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From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Andy Shevchenko <andriy.shevchenko@linux.intel.com>,
	Aryan Sinha <sinha.aryan03@gmail.com>,
	Bhargav Joshi <j.bhargav.u@gmail.com>,
	Biju Das <biju.das@bp.renesas.com>,
	Christophe JAILLET <christophe.jaillet@wanadoo.fr>,
	Dhruvin Rajpura <drajpura@qti.qualcomm.com>,
	Florian Fainelli <florian.fainelli@broadcom.com>,
	Georgi Djakov <djakov@kernel.org>,
	Hemanth Selam <hemanth.selam@gmail.com>,
	Karl Mehltretter <kmehltretter@gmail.com>,
	liujing <liujing@cmss.chinamobile.com>,
	Markus Elfring <Markus.Elfring@web.de>,
	muzafferkadir@mainlining.org,
	Ovidiu Panait <ovidiu.panait.rb@renesas.com>,
	Pengpeng Hou <pengpeng@iscas.ac.cn>,
	Priyansh Jain <priyansh.jain@oss.qualcomm.com>,
	Rob Herring <robh+dt@kernel.org>,
	Ronald Claveau <linux-kernel-dev@aliel.fr>,
	Tudor Ambarus <tudor.ambarus@linaro.org>,
	Vitaliy Sochnev <sochnev.v.74@gmail.com>,
	Weigang He <geoffreyhe2@gmail.com>,
	Linux Kernel Mailing List <linux-kernel@vger.kernel.org>,
	Linux PM mailing list <linux-pm@vger.kernel.org>
Subject: [GIT PULL] thermal drivers for v7.4-rc1
Date: Wed, 14 Oct 2026 16:08:41 +0200	[thread overview]
Message-ID: <dcde6e02-d61f-429f-a9fd-57043c4819f7@oss.qualcomm.com> (raw)


Hi Rafael,


The following changes since commit cee9395acd8043be0644b25c34bfa86623f2b935:

   Linux 7.3-rc1 (2026-08-30 13:34:40 -0700)

are available in the Git repository at:

   git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git 
tags/thermal-v7.4-rc1

for you to fetch changes up to 2dc1f296b5754dd2441fc8b6613a362a47f6b98f:

   thermal/drivers/rzg3e: Propagate reset assertion failure from suspend 
(2026-10-14 09:46:07 +0200)

----------------------------------------------------------------
- Add the Exynos ACPM thermal driver for Google GS101, along with
   DT bindings and a MAINTAINERS entry (Tudor Ambarus)

- Add Renesas RZ/G3L thermal sensor support and DT bindings, and move
   default calibration values to per-SoC match data (Biju Das)

- Add Qualcomm MSM8952 TSENS support and the corresponding DT binding
   compatible (Muzaffer Kadir)

- Document the Qualcomm PMAU0102 Master BandGap temperature monitor
   compatible in the DT bindings (Dhruvin Rajpura)

- Extend the QCom TSENS v2 trip temperature limits to the hardware
   range of -204°C to +204°C to prevent interrupt storms when operating
   beyond the previous software limits (Priyansh Jain)

- Fix temperature threshold map indexing in the QCom SPMI temperature
   alarm driver to prevent out-of-bounds reads (Georgi Djakov)

- Describe the additional bus clock required by the Amlogic T7 thermal
   sensor and switch the driver to the clk_bulk API to manage multiple
   clocks (Ronald Claveau)

- Request the Airoha EN7581 IRQ after thermal zone registration to
   prevent the interrupt handler from accessing an unregistered or
   already freed thermal zone (Vitaliy Sochnev)

- Fix the Airoha AN7583 ADC mux field mapping, serialize access to the
   shared ADC, and verify mux selection to avoid invalid temperature
   readings and spurious critical shutdowns (Vitaliy Sochnev)

- Register separate thermal zones for the AN7583 bandgap, GbE and CPU
   sensors, and update the DT bindings to use one thermal sensor cell
   to select the sensor (Vitaliy Sochnev)

- Fix signed integer overflow in the Renesas RZ/G3E temperature-to-code
   conversion, preserve compare interrupt state across runtime PM,
   and prevent overlapping temperature conversions (Ovidiu Panait)

- Remove redundant trip window validation and runtime PM
   pm_runtime_mark_last_busy() calls from the Renesas RZ/G3E driver
   (Ovidiu Panait)

- Propagate reset assertion failures from Renesas RZ/G3E suspend and
   attempt to restore power if the sensor was active (Pengpeng Hou)

- Stop the TI bandgap alert IRQ before removing sensor interfaces and
   cancel pending alert work to prevent use-after-free on driver removal
   (Weigang He)

- Validate Spreadtrum sensor IDs read from the device tree before using
   them for register offsets and array indexing (Weigang He)

- Convert the TI OMAP bandgap DT bindings to schema and document the
   DRA752 compatible and thermal sensor cells (Bhargav Joshi)

- Use DT property helpers matching the signed temperature and unsigned
   hysteresis types defined by the thermal zone bindings (Rob Herring)

- Reuse common error handling code in the power allocator governor
   bind callback (Markus Elfring)

- Constify the thermal zone device operations in the i.MX9 driver
   (Christophe JAILLET)

- Fix kernel-doc parameter names and firmware node references in the
   cooling device registration helpers (Aryan Sinha)

- Correct the documented return value of ti_bandgap_get_sensor_data()
   to describe validation errors and potentially NULL stored data
   (Karl Mehltretter)

- Ensure NUL-termination when copying the cooling device command-line
   argument in tmon and fix the associated string truncation warning
   (Florian Fainelli)

- Fix undefined behavior caused by a signed shift in the tmon thermal
   zone binding display (Liu Jing)

- Fix wording in tmon comments (Hemanth Selam)

----------------------------------------------------------------
Andy Shevchenko (1):
       thermal: sysfs: switch to use scnprintf() to suppress truncation 
warning

Aryan Sinha (1):
       thermal/fw: Fix kernel-doc parameter names

Bhargav Joshi (1):
       dt-bindings: thermal: ti,omap-bandgap: Convert to DT schema

Biju Das (3):
       dt-bindings: thermal: r9a08g045-tsu: Document RZ/G3L TSU
       thermal/drivers/renesas/rzg3s: Convert calibration defaults to 
per-SoC match data
       thermal/drivers/renesas/rzg3s: Add RZ/G3L TSU support

Christophe JAILLET (1):
       thermal/drivers/imx9: Constify struct thermal_zone_device_ops

Dhruvin Rajpura (1):
       dt-bindings: thermal: qcom,pm8775-mbg-tm: Document PMAU0102

Florian Fainelli (1):
       tools/thermal/tmon: Fix string truncation warning in optarg copy

Georgi Djakov (1):
       thermal/drivers/qcom-spmi-temp-alarm: Fix temp_map indexing

Hemanth Selam (1):
       tools/thermal: Fix typo "binded" in comments

Karl Mehltretter (1):
       thermal: ti-soc-thermal: Fix the return value in 
ti_bandgap_get_sensor_data() kernel-doc

Liu Jing (1):
       tools/thermal/tmon: Fix signed shift UB in binding display

Markus Elfring (1):
       thermal: gov_power_allocator: Use common error handling code in 
power_allocator_bind()

Muzaffer Kadir (2):
       dt-bindings: thermal: tsens: Add MSM8952
       thermal/qcom/tsens: Add support for MSM8952 tsens

Ovidiu Panait (5):
       drivers/thermal/renesas/rzg3e: Fix signed integer overflow in 
temp_to_code()
       thermal/drivers/renesas/rzg3e: Fix runtime PM handling of compare irq
       thermal/drivers/renesas/rzg3e: Fix race between set_trips() and 
get_temp()
       thermal/drivers/renesas/rzg3e: Remove unneeded low/high check in 
set_trips()
       thermal/drivers/renesas/rzg3e: Remove redundant 
pm_runtime_mark_last_busy() calls

Pengpeng Hou (1):
       thermal/drivers/rzg3e: Propagate reset assertion failure from suspend

Priyansh Jain (1):
       thermal/drivers/qcom/tsens: Widen temperature limits to match 
hardware range

Rob Herring (Arm) (1):
       thermal: of: Match trip property helper types

Ronald Claveau (2):
       dt-bindings: thermal: amlogic: describe bus clock for t7-thermal
       thermal/drivers/amlogic: Switch to clk_bulk API to support 
multiple clocks

Tudor Ambarus (3):
       dt-bindings: thermal: Add Google GS101 TMU
       thermal/drivers/samsung: Add Exynos ACPM TMU driver GS101
       MAINTAINERS: Add entry for Samsung Exynos ACPM thermal driver

Vitaliy Sochnev (5):
       thermal/drivers/airoha: Request the EN7581 IRQ after zone 
registration
       thermal/drivers/airoha: Fix AN7583 ADC mux field mapping
       thermal/drivers/airoha: Serialise access to the shared ADC
       dt-bindings: arm: airoha: Use one thermal sensor cell for AN7583
       thermal/drivers/airoha: Register a thermal zone per AN7583 sensor

Weigang He (2):
       thermal/drivers/ti-soc-thermal: Cancel pending alert work on remove
       thermal/drivers/sprd: validate the sensor id from the device tree

  .../bindings/arm/airoha,en7581-chip-scu.yaml       |   3 +-
  .../bindings/thermal/amlogic,thermal.yaml          |  29 +-
  .../bindings/thermal/google,gs101-tmu-top.yaml     |  69 +++
  .../bindings/thermal/qcom,pm8775-mbg-tm.yaml       |   7 +-
  .../devicetree/bindings/thermal/qcom-tsens.yaml    |   1 +
  .../bindings/thermal/renesas,r9a08g045-tsu.yaml    |   4 +-
  .../bindings/thermal/ti,omap-bandgap.yaml          | 177 ++++++
  .../devicetree/bindings/thermal/ti_soc_thermal.txt |  88 ---
  MAINTAINERS                                        |   8 +
  drivers/thermal/airoha_thermal.c                   | 179 ++++--
  drivers/thermal/amlogic_thermal.c                  |  14 +-
  drivers/thermal/gov_power_allocator.c              |  11 +-
  drivers/thermal/imx91_thermal.c                    |   2 +-
  drivers/thermal/qcom/qcom-spmi-temp-alarm.c        |   8 +-
  drivers/thermal/qcom/tsens-v1.c                    |  41 ++
  drivers/thermal/qcom/tsens-v2.c                    |   4 +-
  drivers/thermal/qcom/tsens.c                       |   3 +
  drivers/thermal/qcom/tsens.h                       |   2 +-
  drivers/thermal/renesas/rzg3e_thermal.c            |  45 +-
  drivers/thermal/renesas/rzg3s_thermal.c            |  38 +-
  drivers/thermal/samsung/Kconfig                    |  19 +
  drivers/thermal/samsung/Makefile                   |   2 +
  drivers/thermal/samsung/acpm-tmu.c                 | 651 
+++++++++++++++++++++
  drivers/thermal/sprd_thermal.c                     |   6 +
  drivers/thermal/thermal_fw.c                       |   8 +-
  drivers/thermal/thermal_of.c                       |  11 +-
  drivers/thermal/thermal_sysfs.c                    |  12 +-
  drivers/thermal/ti-soc-thermal/ti-bandgap.c        |  10 +-
  drivers/thermal/ti-soc-thermal/ti-thermal-common.c |   4 +
  tools/thermal/tmon/sysfs.c                         |   2 +-
  tools/thermal/tmon/tmon.c                          |   4 +-
  tools/thermal/tmon/tmon.h                          |   2 +-
  tools/thermal/tmon/tui.c                           |   2 +-
  33 files changed, 1262 insertions(+), 204 deletions(-)
  create mode 100644 
Documentation/devicetree/bindings/thermal/google,gs101-tmu-top.yaml
  create mode 100644 
Documentation/devicetree/bindings/thermal/ti,omap-bandgap.yaml
  delete mode 100644 
Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
  create mode 100644 drivers/thermal/samsung/acpm-tmu.c




             reply	other threads:[~2026-10-14 14:08 UTC|newest]

Thread overview: 3+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2026-10-14 14:08 Daniel Lezcano [this message]
2026-10-14 18:37 ` Rafael J. Wysocki (Intel)
  -- strict thread matches above, loose matches on Subject: below --
2026-10-14 14:08 Daniel Lezcano

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