From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
To: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>,
Krzysztof Kozlowski <krzk@kernel.org>
Cc: Bjorn Andersson <andersson@kernel.org>,
Mathieu Poirier <mathieu.poirier@linaro.org>,
Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>,
Amit Kucheria <amit.kucheria@oss.qualcomm.com>,
Manivannan Sadhasivam <mani@kernel.org>,
Konrad Dybcio <konradybcio@kernel.org>,
Kees Cook <kees@kernel.org>,
"Gustavo A. R. Silva" <gustavoars@kernel.org>,
cros-qcom-dts-watchers@chromium.org,
linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
devicetree@vger.kernel.org, linux-kernel@vger.kernel.org,
linux-pm@vger.kernel.org, linux-hardening@vger.kernel.org,
Manaf Meethalavalappu Pallikunhi
<manaf.pallikunhi@oss.qualcomm.com>,
Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com>
Subject: Re: [PATCH v3 1/8] dt-bindings: remoteproc: qcom,pas: add thermal mitigation properties
Date: Mon, 29 Jun 2026 20:01:43 +0530 [thread overview]
Message-ID: <2754f738-04ef-4f54-86bb-6744e768a8ad@oss.qualcomm.com> (raw)
In-Reply-To: <af39bf37-4ab4-44d9-b91b-b8fa1784783a@oss.qualcomm.com>
On 6/25/2026 1:21 PM, Daniel Lezcano wrote:
>
>
> Le 25/06/2026 à 08:48, Krzysztof Kozlowski a écrit :
>> On 24/06/2026 17:56, Daniel Lezcano wrote:
>>> On 6/24/26 12:42, Krzysztof Kozlowski wrote:
>>>
>>> [ ... ]
>>>
>>>> Therefore I still do not see the need of tmd-names. You know the
>>>> name of
>>>> cooling device, because you have strict one-to-one mapping.
>>>
>>>
>>> There is one remote proc with one or multiple cooling devices attached.
>>>
>>> We describe those in the remoteproc node with the tmd-names.
>>>
>>> Anyway, we should be able to list the tmd names in the driver itself if
>>> we ensure a consistency with the index by defining them in a shared
>>> header eg. include/dt-bindings/firmware/qcom,cdsp.h
>>>
>>> #define HAMOA_TMD_CDSP_SW 0
>>> #define HAMOA_TMD_CDSP_HW 1
>>> #define HAMOA_TMD_CP0UV_RESTRICTION_COLD 2
>>>
>>> In the driver:
>>>
>>> struct tmd_name {
>>> const char *name;
>>> int id;
>>> bool disabled;
>>> };
>>>
>>> static struct tmd_name tmd_names[] = {
>>> { .name = "cdsp_sw", HAMOA_TMD_CDSP_SW },
>>> { .name = "cdsp_hw", HAMOA_TMD_CDSP_HW, .disabled = true },
>>> { .name = "cpuv_restriction_cold", HAMOA_TMD_CP0UV_RESTRICTION_COLD,
>>> .disabled = true },
>>> };
>>>
>>> ...
>>> for (int i = 0; i < ARRAY_SIZE(tmd_names); i++) {
>>>
>>> if (tmd_names[i].disabled)
>>> continue;
>>> devm_cooling_of_device_register(rprocdev,
>>> tmd_names[i].name, tmd_names[i].id, ...);
>>> }
>>>
>>>
>>> In the device tree:
>>>
>>> cooling-maps = <&rproc HAMOA_TMD_CDSP_SW min max>;
>>>
>>> I think that is somehow what Konrad and Dmitry were suggesting
>>>
>>> Does it sound better ?
>>
>> Yes and I am surprised that it came now. So you had TMD index available
>> thus the ID was defined. If device has unique and fixed ID, you should
>> not have any more properties defining it, because that ID is enough. Any
>> names could be only for users, e.g. label, but that is not the case here.
> Yes indeed, having the constraint of cooling index and tmd(name, id) for
> the connection between the cooling device and the thermal zone was a bit
> confusing in our discussion.
>
Thanks for review, will send new version with this new dt binding approach.
> Thanks for the review
>
next prev parent reply other threads:[~2026-06-29 14:31 UTC|newest]
Thread overview: 49+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-06-09 10:22 [PATCH v3 0/8] Add support for Qualcomm remoteproc subsystem cooling Gaurav Kohli
2026-06-09 10:22 ` [PATCH v3 1/8] dt-bindings: remoteproc: qcom,pas: add thermal mitigation properties Gaurav Kohli
2026-06-09 10:47 ` Dmitry Baryshkov
2026-06-10 12:02 ` Gaurav Kohli
2026-06-10 7:31 ` Krzysztof Kozlowski
2026-06-11 11:12 ` Gaurav Kohli
2026-06-11 12:23 ` Krzysztof Kozlowski
2026-06-12 13:52 ` Gaurav Kohli
2026-06-13 7:41 ` Krzysztof Kozlowski
2026-06-13 11:05 ` Gaurav Kohli
2026-06-15 5:03 ` Krzysztof Kozlowski
2026-06-15 10:34 ` Daniel Lezcano
2026-06-15 12:12 ` Gaurav Kohli
2026-06-15 12:30 ` Daniel Lezcano
2026-06-15 14:11 ` Dmitry Baryshkov
2026-06-15 14:33 ` Daniel Lezcano
2026-06-15 15:14 ` Dmitry Baryshkov
2026-06-15 15:33 ` Daniel Lezcano
2026-06-15 22:15 ` Dmitry Baryshkov
2026-06-17 12:32 ` Konrad Dybcio
2026-06-19 12:16 ` Daniel Lezcano
2026-06-16 4:21 ` Krzysztof Kozlowski
2026-06-18 7:17 ` Daniel Lezcano
2026-06-24 10:42 ` Krzysztof Kozlowski
2026-06-24 15:56 ` Daniel Lezcano
2026-06-25 6:48 ` Krzysztof Kozlowski
2026-06-25 7:51 ` Daniel Lezcano
2026-06-29 14:31 ` Gaurav Kohli [this message]
2026-06-09 10:22 ` [PATCH v3 2/8] soc: qcom: Add support for QMI TMD cooling devices Gaurav Kohli
2026-06-09 11:30 ` Dmitry Baryshkov
2026-06-09 12:08 ` Daniel Lezcano
2026-06-10 13:42 ` Dmitry Baryshkov
2026-06-10 14:15 ` Daniel Lezcano
2026-06-11 10:53 ` Gaurav Kohli
2026-06-11 22:50 ` Dmitry Baryshkov
2026-06-09 10:22 ` [PATCH v3 3/8] remoteproc: qcom: pas: register TMD thermal " Gaurav Kohli
2026-06-09 11:05 ` Dmitry Baryshkov
2026-06-09 12:03 ` Konrad Dybcio
2026-06-11 4:45 ` Gaurav Kohli
2026-06-11 20:34 ` Dmitry Baryshkov
2026-06-09 10:22 ` [PATCH v3 4/8] arm64: dts: qcom: kodiak: Enable CDSP & Modem cooling Gaurav Kohli
2026-06-09 10:57 ` Dmitry Baryshkov
2026-06-15 5:32 ` Gaurav Kohli
2026-06-15 15:25 ` Dmitry Baryshkov
2026-06-29 14:43 ` Gaurav Kohli
2026-06-09 10:23 ` [PATCH v3 5/8] arm64: dts: qcom: lemans: Enable CDSP cooling Gaurav Kohli
2026-06-09 10:23 ` [PATCH v3 6/8] arm64: dts: qcom: talos: " Gaurav Kohli
2026-06-09 10:23 ` [PATCH v3 7/8] arm64: dts: qcom: monaco: " Gaurav Kohli
2026-06-09 10:23 ` [PATCH v3 8/8] arm64: dts: qcom: hamoa: " Gaurav Kohli
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