* [GIT PULL] thermal drivers for v7.4-rc1
@ 2026-10-14 14:08 Daniel Lezcano
2026-10-14 18:37 ` Rafael J. Wysocki (Intel)
0 siblings, 1 reply; 3+ messages in thread
From: Daniel Lezcano @ 2026-10-14 14:08 UTC (permalink / raw)
To: Rafael J. Wysocki
Cc: Andy Shevchenko, Aryan Sinha, Bhargav Joshi, Biju Das,
Christophe JAILLET, Dhruvin Rajpura, Florian Fainelli,
Georgi Djakov, Hemanth Selam, Karl Mehltretter, liujing,
Markus Elfring, muzafferkadir, Ovidiu Panait, Pengpeng Hou,
Priyansh Jain, Rob Herring, Ronald Claveau, Tudor Ambarus,
Vitaliy Sochnev, Weigang He, Linux Kernel Mailing List,
Linux PM mailing list
Hi Rafael,
The following changes since commit cee9395acd8043be0644b25c34bfa86623f2b935:
Linux 7.3-rc1 (2026-08-30 13:34:40 -0700)
are available in the Git repository at:
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git
tags/thermal-v7.4-rc1
for you to fetch changes up to 2dc1f296b5754dd2441fc8b6613a362a47f6b98f:
thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
(2026-10-14 09:46:07 +0200)
----------------------------------------------------------------
- Add the Exynos ACPM thermal driver for Google GS101, along with
DT bindings and a MAINTAINERS entry (Tudor Ambarus)
- Add Renesas RZ/G3L thermal sensor support and DT bindings, and move
default calibration values to per-SoC match data (Biju Das)
- Add Qualcomm MSM8952 TSENS support and the corresponding DT binding
compatible (Muzaffer Kadir)
- Document the Qualcomm PMAU0102 Master BandGap temperature monitor
compatible in the DT bindings (Dhruvin Rajpura)
- Extend the QCom TSENS v2 trip temperature limits to the hardware
range of -204°C to +204°C to prevent interrupt storms when operating
beyond the previous software limits (Priyansh Jain)
- Fix temperature threshold map indexing in the QCom SPMI temperature
alarm driver to prevent out-of-bounds reads (Georgi Djakov)
- Describe the additional bus clock required by the Amlogic T7 thermal
sensor and switch the driver to the clk_bulk API to manage multiple
clocks (Ronald Claveau)
- Request the Airoha EN7581 IRQ after thermal zone registration to
prevent the interrupt handler from accessing an unregistered or
already freed thermal zone (Vitaliy Sochnev)
- Fix the Airoha AN7583 ADC mux field mapping, serialize access to the
shared ADC, and verify mux selection to avoid invalid temperature
readings and spurious critical shutdowns (Vitaliy Sochnev)
- Register separate thermal zones for the AN7583 bandgap, GbE and CPU
sensors, and update the DT bindings to use one thermal sensor cell
to select the sensor (Vitaliy Sochnev)
- Fix signed integer overflow in the Renesas RZ/G3E temperature-to-code
conversion, preserve compare interrupt state across runtime PM,
and prevent overlapping temperature conversions (Ovidiu Panait)
- Remove redundant trip window validation and runtime PM
pm_runtime_mark_last_busy() calls from the Renesas RZ/G3E driver
(Ovidiu Panait)
- Propagate reset assertion failures from Renesas RZ/G3E suspend and
attempt to restore power if the sensor was active (Pengpeng Hou)
- Stop the TI bandgap alert IRQ before removing sensor interfaces and
cancel pending alert work to prevent use-after-free on driver removal
(Weigang He)
- Validate Spreadtrum sensor IDs read from the device tree before using
them for register offsets and array indexing (Weigang He)
- Convert the TI OMAP bandgap DT bindings to schema and document the
DRA752 compatible and thermal sensor cells (Bhargav Joshi)
- Use DT property helpers matching the signed temperature and unsigned
hysteresis types defined by the thermal zone bindings (Rob Herring)
- Reuse common error handling code in the power allocator governor
bind callback (Markus Elfring)
- Constify the thermal zone device operations in the i.MX9 driver
(Christophe JAILLET)
- Fix kernel-doc parameter names and firmware node references in the
cooling device registration helpers (Aryan Sinha)
- Correct the documented return value of ti_bandgap_get_sensor_data()
to describe validation errors and potentially NULL stored data
(Karl Mehltretter)
- Ensure NUL-termination when copying the cooling device command-line
argument in tmon and fix the associated string truncation warning
(Florian Fainelli)
- Fix undefined behavior caused by a signed shift in the tmon thermal
zone binding display (Liu Jing)
- Fix wording in tmon comments (Hemanth Selam)
----------------------------------------------------------------
Andy Shevchenko (1):
thermal: sysfs: switch to use scnprintf() to suppress truncation
warning
Aryan Sinha (1):
thermal/fw: Fix kernel-doc parameter names
Bhargav Joshi (1):
dt-bindings: thermal: ti,omap-bandgap: Convert to DT schema
Biju Das (3):
dt-bindings: thermal: r9a08g045-tsu: Document RZ/G3L TSU
thermal/drivers/renesas/rzg3s: Convert calibration defaults to
per-SoC match data
thermal/drivers/renesas/rzg3s: Add RZ/G3L TSU support
Christophe JAILLET (1):
thermal/drivers/imx9: Constify struct thermal_zone_device_ops
Dhruvin Rajpura (1):
dt-bindings: thermal: qcom,pm8775-mbg-tm: Document PMAU0102
Florian Fainelli (1):
tools/thermal/tmon: Fix string truncation warning in optarg copy
Georgi Djakov (1):
thermal/drivers/qcom-spmi-temp-alarm: Fix temp_map indexing
Hemanth Selam (1):
tools/thermal: Fix typo "binded" in comments
Karl Mehltretter (1):
thermal: ti-soc-thermal: Fix the return value in
ti_bandgap_get_sensor_data() kernel-doc
Liu Jing (1):
tools/thermal/tmon: Fix signed shift UB in binding display
Markus Elfring (1):
thermal: gov_power_allocator: Use common error handling code in
power_allocator_bind()
Muzaffer Kadir (2):
dt-bindings: thermal: tsens: Add MSM8952
thermal/qcom/tsens: Add support for MSM8952 tsens
Ovidiu Panait (5):
drivers/thermal/renesas/rzg3e: Fix signed integer overflow in
temp_to_code()
thermal/drivers/renesas/rzg3e: Fix runtime PM handling of compare irq
thermal/drivers/renesas/rzg3e: Fix race between set_trips() and
get_temp()
thermal/drivers/renesas/rzg3e: Remove unneeded low/high check in
set_trips()
thermal/drivers/renesas/rzg3e: Remove redundant
pm_runtime_mark_last_busy() calls
Pengpeng Hou (1):
thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
Priyansh Jain (1):
thermal/drivers/qcom/tsens: Widen temperature limits to match
hardware range
Rob Herring (Arm) (1):
thermal: of: Match trip property helper types
Ronald Claveau (2):
dt-bindings: thermal: amlogic: describe bus clock for t7-thermal
thermal/drivers/amlogic: Switch to clk_bulk API to support
multiple clocks
Tudor Ambarus (3):
dt-bindings: thermal: Add Google GS101 TMU
thermal/drivers/samsung: Add Exynos ACPM TMU driver GS101
MAINTAINERS: Add entry for Samsung Exynos ACPM thermal driver
Vitaliy Sochnev (5):
thermal/drivers/airoha: Request the EN7581 IRQ after zone
registration
thermal/drivers/airoha: Fix AN7583 ADC mux field mapping
thermal/drivers/airoha: Serialise access to the shared ADC
dt-bindings: arm: airoha: Use one thermal sensor cell for AN7583
thermal/drivers/airoha: Register a thermal zone per AN7583 sensor
Weigang He (2):
thermal/drivers/ti-soc-thermal: Cancel pending alert work on remove
thermal/drivers/sprd: validate the sensor id from the device tree
.../bindings/arm/airoha,en7581-chip-scu.yaml | 3 +-
.../bindings/thermal/amlogic,thermal.yaml | 29 +-
.../bindings/thermal/google,gs101-tmu-top.yaml | 69 +++
.../bindings/thermal/qcom,pm8775-mbg-tm.yaml | 7 +-
.../devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
.../bindings/thermal/renesas,r9a08g045-tsu.yaml | 4 +-
.../bindings/thermal/ti,omap-bandgap.yaml | 177 ++++++
.../devicetree/bindings/thermal/ti_soc_thermal.txt | 88 ---
MAINTAINERS | 8 +
drivers/thermal/airoha_thermal.c | 179 ++++--
drivers/thermal/amlogic_thermal.c | 14 +-
drivers/thermal/gov_power_allocator.c | 11 +-
drivers/thermal/imx91_thermal.c | 2 +-
drivers/thermal/qcom/qcom-spmi-temp-alarm.c | 8 +-
drivers/thermal/qcom/tsens-v1.c | 41 ++
drivers/thermal/qcom/tsens-v2.c | 4 +-
drivers/thermal/qcom/tsens.c | 3 +
drivers/thermal/qcom/tsens.h | 2 +-
drivers/thermal/renesas/rzg3e_thermal.c | 45 +-
drivers/thermal/renesas/rzg3s_thermal.c | 38 +-
drivers/thermal/samsung/Kconfig | 19 +
drivers/thermal/samsung/Makefile | 2 +
drivers/thermal/samsung/acpm-tmu.c | 651
+++++++++++++++++++++
drivers/thermal/sprd_thermal.c | 6 +
drivers/thermal/thermal_fw.c | 8 +-
drivers/thermal/thermal_of.c | 11 +-
drivers/thermal/thermal_sysfs.c | 12 +-
drivers/thermal/ti-soc-thermal/ti-bandgap.c | 10 +-
drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 4 +
tools/thermal/tmon/sysfs.c | 2 +-
tools/thermal/tmon/tmon.c | 4 +-
tools/thermal/tmon/tmon.h | 2 +-
tools/thermal/tmon/tui.c | 2 +-
33 files changed, 1262 insertions(+), 204 deletions(-)
create mode 100644
Documentation/devicetree/bindings/thermal/google,gs101-tmu-top.yaml
create mode 100644
Documentation/devicetree/bindings/thermal/ti,omap-bandgap.yaml
delete mode 100644
Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
create mode 100644 drivers/thermal/samsung/acpm-tmu.c
^ permalink raw reply [flat|nested] 3+ messages in thread* Re: [GIT PULL] thermal drivers for v7.4-rc1
2026-10-14 14:08 [GIT PULL] thermal drivers for v7.4-rc1 Daniel Lezcano
@ 2026-10-14 18:37 ` Rafael J. Wysocki (Intel)
0 siblings, 0 replies; 3+ messages in thread
From: Rafael J. Wysocki (Intel) @ 2026-10-14 18:37 UTC (permalink / raw)
To: Daniel Lezcano
Cc: Rafael J. Wysocki, Andy Shevchenko, Aryan Sinha, Bhargav Joshi,
Biju Das, Christophe JAILLET, Dhruvin Rajpura, Florian Fainelli,
Georgi Djakov, Hemanth Selam, Karl Mehltretter, liujing,
Markus Elfring, muzafferkadir, Ovidiu Panait, Pengpeng Hou,
Priyansh Jain, Rob Herring, Ronald Claveau, Tudor Ambarus,
Vitaliy Sochnev, Weigang He, Linux Kernel Mailing List,
Linux PM mailing list
Hi Daniel,
On Wed, Oct 14, 2026 at 4:08 PM Daniel Lezcano
<daniel.lezcano@oss.qualcomm.com> wrote:
>
>
> Hi Rafael,
>
>
> The following changes since commit cee9395acd8043be0644b25c34bfa86623f2b935:
>
> Linux 7.3-rc1 (2026-08-30 13:34:40 -0700)
>
> are available in the Git repository at:
>
> git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git
> tags/thermal-v7.4-rc1
>
> for you to fetch changes up to 2dc1f296b5754dd2441fc8b6613a362a47f6b98f:
>
> thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
> (2026-10-14 09:46:07 +0200)
>
> ----------------------------------------------------------------
> - Add the Exynos ACPM thermal driver for Google GS101, along with
> DT bindings and a MAINTAINERS entry (Tudor Ambarus)
>
> - Add Renesas RZ/G3L thermal sensor support and DT bindings, and move
> default calibration values to per-SoC match data (Biju Das)
>
> - Add Qualcomm MSM8952 TSENS support and the corresponding DT binding
> compatible (Muzaffer Kadir)
>
> - Document the Qualcomm PMAU0102 Master BandGap temperature monitor
> compatible in the DT bindings (Dhruvin Rajpura)
>
> - Extend the QCom TSENS v2 trip temperature limits to the hardware
> range of -204°C to +204°C to prevent interrupt storms when operating
> beyond the previous software limits (Priyansh Jain)
>
> - Fix temperature threshold map indexing in the QCom SPMI temperature
> alarm driver to prevent out-of-bounds reads (Georgi Djakov)
>
> - Describe the additional bus clock required by the Amlogic T7 thermal
> sensor and switch the driver to the clk_bulk API to manage multiple
> clocks (Ronald Claveau)
>
> - Request the Airoha EN7581 IRQ after thermal zone registration to
> prevent the interrupt handler from accessing an unregistered or
> already freed thermal zone (Vitaliy Sochnev)
>
> - Fix the Airoha AN7583 ADC mux field mapping, serialize access to the
> shared ADC, and verify mux selection to avoid invalid temperature
> readings and spurious critical shutdowns (Vitaliy Sochnev)
>
> - Register separate thermal zones for the AN7583 bandgap, GbE and CPU
> sensors, and update the DT bindings to use one thermal sensor cell
> to select the sensor (Vitaliy Sochnev)
>
> - Fix signed integer overflow in the Renesas RZ/G3E temperature-to-code
> conversion, preserve compare interrupt state across runtime PM,
> and prevent overlapping temperature conversions (Ovidiu Panait)
>
> - Remove redundant trip window validation and runtime PM
> pm_runtime_mark_last_busy() calls from the Renesas RZ/G3E driver
> (Ovidiu Panait)
>
> - Propagate reset assertion failures from Renesas RZ/G3E suspend and
> attempt to restore power if the sensor was active (Pengpeng Hou)
>
> - Stop the TI bandgap alert IRQ before removing sensor interfaces and
> cancel pending alert work to prevent use-after-free on driver removal
> (Weigang He)
>
> - Validate Spreadtrum sensor IDs read from the device tree before using
> them for register offsets and array indexing (Weigang He)
>
> - Convert the TI OMAP bandgap DT bindings to schema and document the
> DRA752 compatible and thermal sensor cells (Bhargav Joshi)
>
> - Use DT property helpers matching the signed temperature and unsigned
> hysteresis types defined by the thermal zone bindings (Rob Herring)
>
> - Reuse common error handling code in the power allocator governor
> bind callback (Markus Elfring)
>
> - Constify the thermal zone device operations in the i.MX9 driver
> (Christophe JAILLET)
>
> - Fix kernel-doc parameter names and firmware node references in the
> cooling device registration helpers (Aryan Sinha)
>
> - Correct the documented return value of ti_bandgap_get_sensor_data()
> to describe validation errors and potentially NULL stored data
> (Karl Mehltretter)
>
> - Ensure NUL-termination when copying the cooling device command-line
> argument in tmon and fix the associated string truncation warning
> (Florian Fainelli)
>
> - Fix undefined behavior caused by a signed shift in the tmon thermal
> zone binding display (Liu Jing)
>
> - Fix wording in tmon comments (Hemanth Selam)
>
> ----------------------------------------------------------------
> Andy Shevchenko (1):
> thermal: sysfs: switch to use scnprintf() to suppress truncation
> warning
>
> Aryan Sinha (1):
> thermal/fw: Fix kernel-doc parameter names
>
> Bhargav Joshi (1):
> dt-bindings: thermal: ti,omap-bandgap: Convert to DT schema
>
> Biju Das (3):
> dt-bindings: thermal: r9a08g045-tsu: Document RZ/G3L TSU
> thermal/drivers/renesas/rzg3s: Convert calibration defaults to
> per-SoC match data
> thermal/drivers/renesas/rzg3s: Add RZ/G3L TSU support
>
> Christophe JAILLET (1):
> thermal/drivers/imx9: Constify struct thermal_zone_device_ops
>
> Dhruvin Rajpura (1):
> dt-bindings: thermal: qcom,pm8775-mbg-tm: Document PMAU0102
>
> Florian Fainelli (1):
> tools/thermal/tmon: Fix string truncation warning in optarg copy
>
> Georgi Djakov (1):
> thermal/drivers/qcom-spmi-temp-alarm: Fix temp_map indexing
>
> Hemanth Selam (1):
> tools/thermal: Fix typo "binded" in comments
>
> Karl Mehltretter (1):
> thermal: ti-soc-thermal: Fix the return value in
> ti_bandgap_get_sensor_data() kernel-doc
>
> Liu Jing (1):
> tools/thermal/tmon: Fix signed shift UB in binding display
>
> Markus Elfring (1):
> thermal: gov_power_allocator: Use common error handling code in
> power_allocator_bind()
>
> Muzaffer Kadir (2):
> dt-bindings: thermal: tsens: Add MSM8952
> thermal/qcom/tsens: Add support for MSM8952 tsens
>
> Ovidiu Panait (5):
> drivers/thermal/renesas/rzg3e: Fix signed integer overflow in
> temp_to_code()
> thermal/drivers/renesas/rzg3e: Fix runtime PM handling of compare irq
> thermal/drivers/renesas/rzg3e: Fix race between set_trips() and
> get_temp()
> thermal/drivers/renesas/rzg3e: Remove unneeded low/high check in
> set_trips()
> thermal/drivers/renesas/rzg3e: Remove redundant
> pm_runtime_mark_last_busy() calls
>
> Pengpeng Hou (1):
> thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
>
> Priyansh Jain (1):
> thermal/drivers/qcom/tsens: Widen temperature limits to match
> hardware range
>
> Rob Herring (Arm) (1):
> thermal: of: Match trip property helper types
>
> Ronald Claveau (2):
> dt-bindings: thermal: amlogic: describe bus clock for t7-thermal
> thermal/drivers/amlogic: Switch to clk_bulk API to support
> multiple clocks
>
> Tudor Ambarus (3):
> dt-bindings: thermal: Add Google GS101 TMU
> thermal/drivers/samsung: Add Exynos ACPM TMU driver GS101
> MAINTAINERS: Add entry for Samsung Exynos ACPM thermal driver
>
> Vitaliy Sochnev (5):
> thermal/drivers/airoha: Request the EN7581 IRQ after zone
> registration
> thermal/drivers/airoha: Fix AN7583 ADC mux field mapping
> thermal/drivers/airoha: Serialise access to the shared ADC
> dt-bindings: arm: airoha: Use one thermal sensor cell for AN7583
> thermal/drivers/airoha: Register a thermal zone per AN7583 sensor
>
> Weigang He (2):
> thermal/drivers/ti-soc-thermal: Cancel pending alert work on remove
> thermal/drivers/sprd: validate the sensor id from the device tree
>
> .../bindings/arm/airoha,en7581-chip-scu.yaml | 3 +-
> .../bindings/thermal/amlogic,thermal.yaml | 29 +-
> .../bindings/thermal/google,gs101-tmu-top.yaml | 69 +++
> .../bindings/thermal/qcom,pm8775-mbg-tm.yaml | 7 +-
> .../devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
> .../bindings/thermal/renesas,r9a08g045-tsu.yaml | 4 +-
> .../bindings/thermal/ti,omap-bandgap.yaml | 177 ++++++
> .../devicetree/bindings/thermal/ti_soc_thermal.txt | 88 ---
> MAINTAINERS | 8 +
> drivers/thermal/airoha_thermal.c | 179 ++++--
> drivers/thermal/amlogic_thermal.c | 14 +-
> drivers/thermal/gov_power_allocator.c | 11 +-
> drivers/thermal/imx91_thermal.c | 2 +-
> drivers/thermal/qcom/qcom-spmi-temp-alarm.c | 8 +-
> drivers/thermal/qcom/tsens-v1.c | 41 ++
> drivers/thermal/qcom/tsens-v2.c | 4 +-
> drivers/thermal/qcom/tsens.c | 3 +
> drivers/thermal/qcom/tsens.h | 2 +-
> drivers/thermal/renesas/rzg3e_thermal.c | 45 +-
> drivers/thermal/renesas/rzg3s_thermal.c | 38 +-
> drivers/thermal/samsung/Kconfig | 19 +
> drivers/thermal/samsung/Makefile | 2 +
> drivers/thermal/samsung/acpm-tmu.c | 651
> +++++++++++++++++++++
> drivers/thermal/sprd_thermal.c | 6 +
> drivers/thermal/thermal_fw.c | 8 +-
> drivers/thermal/thermal_of.c | 11 +-
> drivers/thermal/thermal_sysfs.c | 12 +-
> drivers/thermal/ti-soc-thermal/ti-bandgap.c | 10 +-
> drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 4 +
> tools/thermal/tmon/sysfs.c | 2 +-
> tools/thermal/tmon/tmon.c | 4 +-
> tools/thermal/tmon/tmon.h | 2 +-
> tools/thermal/tmon/tui.c | 2 +-
> 33 files changed, 1262 insertions(+), 204 deletions(-)
> create mode 100644
> Documentation/devicetree/bindings/thermal/google,gs101-tmu-top.yaml
> create mode 100644
> Documentation/devicetree/bindings/thermal/ti,omap-bandgap.yaml
> delete mode 100644
> Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
> create mode 100644 drivers/thermal/samsung/acpm-tmu.c
Pulled and added to linux-pm.git/linux-next, thanks!
^ permalink raw reply [flat|nested] 3+ messages in thread
* [GIT PULL] thermal drivers for v7.4-rc1
@ 2026-10-14 14:08 Daniel Lezcano
0 siblings, 0 replies; 3+ messages in thread
From: Daniel Lezcano @ 2026-10-14 14:08 UTC (permalink / raw)
To: Rafael J. Wysocki
Cc: Andy Shevchenko, Aryan Sinha, Bhargav Joshi, Biju Das,
Christophe JAILLET, Dhruvin Rajpura, Florian Fainelli,
Georgi Djakov, Hemanth Selam, Karl Mehltretter, liujing,
Markus Elfring, muzafferkadir, Ovidiu Panait, Pengpeng Hou,
Priyansh Jain, Rob Herring, Ronald Claveau, Tudor Ambarus,
Vitaliy Sochnev, Weigang He, Linux Kernel Mailing List,
Linux PM mailing list
Hi Rafael,
The following changes since commit cee9395acd8043be0644b25c34bfa86623f2b935:
Linux 7.3-rc1 (2026-08-30 13:34:40 -0700)
are available in the Git repository at:
git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git
tags/thermal-v7.4-rc1
for you to fetch changes up to 2dc1f296b5754dd2441fc8b6613a362a47f6b98f:
thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
(2026-10-14 09:46:07 +0200)
----------------------------------------------------------------
- Add the Exynos ACPM thermal driver for Google GS101, along with
DT bindings and a MAINTAINERS entry (Tudor Ambarus)
- Add Renesas RZ/G3L thermal sensor support and DT bindings, and move
default calibration values to per-SoC match data (Biju Das)
- Add Qualcomm MSM8952 TSENS support and the corresponding DT binding
compatible (Muzaffer Kadir)
- Document the Qualcomm PMAU0102 Master BandGap temperature monitor
compatible in the DT bindings (Dhruvin Rajpura)
- Extend the QCom TSENS v2 trip temperature limits to the hardware
range of -204°C to +204°C to prevent interrupt storms when operating
beyond the previous software limits (Priyansh Jain)
- Fix temperature threshold map indexing in the QCom SPMI temperature
alarm driver to prevent out-of-bounds reads (Georgi Djakov)
- Describe the additional bus clock required by the Amlogic T7 thermal
sensor and switch the driver to the clk_bulk API to manage multiple
clocks (Ronald Claveau)
- Request the Airoha EN7581 IRQ after thermal zone registration to
prevent the interrupt handler from accessing an unregistered or
already freed thermal zone (Vitaliy Sochnev)
- Fix the Airoha AN7583 ADC mux field mapping, serialize access to the
shared ADC, and verify mux selection to avoid invalid temperature
readings and spurious critical shutdowns (Vitaliy Sochnev)
- Register separate thermal zones for the AN7583 bandgap, GbE and CPU
sensors, and update the DT bindings to use one thermal sensor cell
to select the sensor (Vitaliy Sochnev)
- Fix signed integer overflow in the Renesas RZ/G3E temperature-to-code
conversion, preserve compare interrupt state across runtime PM,
and prevent overlapping temperature conversions (Ovidiu Panait)
- Remove redundant trip window validation and runtime PM
pm_runtime_mark_last_busy() calls from the Renesas RZ/G3E driver
(Ovidiu Panait)
- Propagate reset assertion failures from Renesas RZ/G3E suspend and
attempt to restore power if the sensor was active (Pengpeng Hou)
- Stop the TI bandgap alert IRQ before removing sensor interfaces and
cancel pending alert work to prevent use-after-free on driver removal
(Weigang He)
- Validate Spreadtrum sensor IDs read from the device tree before using
them for register offsets and array indexing (Weigang He)
- Convert the TI OMAP bandgap DT bindings to schema and document the
DRA752 compatible and thermal sensor cells (Bhargav Joshi)
- Use DT property helpers matching the signed temperature and unsigned
hysteresis types defined by the thermal zone bindings (Rob Herring)
- Reuse common error handling code in the power allocator governor
bind callback (Markus Elfring)
- Constify the thermal zone device operations in the i.MX9 driver
(Christophe JAILLET)
- Fix kernel-doc parameter names and firmware node references in the
cooling device registration helpers (Aryan Sinha)
- Correct the documented return value of ti_bandgap_get_sensor_data()
to describe validation errors and potentially NULL stored data
(Karl Mehltretter)
- Ensure NUL-termination when copying the cooling device command-line
argument in tmon and fix the associated string truncation warning
(Florian Fainelli)
- Fix undefined behavior caused by a signed shift in the tmon thermal
zone binding display (Liu Jing)
- Fix wording in tmon comments (Hemanth Selam)
----------------------------------------------------------------
Andy Shevchenko (1):
thermal: sysfs: switch to use scnprintf() to suppress truncation
warning
Aryan Sinha (1):
thermal/fw: Fix kernel-doc parameter names
Bhargav Joshi (1):
dt-bindings: thermal: ti,omap-bandgap: Convert to DT schema
Biju Das (3):
dt-bindings: thermal: r9a08g045-tsu: Document RZ/G3L TSU
thermal/drivers/renesas/rzg3s: Convert calibration defaults to
per-SoC match data
thermal/drivers/renesas/rzg3s: Add RZ/G3L TSU support
Christophe JAILLET (1):
thermal/drivers/imx9: Constify struct thermal_zone_device_ops
Dhruvin Rajpura (1):
dt-bindings: thermal: qcom,pm8775-mbg-tm: Document PMAU0102
Florian Fainelli (1):
tools/thermal/tmon: Fix string truncation warning in optarg copy
Georgi Djakov (1):
thermal/drivers/qcom-spmi-temp-alarm: Fix temp_map indexing
Hemanth Selam (1):
tools/thermal: Fix typo "binded" in comments
Karl Mehltretter (1):
thermal: ti-soc-thermal: Fix the return value in
ti_bandgap_get_sensor_data() kernel-doc
Liu Jing (1):
tools/thermal/tmon: Fix signed shift UB in binding display
Markus Elfring (1):
thermal: gov_power_allocator: Use common error handling code in
power_allocator_bind()
Muzaffer Kadir (2):
dt-bindings: thermal: tsens: Add MSM8952
thermal/qcom/tsens: Add support for MSM8952 tsens
Ovidiu Panait (5):
drivers/thermal/renesas/rzg3e: Fix signed integer overflow in
temp_to_code()
thermal/drivers/renesas/rzg3e: Fix runtime PM handling of compare irq
thermal/drivers/renesas/rzg3e: Fix race between set_trips() and
get_temp()
thermal/drivers/renesas/rzg3e: Remove unneeded low/high check in
set_trips()
thermal/drivers/renesas/rzg3e: Remove redundant
pm_runtime_mark_last_busy() calls
Pengpeng Hou (1):
thermal/drivers/rzg3e: Propagate reset assertion failure from suspend
Priyansh Jain (1):
thermal/drivers/qcom/tsens: Widen temperature limits to match
hardware range
Rob Herring (Arm) (1):
thermal: of: Match trip property helper types
Ronald Claveau (2):
dt-bindings: thermal: amlogic: describe bus clock for t7-thermal
thermal/drivers/amlogic: Switch to clk_bulk API to support
multiple clocks
Tudor Ambarus (3):
dt-bindings: thermal: Add Google GS101 TMU
thermal/drivers/samsung: Add Exynos ACPM TMU driver GS101
MAINTAINERS: Add entry for Samsung Exynos ACPM thermal driver
Vitaliy Sochnev (5):
thermal/drivers/airoha: Request the EN7581 IRQ after zone
registration
thermal/drivers/airoha: Fix AN7583 ADC mux field mapping
thermal/drivers/airoha: Serialise access to the shared ADC
dt-bindings: arm: airoha: Use one thermal sensor cell for AN7583
thermal/drivers/airoha: Register a thermal zone per AN7583 sensor
Weigang He (2):
thermal/drivers/ti-soc-thermal: Cancel pending alert work on remove
thermal/drivers/sprd: validate the sensor id from the device tree
.../bindings/arm/airoha,en7581-chip-scu.yaml | 3 +-
.../bindings/thermal/amlogic,thermal.yaml | 29 +-
.../bindings/thermal/google,gs101-tmu-top.yaml | 69 +++
.../bindings/thermal/qcom,pm8775-mbg-tm.yaml | 7 +-
.../devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
.../bindings/thermal/renesas,r9a08g045-tsu.yaml | 4 +-
.../bindings/thermal/ti,omap-bandgap.yaml | 177 ++++++
.../devicetree/bindings/thermal/ti_soc_thermal.txt | 88 ---
MAINTAINERS | 8 +
drivers/thermal/airoha_thermal.c | 179 ++++--
drivers/thermal/amlogic_thermal.c | 14 +-
drivers/thermal/gov_power_allocator.c | 11 +-
drivers/thermal/imx91_thermal.c | 2 +-
drivers/thermal/qcom/qcom-spmi-temp-alarm.c | 8 +-
drivers/thermal/qcom/tsens-v1.c | 41 ++
drivers/thermal/qcom/tsens-v2.c | 4 +-
drivers/thermal/qcom/tsens.c | 3 +
drivers/thermal/qcom/tsens.h | 2 +-
drivers/thermal/renesas/rzg3e_thermal.c | 45 +-
drivers/thermal/renesas/rzg3s_thermal.c | 38 +-
drivers/thermal/samsung/Kconfig | 19 +
drivers/thermal/samsung/Makefile | 2 +
drivers/thermal/samsung/acpm-tmu.c | 651
+++++++++++++++++++++
drivers/thermal/sprd_thermal.c | 6 +
drivers/thermal/thermal_fw.c | 8 +-
drivers/thermal/thermal_of.c | 11 +-
drivers/thermal/thermal_sysfs.c | 12 +-
drivers/thermal/ti-soc-thermal/ti-bandgap.c | 10 +-
drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 4 +
tools/thermal/tmon/sysfs.c | 2 +-
tools/thermal/tmon/tmon.c | 4 +-
tools/thermal/tmon/tmon.h | 2 +-
tools/thermal/tmon/tui.c | 2 +-
33 files changed, 1262 insertions(+), 204 deletions(-)
create mode 100644
Documentation/devicetree/bindings/thermal/google,gs101-tmu-top.yaml
create mode 100644
Documentation/devicetree/bindings/thermal/ti,omap-bandgap.yaml
delete mode 100644
Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
create mode 100644 drivers/thermal/samsung/acpm-tmu.c
^ permalink raw reply [flat|nested] 3+ messages in thread
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2026-10-14 14:08 [GIT PULL] thermal drivers for v7.4-rc1 Daniel Lezcano
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2026-10-14 14:08 Daniel Lezcano
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