Re: [PATCH v3 1/8] dt-bindings: remoteproc: qcom,pas: add thermal mitigation properties

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

On 6/24/26 12:42, Krzysztof Kozlowski wrote:

[ ... ]

> Therefore I still do not see the need of tmd-names. You know the name of
> cooling device, because you have strict one-to-one mapping.


There is one remote proc with one or multiple cooling devices attached.

We describe those in the remoteproc node with the tmd-names.

Anyway, we should be able to list the tmd names in the driver itself if 
we ensure a consistency with the index by defining them in a shared 
header eg. include/dt-bindings/firmware/qcom,cdsp.h

#define HAMOA_TMD_CDSP_SW 0
#define HAMOA_TMD_CDSP_HW 1
#define HAMOA_TMD_CP0UV_RESTRICTION_COLD 2

In the driver:

struct tmd_name {
	const char *name;
	int id;
	bool disabled;
};

static struct tmd_name tmd_names[] = {
	{ .name = "cdsp_sw", HAMOA_TMD_CDSP_SW },
	{ .name = "cdsp_hw", HAMOA_TMD_CDSP_HW, .disabled = true },
	{ .name = "cpuv_restriction_cold", HAMOA_TMD_CP0UV_RESTRICTION_COLD, 
.disabled = true },
};

...
	for (int i = 0; i < ARRAY_SIZE(tmd_names); i++) {

		if (tmd_names[i].disabled)
			continue;
		devm_cooling_of_device_register(rprocdev,
			tmd_names[i].name, tmd_names[i].id, ...);
	}


In the device tree:

	cooling-maps = <&rproc HAMOA_TMD_CDSP_SW min max>;

I think that is somehow what Konrad and Dmitry were suggesting

Does it sound better ?