From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: Stephan Gerhold <stephan.gerhold@linaro.org>, konradybcio@kernel.org
Cc: andersson@kernel.org, robh@kernel.org, krzk+dt@kernel.org,
johannes.goede@oss.qualcomm.com, conor+dt@kernel.org,
linux-arm-msm@vger.kernel.org, devicetree@vger.kernel.org,
linux-kernel@vger.kernel.org,
Mark Pearson <mpearson-lenovo@squebb.ca>
Subject: Re: [PATCH v3] arm64: dts: qcom: x1e78100-thinkpad-t14s: Add thermal zones for PMICs
Date: Wed, 21 Oct 2026 22:33:52 +0200 [thread overview]
Message-ID: <912b3de9-cb81-4d90-9d2c-9b99297e2645@oss.qualcomm.com> (raw)
In-Reply-To: <atjy8ZVUW61VBa26@linaro.org>
On 10/21/26 19:14, Stephan Gerhold wrote:
> On Wed, Oct 21, 2026 at 06:20:55PM +0200, Daniel Lezcano wrote:
>> On 10/21/26 10:49, Stephan Gerhold wrote:
>>> On Tue, Oct 20, 2026 at 06:08:56PM +0200, Daniel Lezcano wrote:
>>>>
>>>> Thanks Stephan for the additional information, that's very helpful.
>>>>
>>>> We currently have an urgent thermal issue on this platform, and getting this
>>>> thermal mitigation upstream is important to prevent overheating under
>>>> sustained workloads.
>>>>
>>>> Would it be acceptable to address the sensor naming and description
>>>> improvements in a follow-up patch, so that we can get the thermal protection
>>>> in place first?
>>>>
>>>> Of course, if any of these changes are critical for the correctness of the
>>>> thermal mitigation, we should address them now.
>>>>
>>>
>>> I have no intention to delay this patch. In fact, since I'm using the
>>> latest unmodified stable kernel on my T14s, I'm also suffering from
>>> these thermal issues. :-)
>>>
>>> On the other hand, we are at the beginning of the merge window and Bjorn
>>> is unlikely to queue patches until that ends. The changes that
>>> I suggested are purely cosmetic (the names of the thermal zones), there
>>> is no need to repeat the thermal validation. The throttling behavior
>>> will be identical no matter which name is used for the thermal zones.
>>>
>>> IMO we should use the remaining time until the merge window ends to
>>> correct the naming to avoid any confusion for people reading the patch
>>> once it lands.
>>
>> Ok, fair enough
>>
>> I propose the following names for the thermal zone:
>>
>> dram-board-thermal
>> gpu-board-thermal
>> fan-board-thermal
>> wwan-board-thermal
>> chg-board-thermal
>> cpu-board-thermal
>> typec-board-thermal
>>
>> so we can capture with the name the ones related to the non-on-die sensors
>>
>> Sounds good ?
>
> That works for me, I don't have a strong opinion about the naming (maybe
> @Konrad has?). I guess people reading this might mistakenly assume that
> these refer to separate "sub-boards" in the sense that there is a
> "mainboard", a "Type-C board", a "DRAM board", a "GPU board", etc.
> But I can't think of a better name either. :-)
Hmm, yes. That is a good a point
prev parent reply other threads:[~2026-10-21 20:33 UTC|newest]
Thread overview: 8+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-10-14 19:35 Daniel Lezcano
2026-10-14 19:36 ` johannes.goede
2026-10-16 9:56 ` Stephan Gerhold
2026-10-20 16:08 ` Daniel Lezcano
2026-10-21 8:49 ` Stephan Gerhold
2026-10-21 16:20 ` Daniel Lezcano
2026-10-21 17:14 ` Stephan Gerhold
2026-10-21 20:33 ` Daniel Lezcano [this message]
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