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From: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com>
To: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Cc: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>,
	Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>,
	Bjorn Andersson <andersson@kernel.org>,
	Mathieu Poirier <mathieu.poirier@linaro.org>,
	Rob Herring <robh@kernel.org>,
	Krzysztof Kozlowski <krzk+dt@kernel.org>,
	Conor Dooley <conor+dt@kernel.org>,
	Amit Kucheria <amit.kucheria@oss.qualcomm.com>,
	Manivannan Sadhasivam <mani@kernel.org>,
	Konrad Dybcio <konradybcio@kernel.org>,
	Kees Cook <kees@kernel.org>,
	"Gustavo A. R. Silva" <gustavoars@kernel.org>,
	cros-qcom-dts-watchers@chromium.org,
	linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
	devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
	linux-pm@vger.kernel.org, linux-hardening@vger.kernel.org,
	Manaf Meethalavalappu Pallikunhi
	<manaf.pallikunhi@oss.qualcomm.com>
Subject: Re: [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants
Date: Mon, 6 Jul 2026 20:47:10 +0300	[thread overview]
Message-ID: <dv4n4ntnfvhouv23asgshgs7wcolkmqs7lbuni52maexo4s44x@4bqhf33x4fr6> (raw)
In-Reply-To: <10a346d8-fbb1-4142-a650-507c3917b8f6@oss.qualcomm.com>

On Mon, Jul 06, 2026 at 07:03:18PM +0200, Daniel Lezcano wrote:
> On 7/3/26 17:42, Dmitry Baryshkov wrote:
> > On Fri, Jul 03, 2026 at 07:43:39PM +0530, Gaurav Kohli wrote:
> > > 
> > > 
> > > On 7/3/2026 1:23 PM, Konrad Dybcio wrote:
> > > > On 7/3/26 7:03 AM, Gaurav Kohli wrote:
> > > > > Add Device Tree binding constants for Qualcomm Thermal Mitigation
> > > > > Device (TMD) types used by remoteproc-backed thermal cooling devices.
> > > > > 
> > > > > Qualcomm remote processors expose thermal mitigation endpoints
> > > > > through QMI. These endpoints can be registered with the thermal
> > > > > framework via the `#cooling-cells` property on the remoteproc node.
> > > > > 
> > > > > The QMI TMD protocol identifies devices using string names (for example,
> > > > > "pa", "modem", and "cdsp_sw"), while the DT cooling-device binding with
> > > > > `#cooling-cells = <3>` requires numeric device id in the form:
> > > > > 
> > > > >     <&phandle device_id min_state max_state>
> > > > > 
> > > > > Define common TMD device index constants shared across currently
> > > > > supported platforms. If a future target requires a different mapping,
> > > > > additional target-specific constants can be introduced while preserving
> > > > > existing DT ABI.
> > > > > 
> > > > > Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
> > > > > ---
> > > > >    MAINTAINERS                                 |  1 +
> > > > >    include/dt-bindings/firmware/qcom,qmi-tmd.h | 20 ++++++++++++++++++++
> > > > >    2 files changed, 21 insertions(+)
> > > > > 
> > > > > diff --git a/MAINTAINERS b/MAINTAINERS
> > > > > index 57656ec0e9d5..ffd85fd1dd80 100644
> > > > > --- a/MAINTAINERS
> > > > > +++ b/MAINTAINERS
> > > > > @@ -3410,6 +3410,7 @@ F:	drivers/firmware/qcom/
> > > > >    F:	drivers/soc/qcom/
> > > > >    F:	drivers/watchdog/gunyah_wdt.c
> > > > >    F:	include/dt-bindings/arm/qcom,ids.h
> > > > > +F:	include/dt-bindings/firmware/qcom,qmi-tmd.h
> > > > >    F:	include/dt-bindings/firmware/qcom,scm.h
> > > > >    F:	include/dt-bindings/soc/qcom*
> > > > >    F:	include/linux/firmware/qcom
> > > > > diff --git a/include/dt-bindings/firmware/qcom,qmi-tmd.h b/include/dt-bindings/firmware/qcom,qmi-tmd.h
> > > > > new file mode 100644
> > > > > index 000000000000..73efecef0f3c
> > > > > --- /dev/null
> > > > > +++ b/include/dt-bindings/firmware/qcom,qmi-tmd.h
> > > > > @@ -0,0 +1,20 @@
> > > > > +/* SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause */
> > > > > +/*
> > > > > + * Qualcomm QMI TMD (Thermal Mitigation Device) cooling device indices
> > > > > + *
> > > > > + * These indices are used in device tree cooling-maps to reference
> > > > > + * specific TMD devices provided by remote processors via QMI.
> > > > > + *
> > > > > + * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
> > > > > + */
> > > > > +#ifndef _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H
> > > > > +#define _DT_BINDINGS_FIRMWARE_QCOM_QMI_TMD_H
> > > > > +
> > > > > +/* CDSP thermal mitigation device id */
> > > > > +#define QCOM_CDSP_TMD_CDSP_SW	0
> > > > > +
> > > > > +/* Modem thermal mitigation device id */
> > > > > +#define QCOM_MODEM_TMD_PA	0
> > > > > +#define QCOM_MODEM_TMD_MODEM	1
> > > > 
> > > > What about the dozens other ones that Dmitry's laptop reports?Ri
> > > > 
> > > 
> > > Thanks for the review, Konrad.
> > > 
> > > We are only defining constants for the TMD devices that are actually used
> > > for thermal mitigation on the platforms supported by this series.
> > 
> > Why are you using only those TMD devices?
> > 
> > > More constants can be added as needed.
> > 
> > Kodiak is one of the supported platforms.
> 
> What would be the benefit of having more than thirteen cooling devices
> declared in the thermal framework and having only a couple of them mapped in
> a thermal zone ?
> 
> I agree there are more TMDs but if they are unused for the moment, why do we
> need to add them ? Can we do that incrementally ?

That's what I am trying to understand: why the implementation uses only
the selected two devices, if the modem on Kodiak supports others. How
can we find out, which TMDs to use on other devices.

-- 
With best wishes
Dmitry

  reply	other threads:[~2026-07-06 17:47 UTC|newest]

Thread overview: 43+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2026-07-03  5:03 [PATCH v4 00/10] Add support for Qualcomm remoteproc subsystem cooling Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 01/10] dt-bindings: firmware: qcom: tmd: add TMD device type constants Gaurav Kohli
2026-07-03  7:47   ` Krzysztof Kozlowski
2026-07-03 10:14     ` Gaurav Kohli
2026-07-03  7:52   ` Krzysztof Kozlowski
2026-07-03 10:31     ` Gaurav Kohli
2026-07-03  7:53   ` Konrad Dybcio
2026-07-03 14:13     ` Gaurav Kohli
2026-07-03 15:42       ` Dmitry Baryshkov
2026-07-06 17:03         ` Daniel Lezcano
2026-07-06 17:47           ` Dmitry Baryshkov [this message]
2026-07-06 18:11             ` Daniel Lezcano
2026-07-06 19:21               ` Krzysztof Kozlowski
2026-07-08 11:16                 ` Gaurav Kohli
2026-07-06 19:34               ` Dmitry Baryshkov
2026-07-07 10:25                 ` Gaurav Kohli
2026-07-08 14:25                   ` Dmitry Baryshkov
2026-07-09  5:24                     ` Gaurav Kohli
2026-07-09  7:37                       ` Dmitry Baryshkov
2026-07-09  7:42                         ` Daniel Lezcano
2026-07-09  7:58                           ` Dmitry Baryshkov
2026-07-09  8:23                             ` Daniel Lezcano
2026-07-03  5:03 ` [PATCH v4 02/10] dt-bindings: remoteproc: qcom,pas: add #cooling-cells property Gaurav Kohli
2026-07-03  7:49   ` Krzysztof Kozlowski
2026-07-05  8:41     ` Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 03/10] soc: qcom: Add QMI TMD support for remote thermal mitigation Gaurav Kohli
2026-07-03  8:03   ` Krzysztof Kozlowski
2026-07-05  9:37     ` Gaurav Kohli
2026-07-03 18:09   ` Julian Braha
2026-07-05  9:50     ` Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 04/10] remoteproc: qcom: pas: add support for TMD thermal cooling devices Gaurav Kohli
2026-07-03  7:56   ` Krzysztof Kozlowski
2026-07-05  9:56     ` Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 05/10] remoteproc: qcom_q6v5_pas: enable QMI TMD cooling support Gaurav Kohli
2026-07-06 17:08   ` Daniel Lezcano
2026-07-03  5:03 ` [PATCH v4 06/10] arm64: dts: qcom: kodiak: Enable CDSP & Modem cooling Gaurav Kohli
2026-07-03  7:51   ` Krzysztof Kozlowski
2026-07-03 15:48   ` Dmitry Baryshkov
2026-07-05 10:19     ` Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 07/10] arm64: dts: qcom: lemans: Enable CDSP cooling Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 08/10] arm64: dts: qcom: talos: " Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 09/10] arm64: dts: qcom: monaco: " Gaurav Kohli
2026-07-03  5:03 ` [PATCH v4 10/10] arm64: dts: qcom: hamoa: " Gaurav Kohli

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