (a) patches that were added to the staging tree post 3.10-rc1 but
> were not included after the move from staging to thermal. This is
> because your thermal tree is based of 3.10-rc1 and not staging/next
> or linux-next/master. Thus the first two patches make sure the driver
> under drivers/thermal/ti-soc-thermal has also the needed fixes.
>
> (b) patches containing fixes found during the addition of DRA752
> chip support.
>
> (c) patches adding the support to DRA752 chips.
>
> Please consider these too for 3.11.
>
> For those people interested in testing this patch set, it is based
> on thermal/next and can also be found here:
> https://git.gitorious.org/thermal-framework/thermal-framework.git thermal_work/ti-soc-thermal/fixes+dra752
>
> All best,
>
> Eduardo Valentin (7):
> thermal: ti-soc-thermal: update DT reference for OMAP5430
> thermal: ti-soc-thermal: remove external heat while extrapolating
> hotspot
> thermal: ti-soc-thermal: freeze FSM while computing trend
> thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
> thermal: ti-soc-thermal: add thermal data for DRA752 chips
> thermal: ti-soc-thermal: add dra752 chip to device table
> thermal: ti-soc-thermal: add DT example for DRA752 chip
>
> .../devicetree/bindings/thermal/ti_soc_thermal.txt | 13 +
> drivers/staging/ti-soc-thermal/dra752-bandgap.h | 280 ++++++++++++
> .../staging/ti-soc-thermal/dra752-thermal-data.c | 476 +++++++++++++++++++++
> drivers/thermal/ti-soc-thermal/Kconfig | 12 +
> drivers/thermal/ti-soc-thermal/Makefile | 1 +
> drivers/thermal/ti-soc-thermal/ti-bandgap.c | 29 +-
> drivers/thermal/ti-soc-thermal/ti-bandgap.h | 5 +
> drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 43 +-
> drivers/thermal/ti-soc-thermal/ti-thermal.h | 6 +
> 9 files changed, 842 insertions(+), 23 deletions(-)
> create mode 100644 drivers/staging/ti-soc-thermal/dra752-bandgap.h
> create mode 100644 drivers/staging/ti-soc-thermal/dra752-thermal-data.c
>
^ permalink raw reply [flat|nested] 3+ messages in thread
end of thread, other threads:[~2013-06-13 2:21 UTC | newest]
Thread overview: 3+ messages (download: mbox.gz / follow: Atom feed)
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2013-05-29 15:07 [PATCH 0/7] thermal: ti-soc-thermal: fixes and DRA752 support Eduardo Valentin
2013-05-29 15:07 Eduardo Valentin
2013-06-13 2:20 ` Zhang Rui
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