Re: [PATCH 03/15] dt-bindings: nvme: apple: Add apple,t8142-nvme-ans2 compatible

[Sven Peter <sven@kernel.org>]

On 11/11/26 15:32, Yureka wrote:
> On 11/11/26 13:46, Krzysztof Kozlowski wrote:
>> On Fri, Nov 06, 2026 at 10:04:12PM +0100, Yureka Lilian wrote:
>>> "apple,t8142-nvme-ans2" on the Apple M5 SoC is compatible with
>>> "apple,t8132-nvme-ans2" so add its per-SoC compatible.
>>>
>>> Signed-off-by: Yureka Lilian <yureka@cyberchaos.dev>
>>> ---
>>>   Documentation/devicetree/bindings/nvme/apple,nvme-ans.yaml | 1 +
>>>   1 file changed, 1 insertion(+)
>>>
>> Squash all nvmem patches. Don't add compatibles one by one.
>>
>> Best regards,
>> Krzysztof
>
>
> Hello Krzysztof,
>
>
> (replying to all three of your emails here)
>
> thanks for your feedback! I did run `b4 prep --check` and `make 
> dtbs_check` before sending and it passed without warnings on all 15 
> patches of this series. I will now also run `checkpatch.pl --strict` 
> as you suggested.
>
> For v2, I will make one commit per type of dt-binding, so 
> "dt-bindings: nvme: apple: Add t6040,t8140,t8142", and then "mailbox: 
> apple,mailbox: Add t8132,t6040,t8140,t8142", etc., ok or do you have 
> another suggested grouping?
>
> > Please stop inflating this. You are only making it difficult to 
> review your work.
>
> It would be appreciated if you can tell me clearly what is expected, 
> as this statement is not actually telling me what is inflated / wrong.
I think you already understood it: Just one commit for SART, one for 
NVMe, and one for the mailbox bindings that each add all new compatibles 
at once because the hardware (likely) didn't change and there's no need 
to explain what's different from the previous generation.


Thanks,

Sven