[PATCH 0/2] Add QMI TMD based cooling support for the Shikra CDSP and Modem

[PATCH 0/2] Add QMI TMD based cooling support for the Shikra CDSP and Modem

[Dipa Ramesh Mantre]

This series introduces Qualcomm Messaging Interface based Thermal
Mitigation Device (QMI TMD) support to control thermal mitigation
on remote subsystems such as the Modem and CDSP for Shikra.

Depends-on: https://lore.kernel.org/all/20260809-b4-qmi-tmd-v8-0-b15d47adc379@oss.qualcomm.com/

Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
---
Dipa Ramesh Mantre (2):
      remoteproc: qcom_q6v5_pas: Add QMI TMD cooling support for Shikra
      arm64: dts: qcom: shikra: Enable CDSP & Modem cooling

 arch/arm64/boot/dts/qcom/shikra.dtsi | 71 ++++++++++++++++++++++++++++++++++--
 drivers/remoteproc/qcom_q6v5_pas.c   |  6 +++
 2 files changed, 74 insertions(+), 3 deletions(-)
---
base-commit: 944a035ecca915ae947905dcfb03f2b9dc6d032c
change-id: 20260908-shikra_qmi_tmd-b1328cb84eaa

Best regards,
-- 
Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>

[PATCH 1/2] remoteproc: qcom_q6v5_pas: Add QMI TMD cooling support for Shikra

[Dipa Ramesh Mantre]

Add QMI TMD instance IDs and cooling device name arrays for CDSP
and MPSS subsystems on Shikra to enable thermal mitigation support.

Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
---
 drivers/remoteproc/qcom_q6v5_pas.c | 6 ++++++
 1 file changed, 6 insertions(+)

diff --git a/drivers/remoteproc/qcom_q6v5_pas.c b/drivers/remoteproc/qcom_q6v5_pas.c
index a005546c265d..3daaed6ca596 100644
--- a/drivers/remoteproc/qcom_q6v5_pas.c
+++ b/drivers/remoteproc/qcom_q6v5_pas.c
@@ -1660,6 +1660,9 @@ static const struct qcom_pas_data shikra_cdsp_resource = {
 	.sysmon_name = "cdsp",
 	.ssctl_id = 0x17,
 	.smem_host_id = 5,
+	.tmd_instance_id = 0x43,
+	.tmd_name = cdsp_tmd_name,
+	.num_tmd = ARRAY_SIZE(cdsp_tmd_name),
 };
 
 static const struct qcom_pas_data shikra_lpaicp_resource = {
@@ -1688,6 +1691,9 @@ static const struct qcom_pas_data shikra_mpss_resource = {
 	.ssr_name = "mpss",
 	.sysmon_name = "modem",
 	.ssctl_id = 0x12,
+	.tmd_instance_id = 0x0,
+	.tmd_name = modem_tmd_name,
+	.num_tmd = ARRAY_SIZE(modem_tmd_name),
 };
 
 static const struct qcom_pas_data sm8650_cdsp_resource = {

-- 
2.34.1

[PATCH 2/2] arm64: dts: qcom: shikra: Enable CDSP & Modem cooling

[Dipa Ramesh Mantre]

Unlike the CPU, the CDSP/Modem does not throttle its speed automatically
when it reaches high temperatures in shikra.

Set up CDSP/Modem cooling by throttling the CDSP and modem when they
reach 115°C using the QMI TMD cooling device framework.

Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
---
 arch/arm64/boot/dts/qcom/shikra.dtsi | 71 ++++++++++++++++++++++++++++++++++--
 1 file changed, 68 insertions(+), 3 deletions(-)

diff --git a/arch/arm64/boot/dts/qcom/shikra.dtsi b/arch/arm64/boot/dts/qcom/shikra.dtsi
index c1f06f692f66..55bac1b57cba 100644
--- a/arch/arm64/boot/dts/qcom/shikra.dtsi
+++ b/arch/arm64/boot/dts/qcom/shikra.dtsi
@@ -10,6 +10,7 @@
 #include <dt-bindings/interconnect/qcom,icc.h>
 #include <dt-bindings/interconnect/qcom,osm-l3.h>
 #include <dt-bindings/dma/qcom-gpi.h>
+#include <dt-bindings/thermal/qcom,pas.h>
 #include <dt-bindings/interconnect/qcom,rpm-icc.h>
 #include <dt-bindings/interconnect/qcom,shikra.h>
 #include <dt-bindings/interrupt-controller/arm-gic.h>
@@ -2007,6 +2008,8 @@ remoteproc_mpss: remoteproc@6080000 {
 			qcom,smem-states = <&modem_smp2p_out 0>;
 			qcom,smem-state-names = "stop";
 
+			#cooling-cells = <3>;
+
 			status = "disabled";
 
 			glink-edge {
@@ -2047,6 +2050,8 @@ remoteproc_cdsp: remoteproc@b300000 {
 			qcom,smem-states = <&cdsp_smp2p_out 0>;
 			qcom,smem-state-names = "stop";
 
+			#cooling-cells = <3>;
+
 			status = "disabled";
 
 			glink-edge {
@@ -3868,6 +3873,8 @@ map0 {
 		};
 
 		nsp-thermal {
+			polling-delay-passive = <200>;
+
 			thermal-sensors = <&tsens0 7>;
 
 			trips {
@@ -3877,15 +3884,31 @@ trip-point0 {
 					type = "hot";
 				};
 
-				nsp-critical {
+				nsp_alert1: nsp-alert1 {
 					temperature = <115000>;
+					hysteresis = <5000>;
+					type = "passive";
+				};
+
+				nsp-critical {
+					temperature = <118000>;
 					hysteresis = <0>;
 					type = "critical";
 				};
 			};
+
+			cooling-maps {
+				map0 {
+					trip = <&nsp_alert1>;
+					cooling-device = <&remoteproc_cdsp QCOM_TMD_CDSP_SW
+							 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+				};
+			};
 		};
 
 		mdmss0-thermal {
+			polling-delay-passive = <200>;
+
 			thermal-sensors = <&tsens0 8>;
 
 			trips {
@@ -3895,15 +3918,37 @@ trip-point0 {
 					type = "hot";
 				};
 
-				mdmss0-critical {
+				mdmss0_alert1: mdmss0-alert1 {
 					temperature = <115000>;
+					hysteresis = <5000>;
+					type = "passive";
+				};
+
+				mdmss0-critical {
+					temperature = <118000>;
 					hysteresis = <0>;
 					type = "critical";
 				};
 			};
+
+			cooling-maps {
+				map0 {
+					trip = <&mdmss0_alert1>;
+					cooling-device = <&remoteproc_mpss QCOM_TMD_PA
+							 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+				};
+
+				map1 {
+					trip = <&mdmss0_alert1>;
+					cooling-device = <&remoteproc_mpss QCOM_TMD_MODEM
+							 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+				};
+			};
 		};
 
 		mdmss1-thermal {
+			polling-delay-passive = <200>;
+
 			thermal-sensors = <&tsens0 9>;
 
 			trips {
@@ -3913,12 +3958,32 @@ trip-point0 {
 					type = "hot";
 				};
 
-				mdmss1-critical {
+				mdmss1_alert1: mdmss1-alert1 {
 					temperature = <115000>;
+					hysteresis = <5000>;
+					type = "passive";
+				};
+
+				mdmss1-critical {
+					temperature = <118000>;
 					hysteresis = <0>;
 					type = "critical";
 				};
 			};
+
+			cooling-maps {
+				map0 {
+					trip = <&mdmss1_alert1>;
+					cooling-device = <&remoteproc_mpss QCOM_TMD_PA
+							 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+				};
+
+				map1 {
+					trip = <&mdmss1_alert1>;
+					cooling-device = <&remoteproc_mpss QCOM_TMD_MODEM
+							 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+				};
+			};
 		};
 
 		camera-thermal {

-- 
2.34.1

Re: [PATCH 1/2] remoteproc: qcom_q6v5_pas: Add QMI TMD cooling support for Shikra

[Gaurav Kohli]

On 9/11/2026 10:33 AM, Dipa Ramesh Mantre wrote:
> Add QMI TMD instance IDs and cooling device name arrays for CDSP
> and MPSS subsystems on Shikra to enable thermal mitigation support.
> 
> Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
> ---
>   drivers/remoteproc/qcom_q6v5_pas.c | 6 ++++++
>   1 file changed, 6 insertions(+)
> 
> diff --git a/drivers/remoteproc/qcom_q6v5_pas.c b/drivers/remoteproc/qcom_q6v5_pas.c
> index a005546c265d..3daaed6ca596 100644
> --- a/drivers/remoteproc/qcom_q6v5_pas.c
> +++ b/drivers/remoteproc/qcom_q6v5_pas.c
> @@ -1660,6 +1660,9 @@ static const struct qcom_pas_data shikra_cdsp_resource = {
>   	.sysmon_name = "cdsp",
>   	.ssctl_id = 0x17,
>   	.smem_host_id = 5,
> +	.tmd_instance_id = 0x43,
> +	.tmd_name = cdsp_tmd_name,
> +	.num_tmd = ARRAY_SIZE(cdsp_tmd_name),
>   };
> 

Reviewed-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>

thanks
Gaurav

Re: [PATCH 2/2] arm64: dts: qcom: shikra: Enable CDSP & Modem cooling

[Konrad Dybcio]

On 9/11/26 7:03 AM, Dipa Ramesh Mantre wrote:
> Unlike the CPU, the CDSP/Modem does not throttle its speed automatically
> when it reaches high temperatures in shikra.
> 
> Set up CDSP/Modem cooling by throttling the CDSP and modem when they
> reach 115°C using the QMI TMD cooling device framework.
> 
> Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
> ---

[...]

> -				nsp-critical {
> +				nsp_alert1: nsp-alert1 {
>  					temperature = <115000>;
> +					hysteresis = <5000>;
> +					type = "passive";
> +				};

No "hot" points? And no throttling at all until 115?

> +
> +				nsp-critical {
> +					temperature = <118000>;
>  					hysteresis = <0>;
>  					type = "critical";
>  				};
>  			};
> +
> +			cooling-maps {
> +				map0 {
> +					trip = <&nsp_alert1>;
> +					cooling-device = <&remoteproc_cdsp QCOM_TMD_CDSP_SW
> +							 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;

Please align the arguments so that we have:

<&foo bar
 FOO BAR>

instead of

<&foo bar
FOO BAR>


Konrad