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From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com>,
	Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Cc: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>,
	Bjorn Andersson <andersson@kernel.org>,
	Mathieu Poirier <mathieu.poirier@linaro.org>,
	Rob Herring <robh@kernel.org>,
	Krzysztof Kozlowski <krzk+dt@kernel.org>,
	Conor Dooley <conor+dt@kernel.org>,
	Amit Kucheria <amit.kucheria@oss.qualcomm.com>,
	Manivannan Sadhasivam <mani@kernel.org>,
	Konrad Dybcio <konradybcio@kernel.org>,
	Kees Cook <kees@kernel.org>,
	"Gustavo A. R. Silva" <gustavoars@kernel.org>,
	cros-qcom-dts-watchers@chromium.org,
	linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
	devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
	linux-pm@vger.kernel.org, linux-hardening@vger.kernel.org,
	Manaf Meethalavalappu Pallikunhi
	<manaf.pallikunhi@oss.qualcomm.com>
Subject: Re: [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants
Date: Thu, 9 Jul 2026 09:42:04 +0200	[thread overview]
Message-ID: <54250163-678f-41e7-97d0-6596123367f1@oss.qualcomm.com> (raw)
In-Reply-To: <tq3g6lpb2go4nen3ferx7kzs5g6sshc45ayfyvhjmc3rv3jv7p@fhixqlwbtooa>



Le 09/07/2026 à 09:37, Dmitry Baryshkov a écrit :
> On Thu, Jul 09, 2026 at 10:54:26AM +0530, Gaurav Kohli wrote:
>>
>>
>> On 7/8/2026 7:55 PM, Dmitry Baryshkov wrote:
>>> On Tue, Jul 07, 2026 at 03:55:13PM +0530, Gaurav Kohli wrote:
>>>>
>>>>
>>>> On 7/7/2026 1:04 AM, Dmitry Baryshkov wrote:
>>>>> On Mon, Jul 06, 2026 at 08:11:35PM +0200, Daniel Lezcano wrote:
>>>>>> On 7/6/26 19:47, Dmitry Baryshkov wrote:
>>>>>>> On Mon, Jul 06, 2026 at 07:03:18PM +0200, Daniel Lezcano wrote:
>>>>>>>> On 7/3/26 17:42, Dmitry Baryshkov wrote:
>>>>>>>>> On Fri, Jul 03, 2026 at 07:43:39PM +0530, Gaurav Kohli wrote:
>>>>>>>>>>
>>>>>>>>>>
>>>>>>>>>> On 7/3/2026 1:23 PM, Konrad Dybcio wrote:
>>>>>>>>>>> On 7/3/26 7:03 AM, Gaurav Kohli wrote:
>>>>>>>>>>>> Add Device Tree binding constants for Qualcomm Thermal Mitigation
>>>>>>>>>>>> Device (TMD) types used by remoteproc-backed thermal cooling devices.
>>>>>>>>>>>>
>>>>>>>>>>>> Qualcomm remote processors expose thermal mitigation endpoints
>>>>>>>>>>>> through QMI. These endpoints can be registered with the thermal
>>>>>>>>>>>> framework via the `#cooling-cells` property on the remoteproc node.
>>>>>>>>>>>>
>>>>>>>>>>>> The QMI TMD protocol identifies devices using string names (for example,
>>>>>>>>>>>> "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with
>>>>>>>>>>>> `#cooling-cells = <3>` requires numeric device id in the form:
>>>>>>>>>>>>
>>>>>>>>>>>>         <&phandle device_id min_state max_state>
>>>>>>>>>>>>
>>>>>>>>>>>> Define common TMD device index constants shared across currently
>>>>>>>>>>>> supported platforms. If a future target requires a different mapping,
>>>>>>>>>>>> additional target-specific constants can be introduced while preserving
>>>>>>>>>>>> existing DT ABI.
>>>>>>>>>>>>
>>>>>>>>>>>> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>>>>>>
>>>>>> [ ... ]
>>>>>>
>>>>>>>>> Why are you using only those TMD devices?
>>>>>>>>>
>>>>>>>>>> More constants can be added as needed.
>>>>>>>>>
>>>>>>>>> Kodiak is one of the supported platforms.
>>>>>>>>
>>>>>>>> What would be the benefit of having more than thirteen cooling devices
>>>>>>>> declared in the thermal framework and having only a couple of them mapped in
>>>>>>>> a thermal zone ?
>>>>>>>>
>>>>>>>> I agree there are more TMDs but if they are unused for the moment, why do we
>>>>>>>> need to add them ? Can we do that incrementally ?
>>>>>>>
>>>>>>> That's what I am trying to understand: why the implementation uses only
>>>>>>> the selected two devices, if the modem on Kodiak supports others. How
>>>>>>> can we find out, which TMDs to use on other devices.
>>>>>>
>>>>>> My understanding is that is an initial thermal setup. Gaurav will add them
>>>>>> step by step while setting up all the thermal zones instead of sending a big
>>>>>> patchset. And TBH, that will be much easier to review.
>>>>>
>>>>> In such a case it should be noted in the commit message and/or cover
>>>>> letter.
>>>>
>>>> Thanks for the review/guidance. Not all TMD endpoints are relevant for
>>>> kernel thermal zone binding — some like BCL and cold temperature are handled
>>>> from userspace when needed. The constants here cover only
>>>
>>> What if there is no userspace? Or the userspace is different from what
>>> you expect? I doubt we have TMD-speaking userspace yet.
>>
>> Thanks for mail, The TMD userspace implementation is available upstream at
>> https://github.com/qualcomm/qmi-framework.
> 
> Is it?
> 
> lumag@rohan:/tmp/qmi-framework$ git grep -i tmd
> lumag@rohan:/tmp/qmi-framework$
> 
> I found no traces of TMD there. Moreover, I don't see why QMI framework
> implementation would react to thermal events.
> 
>>>> what is needed for modem and CDSP thermal zones on the currently posted
>>>> targets.
>>>
>>> Again, SLPI, ADSP?
>>
>> Sorry, I should have said "generic subsystems" rather than listing specific
>> ones. SLPI and ADSP do not require active thermal mitigation on these
>> platforms.
> 
> Could you please provide details, then. What is cpuv_restriction_cold
> TMD?

It warms up the zone when the temperature is too cold


  reply	other threads:[~2026-07-09  7:42 UTC|newest]

Thread overview: 43+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2026-07-03  5:03 [PATCH v4 00/10] Add support for Qualcomm remoteproc subsystem cooling Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants Gaurav Kohli
2026-07-03  7:47   ` Krzysztof Kozlowski
2026-07-03 10:14     ` Gaurav Kohli
2026-07-03  7:52   ` Krzysztof Kozlowski
2026-07-03 10:31     ` Gaurav Kohli
2026-07-03  7:53   ` Konrad Dybcio
2026-07-03 14:13     ` Gaurav Kohli
2026-07-03 15:42       ` Dmitry Baryshkov
2026-07-06 17:03         ` Daniel Lezcano
2026-07-06 17:47           ` Dmitry Baryshkov
2026-07-06 18:11             ` Daniel Lezcano
2026-07-06 19:21               ` Krzysztof Kozlowski
2026-07-08 11:16                 ` Gaurav Kohli
2026-07-06 19:34               ` Dmitry Baryshkov
2026-07-07 10:25                 ` Gaurav Kohli
2026-07-08 14:25                   ` Dmitry Baryshkov
2026-07-09  5:24                     ` Gaurav Kohli
2026-07-09  7:37                       ` Dmitry Baryshkov
2026-07-09  7:42                         ` Daniel Lezcano [this message]
2026-07-09  7:58                           ` Dmitry Baryshkov
2026-07-09  8:23                             ` Daniel Lezcano
2026-07-03  5:03 ` [PATCH v4 02/10] dt-bindings: remoteproc: qcom,pas: add #cooling-cells property Gaurav Kohli
2026-07-03  7:49   ` Krzysztof Kozlowski
2026-07-05  8:41     ` Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 03/10] soc: qcom: Add QMI TMD support for remote thermal mitigation Gaurav Kohli
2026-07-03  8:03   ` Krzysztof Kozlowski
2026-07-05  9:37     ` Gaurav Kohli
2026-07-03 18:09   ` Julian Braha
2026-07-05  9:50     ` Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 04/10] remoteproc: qcom: pas: add support for TMD thermal cooling devices Gaurav Kohli
2026-07-03  7:56   ` Krzysztof Kozlowski
2026-07-05  9:56     ` Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 05/10] remoteproc: qcom_q6v5_pas: enable QMI TMD cooling support Gaurav Kohli
2026-07-06 17:08   ` Daniel Lezcano
2026-07-03  5:03 ` [PATCH v4 06/10] arm64: dts: qcom: kodiak: Enable CDSP & Modem cooling Gaurav Kohli
2026-07-03  7:51   ` Krzysztof Kozlowski
2026-07-03 15:48   ` Dmitry Baryshkov
2026-07-05 10:19     ` Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 07/10] arm64: dts: qcom: lemans: Enable CDSP cooling Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 08/10] arm64: dts: qcom: talos: " Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 09/10] arm64: dts: qcom: monaco: " Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 10/10] arm64: dts: qcom: hamoa: " Gaurav Kohli

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