Re: [PATCH v4 0/6] Thermal zone device structure encapsulation

[Daniel Lezcano <daniel.lezcano@linaro.org>]

On 27/04/2023 19:23, Rafael J. Wysocki wrote:
> On Wed, Apr 19, 2023 at 10:33 AM Daniel Lezcano
> <daniel.lezcano@linaro.org> wrote:
>>
>> The thermal zone device structure is defined in the exported thermal
>> header include/linux/thermal.h
>>
>> Given the definition being public, the structure is exposed to the
>> external components other than the thermal framework core code. It
>> results the drivers are tampering the structure internals like taking
>> the lock or changing the field values.
>>
>> Obviously that is bad for several reasons as the drivers can hook the
>> thermal framework behavior and makes very difficult the changes in the
>> core code as external components depend on it directly.
>>
>> Moreover, the thermal trip points being reworked, we don't want the
>> drivers to access the trips array directly in the thermal zone
>> structure and doing assumptions on how they are organized.
>>
>> This series provides a second set of changes moving to the thermal
>> zone device structure self-encapsulation.
>>
>> The ACPI and the Menlon drivers are using the thermal zone's device
>> fields to create symlinks and new attributes in the sysfs thermal zone
>> directory. These changes provide a hopefully temporary wrapper to
>> access it in order to allow moving forward in the thermal zone device
>> self-encapsulation and a Kconfig option to disable by default such a
>> extra sysfs information.
>>

[ ... ]

> Patches [4/6] and [6/6] were superseded by the Menlow driver removal.
> 
> I've applied the rest as 6.4-rc material, with some subject
> adjustments and after removing some trailing white space in a few
> places.


Thanks!

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