[GIT PULL] thermal drivers fixes for v7.3-rc1

[GIT PULL] thermal drivers fixes for v7.3-rc1

[Daniel Lezcano]

Hi Rafael,

please consider the following changes since commit 
55c16e15ff9f91bc994a20124b83faf27f0e3690:

   thermal/drivers: Remove redundant error messages on IRQ request 
failure (2026-08-07 17:27:28 +0200)

are available in the Git repository at:

  
ssh://git@gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git 
tags/thermal-v7.3-rc1-fixes

for you to fetch changes up to 22114b21259b3656019cc0cb3214618f5eb278dd:

   thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header 
(2026-08-11 12:43:45 +0200)

----------------------------------------------------------------
- Fix missing bitfield include headers in Armada and QCom SPM BMG
   drivers (Daniel Lezcano)

- Fix missed file when manually applying a change after a conflict
   resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)

----------------------------------------------------------------
Daniel Lezcano (3):
       thermal/drivers/qcom: Fix missing spmi adc tm5 gen3 file
       thermal/drivers/armada: Fix missing bitfields include
       thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header

  drivers/thermal/armada_thermal.c              |   1 +
  drivers/thermal/qcom/qcom-spmi-adc-tm5-gen3.c | 434 
++++++++++++++++++++++++++
  drivers/thermal/qcom/qcom-spmi-mbg-tm.c       |   2 +-
  3 files changed, 436 insertions(+), 1 deletion(-)
  create mode 100644 drivers/thermal/qcom/qcom-spmi-adc-tm5-gen3.c

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Daniel Lezcano]

Hi Rafael,

please ignore this PR because there is a missing SoB.

I'll fix it and meanwhile update the linux-next branch so it will fix 
the build issue.

On 8/11/26 12:54, Daniel Lezcano wrote:
> Hi Rafael,
> 
> please consider the following changes since commit 
> 55c16e15ff9f91bc994a20124b83faf27f0e3690:
> 
>    thermal/drivers: Remove redundant error messages on IRQ request 
> failure (2026-08-07 17:27:28 +0200)
> 
> are available in the Git repository at:
> 
> 
> ssh://git@gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git 
> tags/thermal-v7.3-rc1-fixes
> 
> for you to fetch changes up to 22114b21259b3656019cc0cb3214618f5eb278dd:
> 
>    thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header 
> (2026-08-11 12:43:45 +0200)
> 
> ----------------------------------------------------------------
> - Fix missing bitfield include headers in Armada and QCom SPM BMG
>    drivers (Daniel Lezcano)
> 
> - Fix missed file when manually applying a change after a conflict
>    resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)
> 
> ----------------------------------------------------------------
> Daniel Lezcano (3):
>        thermal/drivers/qcom: Fix missing spmi adc tm5 gen3 file
>        thermal/drivers/armada: Fix missing bitfields include
>        thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header
> 
>   drivers/thermal/armada_thermal.c              |   1 +
>   drivers/thermal/qcom/qcom-spmi-adc-tm5-gen3.c | 434 ++++++++++++++++++ 
> ++++++++
>   drivers/thermal/qcom/qcom-spmi-mbg-tm.c       |   2 +-
>   3 files changed, 436 insertions(+), 1 deletion(-)
>   create mode 100644 drivers/thermal/qcom/qcom-spmi-adc-tm5-gen3.c

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Rafael J. Wysocki (Intel)]

Hi Daniel,

On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
<daniel.lezcano@oss.qualcomm.com> wrote:
>
>
> Hi Rafael,
>
> please ignore this PR because there is a missing SoB.
>
> I'll fix it and meanwhile update the linux-next branch so it will fix
> the build issue.

Well, the build issue is still there in my thermal branch though.

I've now remerged my linux-next branch to avoid exposing the thermal
drivers merge I did previously and I'll wait for another PR from you.
Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
thermal PR.

Thanks!

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Daniel Lezcano]

On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
> Hi Daniel,
> 
> On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
> <daniel.lezcano@oss.qualcomm.com> wrote:
>>
>>
>> Hi Rafael,
>>
>> please ignore this PR because there is a missing SoB.
>>
>> I'll fix it and meanwhile update the linux-next branch so it will fix
>> the build issue.
> 
> Well, the build issue is still there in my thermal branch though.
> 
> I've now remerged my linux-next branch to avoid exposing the thermal
> drivers merge I did previously and I'll wait for another PR from you.

Ok, thanks

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Daniel Lezcano]

On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
> Hi Daniel,
> 
> On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
> <daniel.lezcano@oss.qualcomm.com> wrote:
>>
>>
>> Hi Rafael,
>>
>> please ignore this PR because there is a missing SoB.
>>
>> I'll fix it and meanwhile update the linux-next branch so it will fix
>> the build issue.
> 
> Well, the build issue is still there in my thermal branch though.
> 
> I've now remerged my linux-next branch to avoid exposing the thermal
> drivers merge I did previously and I'll wait for another PR from you.
> Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
> thermal PR.
There are 3 fixes on top of the PR.

One is obviously to be folded with the existing series as it is my fault 
I forgot to add the file after fixing a conflict [1] which led to the 
linux-next build failure.

But two were reported by lkp [2][3]. May I take the opportunity to fold 
them with the patches they fix and shall I keep them as is ?

[1] 
https://lore.kernel.org/all/20260811145427.3089426-1-daniel.lezcano@kernel.org/

[2] 
https://lore.kernel.org/all/20260811094935.2941313-1-daniel.lezcano@kernel.org/

[3] 
https://lore.kernel.org/all/20260811094747.2940616-1-daniel.lezcano@kernel.org/

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Rafael J. Wysocki (Intel)]

On Wed, Aug 12, 2026 at 2:43 PM Daniel Lezcano
<daniel.lezcano@oss.qualcomm.com> wrote:
>
> On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
> > Hi Daniel,
> >
> > On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
> > <daniel.lezcano@oss.qualcomm.com> wrote:
> >>
> >>
> >> Hi Rafael,
> >>
> >> please ignore this PR because there is a missing SoB.
> >>
> >> I'll fix it and meanwhile update the linux-next branch so it will fix
> >> the build issue.
> >
> > Well, the build issue is still there in my thermal branch though.
> >
> > I've now remerged my linux-next branch to avoid exposing the thermal
> > drivers merge I did previously and I'll wait for another PR from you.
> > Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
> > thermal PR.
> There are 3 fixes on top of the PR.
>
> One is obviously to be folded with the existing series as it is my fault
> I forgot to add the file after fixing a conflict [1] which led to the
> linux-next build failure.
>
> But two were reported by lkp [2][3]. May I take the opportunity to fold
> them with the patches they fix and shall I keep them as is ?
>
> [1]
> https://lore.kernel.org/all/20260811145427.3089426-1-daniel.lezcano@kernel.org/
>
> [2]
> https://lore.kernel.org/all/20260811094935.2941313-1-daniel.lezcano@kernel.org/
>
> [3]
> https://lore.kernel.org/all/20260811094747.2940616-1-daniel.lezcano@kernel.org/

At this point it's better to do additional fix commits on top of the
previous material as it has all been exposed in my thermal branch for
which there are no history rewrites.

Please send me a PR with all of the fixes on top of the current HEAD
of my thermal branch.

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Daniel Lezcano]

On 8/12/26 14:50, Rafael J. Wysocki (Intel) wrote:
> On Wed, Aug 12, 2026 at 2:43 PM Daniel Lezcano
> <daniel.lezcano@oss.qualcomm.com> wrote:
>>
>> On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
>>> Hi Daniel,
>>>
>>> On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
>>> <daniel.lezcano@oss.qualcomm.com> wrote:
>>>>
>>>>
>>>> Hi Rafael,
>>>>
>>>> please ignore this PR because there is a missing SoB.
>>>>
>>>> I'll fix it and meanwhile update the linux-next branch so it will fix
>>>> the build issue.
>>>
>>> Well, the build issue is still there in my thermal branch though.
>>>
>>> I've now remerged my linux-next branch to avoid exposing the thermal
>>> drivers merge I did previously and I'll wait for another PR from you.
>>> Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
>>> thermal PR.
>> There are 3 fixes on top of the PR.
>>
>> One is obviously to be folded with the existing series as it is my fault
>> I forgot to add the file after fixing a conflict [1] which led to the
>> linux-next build failure.
>>
>> But two were reported by lkp [2][3]. May I take the opportunity to fold
>> them with the patches they fix and shall I keep them as is ?
>>
>> [1]
>> https://lore.kernel.org/all/20260811145427.3089426-1-daniel.lezcano@kernel.org/
>>
>> [2]
>> https://lore.kernel.org/all/20260811094935.2941313-1-daniel.lezcano@kernel.org/
>>
>> [3]
>> https://lore.kernel.org/all/20260811094747.2940616-1-daniel.lezcano@kernel.org/
> 
> At this point it's better to do additional fix commits on top of the
> previous material as it has all been exposed in my thermal branch for
> which there are no history rewrites.
> 
> Please send me a PR with all of the fixes on top of the current HEAD
> of my thermal branch.

Do you mean linux-pm/thermal ?

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Rafael J. Wysocki (Intel)]

On Wed, Aug 12, 2026 at 5:16 PM Daniel Lezcano
<daniel.lezcano@oss.qualcomm.com> wrote:
>
> On 8/12/26 14:50, Rafael J. Wysocki (Intel) wrote:
> > On Wed, Aug 12, 2026 at 2:43 PM Daniel Lezcano
> > <daniel.lezcano@oss.qualcomm.com> wrote:
> >>
> >> On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
> >>> Hi Daniel,
> >>>
> >>> On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
> >>> <daniel.lezcano@oss.qualcomm.com> wrote:
> >>>>
> >>>>
> >>>> Hi Rafael,
> >>>>
> >>>> please ignore this PR because there is a missing SoB.
> >>>>
> >>>> I'll fix it and meanwhile update the linux-next branch so it will fix
> >>>> the build issue.
> >>>
> >>> Well, the build issue is still there in my thermal branch though.
> >>>
> >>> I've now remerged my linux-next branch to avoid exposing the thermal
> >>> drivers merge I did previously and I'll wait for another PR from you.
> >>> Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
> >>> thermal PR.
> >> There are 3 fixes on top of the PR.
> >>
> >> One is obviously to be folded with the existing series as it is my fault
> >> I forgot to add the file after fixing a conflict [1] which led to the
> >> linux-next build failure.
> >>
> >> But two were reported by lkp [2][3]. May I take the opportunity to fold
> >> them with the patches they fix and shall I keep them as is ?
> >>
> >> [1]
> >> https://lore.kernel.org/all/20260811145427.3089426-1-daniel.lezcano@kernel.org/
> >>
> >> [2]
> >> https://lore.kernel.org/all/20260811094935.2941313-1-daniel.lezcano@kernel.org/
> >>
> >> [3]
> >> https://lore.kernel.org/all/20260811094747.2940616-1-daniel.lezcano@kernel.org/
> >
> > At this point it's better to do additional fix commits on top of the
> > previous material as it has all been exposed in my thermal branch for
> > which there are no history rewrites.
> >
> > Please send me a PR with all of the fixes on top of the current HEAD
> > of my thermal branch.
>
> Do you mean linux-pm/thermal ?

Yes, that one.

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Daniel Lezcano]

On 8/12/26 18:04, Rafael J. Wysocki (Intel) wrote:
> On Wed, Aug 12, 2026 at 5:16 PM Daniel Lezcano
> <daniel.lezcano@oss.qualcomm.com> wrote:
>>
>> On 8/12/26 14:50, Rafael J. Wysocki (Intel) wrote:
>>> On Wed, Aug 12, 2026 at 2:43 PM Daniel Lezcano
>>> <daniel.lezcano@oss.qualcomm.com> wrote:
>>>>
>>>> On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
>>>>> Hi Daniel,
>>>>>
>>>>> On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
>>>>> <daniel.lezcano@oss.qualcomm.com> wrote:
>>>>>>
>>>>>>
>>>>>> Hi Rafael,
>>>>>>
>>>>>> please ignore this PR because there is a missing SoB.
>>>>>>
>>>>>> I'll fix it and meanwhile update the linux-next branch so it will fix
>>>>>> the build issue.
>>>>>
>>>>> Well, the build issue is still there in my thermal branch though.
>>>>>
>>>>> I've now remerged my linux-next branch to avoid exposing the thermal
>>>>> drivers merge I did previously and I'll wait for another PR from you.
>>>>> Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
>>>>> thermal PR.
>>>> There are 3 fixes on top of the PR.
>>>>
>>>> One is obviously to be folded with the existing series as it is my fault
>>>> I forgot to add the file after fixing a conflict [1] which led to the
>>>> linux-next build failure.
>>>>
>>>> But two were reported by lkp [2][3]. May I take the opportunity to fold
>>>> them with the patches they fix and shall I keep them as is ?
>>>>
>>>> [1]
>>>> https://lore.kernel.org/all/20260811145427.3089426-1-daniel.lezcano@kernel.org/
>>>>
>>>> [2]
>>>> https://lore.kernel.org/all/20260811094935.2941313-1-daniel.lezcano@kernel.org/
>>>>
>>>> [3]
>>>> https://lore.kernel.org/all/20260811094747.2940616-1-daniel.lezcano@kernel.org/
>>>
>>> At this point it's better to do additional fix commits on top of the
>>> previous material as it has all been exposed in my thermal branch for
>>> which there are no history rewrites.
>>>
>>> Please send me a PR with all of the fixes on top of the current HEAD
>>> of my thermal branch.
>>
>> Do you mean linux-pm/thermal ?
> 
> Yes, that one.

It has my PR in it, should it be reset ?

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Rafael J. Wysocki (Intel)]

On Wed, Aug 12, 2026 at 11:33 PM Daniel Lezcano
<daniel.lezcano@oss.qualcomm.com> wrote:
>
> On 8/12/26 18:04, Rafael J. Wysocki (Intel) wrote:
> > On Wed, Aug 12, 2026 at 5:16 PM Daniel Lezcano
> > <daniel.lezcano@oss.qualcomm.com> wrote:
> >>
> >> On 8/12/26 14:50, Rafael J. Wysocki (Intel) wrote:
> >>> On Wed, Aug 12, 2026 at 2:43 PM Daniel Lezcano
> >>> <daniel.lezcano@oss.qualcomm.com> wrote:
> >>>>
> >>>> On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
> >>>>> Hi Daniel,
> >>>>>
> >>>>> On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
> >>>>> <daniel.lezcano@oss.qualcomm.com> wrote:
> >>>>>>
> >>>>>>
> >>>>>> Hi Rafael,
> >>>>>>
> >>>>>> please ignore this PR because there is a missing SoB.
> >>>>>>
> >>>>>> I'll fix it and meanwhile update the linux-next branch so it will fix
> >>>>>> the build issue.
> >>>>>
> >>>>> Well, the build issue is still there in my thermal branch though.
> >>>>>
> >>>>> I've now remerged my linux-next branch to avoid exposing the thermal
> >>>>> drivers merge I did previously and I'll wait for another PR from you.
> >>>>> Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
> >>>>> thermal PR.
> >>>> There are 3 fixes on top of the PR.
> >>>>
> >>>> One is obviously to be folded with the existing series as it is my fault
> >>>> I forgot to add the file after fixing a conflict [1] which led to the
> >>>> linux-next build failure.
> >>>>
> >>>> But two were reported by lkp [2][3]. May I take the opportunity to fold
> >>>> them with the patches they fix and shall I keep them as is ?
> >>>>
> >>>> [1]
> >>>> https://lore.kernel.org/all/20260811145427.3089426-1-daniel.lezcano@kernel.org/
> >>>>
> >>>> [2]
> >>>> https://lore.kernel.org/all/20260811094935.2941313-1-daniel.lezcano@kernel.org/
> >>>>
> >>>> [3]
> >>>> https://lore.kernel.org/all/20260811094747.2940616-1-daniel.lezcano@kernel.org/
> >>>
> >>> At this point it's better to do additional fix commits on top of the
> >>> previous material as it has all been exposed in my thermal branch for
> >>> which there are no history rewrites.
> >>>
> >>> Please send me a PR with all of the fixes on top of the current HEAD
> >>> of my thermal branch.
> >>
> >> Do you mean linux-pm/thermal ?
> >
> > Yes, that one.
>
> It has my PR in it, should it be reset ?

No, it shouldn't.  Please send another fix PR on top of this one.

Re: [GIT PULL] thermal drivers fixes for v7.3-rc1

[Rafael J. Wysocki (Intel)]

On Thu, Aug 13, 2026 at 11:17 AM Rafael J. Wysocki (Intel)
<rafael@kernel.org> wrote:
>
> On Wed, Aug 12, 2026 at 11:33 PM Daniel Lezcano
> <daniel.lezcano@oss.qualcomm.com> wrote:
> >
> > On 8/12/26 18:04, Rafael J. Wysocki (Intel) wrote:
> > > On Wed, Aug 12, 2026 at 5:16 PM Daniel Lezcano
> > > <daniel.lezcano@oss.qualcomm.com> wrote:
> > >>
> > >> On 8/12/26 14:50, Rafael J. Wysocki (Intel) wrote:
> > >>> On Wed, Aug 12, 2026 at 2:43 PM Daniel Lezcano
> > >>> <daniel.lezcano@oss.qualcomm.com> wrote:
> > >>>>
> > >>>> On 8/12/26 13:28, Rafael J. Wysocki (Intel) wrote:
> > >>>>> Hi Daniel,
> > >>>>>
> > >>>>> On Tue, Aug 11, 2026 at 4:48 PM Daniel Lezcano
> > >>>>> <daniel.lezcano@oss.qualcomm.com> wrote:
> > >>>>>>
> > >>>>>>
> > >>>>>> Hi Rafael,
> > >>>>>>
> > >>>>>> please ignore this PR because there is a missing SoB.
> > >>>>>>
> > >>>>>> I'll fix it and meanwhile update the linux-next branch so it will fix
> > >>>>>> the build issue.
> > >>>>>
> > >>>>> Well, the build issue is still there in my thermal branch though.
> > >>>>>
> > >>>>> I've now remerged my linux-next branch to avoid exposing the thermal
> > >>>>> drivers merge I did previously and I'll wait for another PR from you.
> > >>>>> Worst-case I'll skip the thermal drivers material in my first 7.3-rc1
> > >>>>> thermal PR.
> > >>>> There are 3 fixes on top of the PR.
> > >>>>
> > >>>> One is obviously to be folded with the existing series as it is my fault
> > >>>> I forgot to add the file after fixing a conflict [1] which led to the
> > >>>> linux-next build failure.
> > >>>>
> > >>>> But two were reported by lkp [2][3]. May I take the opportunity to fold
> > >>>> them with the patches they fix and shall I keep them as is ?
> > >>>>
> > >>>> [1]
> > >>>> https://lore.kernel.org/all/20260811145427.3089426-1-daniel.lezcano@kernel.org/
> > >>>>
> > >>>> [2]
> > >>>> https://lore.kernel.org/all/20260811094935.2941313-1-daniel.lezcano@kernel.org/
> > >>>>
> > >>>> [3]
> > >>>> https://lore.kernel.org/all/20260811094747.2940616-1-daniel.lezcano@kernel.org/
> > >>>
> > >>> At this point it's better to do additional fix commits on top of the
> > >>> previous material as it has all been exposed in my thermal branch for
> > >>> which there are no history rewrites.
> > >>>
> > >>> Please send me a PR with all of the fixes on top of the current HEAD
> > >>> of my thermal branch.
> > >>
> > >> Do you mean linux-pm/thermal ?
> > >
> > > Yes, that one.
> >
> > It has my PR in it, should it be reset ?
>
> No, it shouldn't.  Please send another fix PR on top of this one.

To be more precise, please just make this new PR only contain fixes on
top of the previous one.