From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Andy Shevchenko <andriy.shevchenko@linux.intel.com>,
Aryan Sinha <sinha.aryan03@gmail.com>,
Bhargav Joshi <j.bhargav.u@gmail.com>,
Biju Das <biju.das@bp.renesas.com>,
Christophe JAILLET <christophe.jaillet@wanadoo.fr>,
Dhruvin Rajpura <drajpura@qti.qualcomm.com>,
Florian Fainelli <florian.fainelli@broadcom.com>,
Georgi Djakov <djakov@kernel.org>,
Hemanth Selam <hemanth.selam@gmail.com>,
Karl Mehltretter <kmehltretter@gmail.com>,
liujing <liujing@cmss.chinamobile.com>,
Markus Elfring <Markus.Elfring@web.de>,
muzafferkadir@mainlining.org,
Ovidiu Panait <ovidiu.panait.rb@renesas.com>,
Pengpeng Hou <pengpeng@iscas.ac.cn>,
Priyansh Jain <priyansh.jain@oss.qualcomm.com>,
Rob Herring <robh+dt@kernel.org>,
Ronald Claveau <linux-kernel-dev@aliel.fr>,
Tudor Ambarus <tudor.ambarus@linaro.org>,
Vitaliy Sochnev <sochnev.v.74@gmail.com>,
Weigang He <geoffreyhe2@gmail.com>,
Linux Kernel Mailing List <linux-kernel@vger.kernel.org>,
Linux PM mailing list <linux-pm@vger.kernel.org>
Subject: [GIT PULL] thermal drivers for v7.4-rc1
Date: Wed, 14 Oct 2026 16:08:41 +0200 [thread overview]
Message-ID: <dcde6e02-d61f-429f-a9fd-57043c4819f7@oss.qualcomm.com> (raw)
Hi Rafael,
The following changes since commit cee9395acd8043be0644b25c34bfa86623f2b935:
Linux 7.3-rc1 (2026-08-30 13:34:40 -0700)
are available in the Git repository at:
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git
tags/thermal-v7.4-rc1
for you to fetch changes up to 2dc1f296b5754dd2441fc8b6613a362a47f6b98f:
thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
(2026-10-14 09:46:07 +0200)
----------------------------------------------------------------
- Add the Exynos ACPM thermal driver for Google GS101, along with
DT bindings and a MAINTAINERS entry (Tudor Ambarus)
- Add Renesas RZ/G3L thermal sensor support and DT bindings, and move
default calibration values to per-SoC match data (Biju Das)
- Add Qualcomm MSM8952 TSENS support and the corresponding DT binding
compatible (Muzaffer Kadir)
- Document the Qualcomm PMAU0102 Master BandGap temperature monitor
compatible in the DT bindings (Dhruvin Rajpura)
- Extend the QCom TSENS v2 trip temperature limits to the hardware
range of -204°C to +204°C to prevent interrupt storms when operating
beyond the previous software limits (Priyansh Jain)
- Fix temperature threshold map indexing in the QCom SPMI temperature
alarm driver to prevent out-of-bounds reads (Georgi Djakov)
- Describe the additional bus clock required by the Amlogic T7 thermal
sensor and switch the driver to the clk_bulk API to manage multiple
clocks (Ronald Claveau)
- Request the Airoha EN7581 IRQ after thermal zone registration to
prevent the interrupt handler from accessing an unregistered or
already freed thermal zone (Vitaliy Sochnev)
- Fix the Airoha AN7583 ADC mux field mapping, serialize access to the
shared ADC, and verify mux selection to avoid invalid temperature
readings and spurious critical shutdowns (Vitaliy Sochnev)
- Register separate thermal zones for the AN7583 bandgap, GbE and CPU
sensors, and update the DT bindings to use one thermal sensor cell
to select the sensor (Vitaliy Sochnev)
- Fix signed integer overflow in the Renesas RZ/G3E temperature-to-code
conversion, preserve compare interrupt state across runtime PM,
and prevent overlapping temperature conversions (Ovidiu Panait)
- Remove redundant trip window validation and runtime PM
pm_runtime_mark_last_busy() calls from the Renesas RZ/G3E driver
(Ovidiu Panait)
- Propagate reset assertion failures from Renesas RZ/G3E suspend and
attempt to restore power if the sensor was active (Pengpeng Hou)
- Stop the TI bandgap alert IRQ before removing sensor interfaces and
cancel pending alert work to prevent use-after-free on driver removal
(Weigang He)
- Validate Spreadtrum sensor IDs read from the device tree before using
them for register offsets and array indexing (Weigang He)
- Convert the TI OMAP bandgap DT bindings to schema and document the
DRA752 compatible and thermal sensor cells (Bhargav Joshi)
- Use DT property helpers matching the signed temperature and unsigned
hysteresis types defined by the thermal zone bindings (Rob Herring)
- Reuse common error handling code in the power allocator governor
bind callback (Markus Elfring)
- Constify the thermal zone device operations in the i.MX9 driver
(Christophe JAILLET)
- Fix kernel-doc parameter names and firmware node references in the
cooling device registration helpers (Aryan Sinha)
- Correct the documented return value of ti_bandgap_get_sensor_data()
to describe validation errors and potentially NULL stored data
(Karl Mehltretter)
- Ensure NUL-termination when copying the cooling device command-line
argument in tmon and fix the associated string truncation warning
(Florian Fainelli)
- Fix undefined behavior caused by a signed shift in the tmon thermal
zone binding display (Liu Jing)
- Fix wording in tmon comments (Hemanth Selam)
----------------------------------------------------------------
Andy Shevchenko (1):
thermal: sysfs: switch to use scnprintf() to suppress truncation
warning
Aryan Sinha (1):
thermal/fw: Fix kernel-doc parameter names
Bhargav Joshi (1):
dt-bindings: thermal: ti,omap-bandgap: Convert to DT schema
Biju Das (3):
dt-bindings: thermal: r9a08g045-tsu: Document RZ/G3L TSU
thermal/drivers/renesas/rzg3s: Convert calibration defaults to
per-SoC match data
thermal/drivers/renesas/rzg3s: Add RZ/G3L TSU support
Christophe JAILLET (1):
thermal/drivers/imx9: Constify struct thermal_zone_device_ops
Dhruvin Rajpura (1):
dt-bindings: thermal: qcom,pm8775-mbg-tm: Document PMAU0102
Florian Fainelli (1):
tools/thermal/tmon: Fix string truncation warning in optarg copy
Georgi Djakov (1):
thermal/drivers/qcom-spmi-temp-alarm: Fix temp_map indexing
Hemanth Selam (1):
tools/thermal: Fix typo "binded" in comments
Karl Mehltretter (1):
thermal: ti-soc-thermal: Fix the return value in
ti_bandgap_get_sensor_data() kernel-doc
Liu Jing (1):
tools/thermal/tmon: Fix signed shift UB in binding display
Markus Elfring (1):
thermal: gov_power_allocator: Use common error handling code in
power_allocator_bind()
Muzaffer Kadir (2):
dt-bindings: thermal: tsens: Add MSM8952
thermal/qcom/tsens: Add support for MSM8952 tsens
Ovidiu Panait (5):
drivers/thermal/renesas/rzg3e: Fix signed integer overflow in
temp_to_code()
thermal/drivers/renesas/rzg3e: Fix runtime PM handling of compare irq
thermal/drivers/renesas/rzg3e: Fix race between set_trips() and
get_temp()
thermal/drivers/renesas/rzg3e: Remove unneeded low/high check in
set_trips()
thermal/drivers/renesas/rzg3e: Remove redundant
pm_runtime_mark_last_busy() calls
Pengpeng Hou (1):
thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
Priyansh Jain (1):
thermal/drivers/qcom/tsens: Widen temperature limits to match
hardware range
Rob Herring (Arm) (1):
thermal: of: Match trip property helper types
Ronald Claveau (2):
dt-bindings: thermal: amlogic: describe bus clock for t7-thermal
thermal/drivers/amlogic: Switch to clk_bulk API to support
multiple clocks
Tudor Ambarus (3):
dt-bindings: thermal: Add Google GS101 TMU
thermal/drivers/samsung: Add Exynos ACPM TMU driver GS101
MAINTAINERS: Add entry for Samsung Exynos ACPM thermal driver
Vitaliy Sochnev (5):
thermal/drivers/airoha: Request the EN7581 IRQ after zone
registration
thermal/drivers/airoha: Fix AN7583 ADC mux field mapping
thermal/drivers/airoha: Serialise access to the shared ADC
dt-bindings: arm: airoha: Use one thermal sensor cell for AN7583
thermal/drivers/airoha: Register a thermal zone per AN7583 sensor
Weigang He (2):
thermal/drivers/ti-soc-thermal: Cancel pending alert work on remove
thermal/drivers/sprd: validate the sensor id from the device tree
.../bindings/arm/airoha,en7581-chip-scu.yaml | 3 +-
.../bindings/thermal/amlogic,thermal.yaml | 29 +-
.../bindings/thermal/google,gs101-tmu-top.yaml | 69 +++
.../bindings/thermal/qcom,pm8775-mbg-tm.yaml | 7 +-
.../devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
.../bindings/thermal/renesas,r9a08g045-tsu.yaml | 4 +-
.../bindings/thermal/ti,omap-bandgap.yaml | 177 ++++++
.../devicetree/bindings/thermal/ti_soc_thermal.txt | 88 ---
MAINTAINERS | 8 +
drivers/thermal/airoha_thermal.c | 179 ++++--
drivers/thermal/amlogic_thermal.c | 14 +-
drivers/thermal/gov_power_allocator.c | 11 +-
drivers/thermal/imx91_thermal.c | 2 +-
drivers/thermal/qcom/qcom-spmi-temp-alarm.c | 8 +-
drivers/thermal/qcom/tsens-v1.c | 41 ++
drivers/thermal/qcom/tsens-v2.c | 4 +-
drivers/thermal/qcom/tsens.c | 3 +
drivers/thermal/qcom/tsens.h | 2 +-
drivers/thermal/renesas/rzg3e_thermal.c | 45 +-
drivers/thermal/renesas/rzg3s_thermal.c | 38 +-
drivers/thermal/samsung/Kconfig | 19 +
drivers/thermal/samsung/Makefile | 2 +
drivers/thermal/samsung/acpm-tmu.c | 651
+++++++++++++++++++++
drivers/thermal/sprd_thermal.c | 6 +
drivers/thermal/thermal_fw.c | 8 +-
drivers/thermal/thermal_of.c | 11 +-
drivers/thermal/thermal_sysfs.c | 12 +-
drivers/thermal/ti-soc-thermal/ti-bandgap.c | 10 +-
drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 4 +
tools/thermal/tmon/sysfs.c | 2 +-
tools/thermal/tmon/tmon.c | 4 +-
tools/thermal/tmon/tmon.h | 2 +-
tools/thermal/tmon/tui.c | 2 +-
33 files changed, 1262 insertions(+), 204 deletions(-)
create mode 100644
Documentation/devicetree/bindings/thermal/google,gs101-tmu-top.yaml
create mode 100644
Documentation/devicetree/bindings/thermal/ti,omap-bandgap.yaml
delete mode 100644
Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
create mode 100644 drivers/thermal/samsung/acpm-tmu.c
next reply other threads:[~2026-10-14 14:08 UTC|newest]
Thread overview: 3+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-10-14 14:08 Daniel Lezcano [this message]
2026-10-14 18:37 ` Rafael J. Wysocki (Intel)
-- strict thread matches above, loose matches on Subject: below --
2026-10-14 14:08 Daniel Lezcano
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