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From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: rafael@kernel.org
Cc: rui.zhang@intel.com, linux-kernel@vger.kernel.org,
	linux-pm@vger.kernel.org
Subject: Re: [PATCH v3 0/6] Thermal zone device structure encapsulation
Date: Mon, 17 Apr 2023 15:17:52 +0200	[thread overview]
Message-ID: <b09deeb1-31c8-ba08-86ce-614349f33b92@linaro.org> (raw)
In-Reply-To: <20230413114647.3878792-1-daniel.lezcano@linaro.org>


Hi Rafael,

I think I addressed your comments from V2.

Is it fine if I merge this series in the thermal/bleeding-branch ?


On 13/04/2023 13:46, Daniel Lezcano wrote:
> The thermal zone device structure is defined in the exported thermal
> header include/linux/thermal.h
> 
> Given the definition being public, the structure is exposed to the
> external components other than the thermal framework core code. It
> results the drivers are tampering the structure internals like taking
> the lock or changing the field values.
> 
> Obviously that is bad for several reasons as the drivers can hook the
> thermal framework behavior and makes very difficult the changes in the
> core code as external components depend on it directly.
> 
> Moreover, the thermal trip points being reworked, we don't want the
> drivers to access the trips array directly in the thermal zone
> structure and doing assumptions on how they are organized.
> 
> This series provides a second set of changes moving to the thermal
> zone device structure self-encapsulation.
> 
> The ACPI and the Menlon drivers are using the thermal zone's device
> fields to create symlinks and new attributes in the sysfs thermal zone
> directory. These changes provide a hopefully temporary wrapper to
> access it in order to allow moving forward in the thermal zone device
> self-encapsulation and a Kconfig option to disable by default such a
> extra sysfs information.
> 
> Changelog:
> 	v3:
> 	- Split the Kconfig option to be driver related when disabling
>            the specific attributes
> 	- Use the thermal zone's device wrapper to write a trace in
>            the pch intel driver
> 	v2:
> 	- Add the Kconfig option to remove specific attributes
> 	- Add a thermal_zone_device() wrapper to access tz->device
> 
> Daniel Lezcano (6):
>    thermal/core: Encapsulate tz->device field
>    thermal/drivers/intel_pch_thermal: Use thermal driver device to write
>      a trace
>    thermal/drivers/acpi: Use thermal_zone_device()
>    thermal/drivers/menlow: Use thermal_zone_device()
>    thermal/drivers/acpi: Make cross dev link optional by configuration
>    thermal/drivers/intel_menlow: Make additionnal sysfs information
>      optional
> 
>   drivers/acpi/Kconfig                      | 13 ++++++
>   drivers/acpi/thermal.c                    | 57 +++++++++++++++++------
>   drivers/thermal/intel/Kconfig             | 11 +++++
>   drivers/thermal/intel/intel_menlow.c      | 12 +++--
>   drivers/thermal/intel/intel_pch_thermal.c |  3 +-
>   drivers/thermal/thermal_core.c            |  6 +++
>   include/linux/thermal.h                   |  1 +
>   7 files changed, 84 insertions(+), 19 deletions(-)
> 

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  parent reply	other threads:[~2023-04-17 13:18 UTC|newest]

Thread overview: 14+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2023-04-13 11:46 Daniel Lezcano
2023-04-13 11:46 ` [PATCH v3 1/6] thermal/core: Encapsulate tz->device field Daniel Lezcano
2023-04-13 11:46 ` [PATCH v3 2/6] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace Daniel Lezcano
2023-04-13 11:46 ` [PATCH v3 3/6] thermal/drivers/acpi: Use thermal_zone_device() Daniel Lezcano
2023-04-13 11:46 ` [PATCH v3 4/6] thermal/drivers/menlow: " Daniel Lezcano
2023-04-13 11:46 ` [PATCH v3 5/6] thermal/drivers/acpi: Make cross dev link optional by configuration Daniel Lezcano
2023-04-18 13:38   ` Rafael J. Wysocki
2023-04-18 13:44     ` Daniel Lezcano
2023-04-18 13:47       ` Rafael J. Wysocki
2023-04-18 13:48         ` Daniel Lezcano
2023-04-13 11:46 ` [PATCH v3 6/6] thermal/drivers/intel_menlow: Make additionnal sysfs information optional Daniel Lezcano
2023-04-18 13:46   ` Rafael J. Wysocki
2023-04-17 13:17 ` Daniel Lezcano [this message]
2023-04-18 13:51   ` [PATCH v3 0/6] Thermal zone device structure encapsulation Rafael J. Wysocki

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