From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
To: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@kernel.org>,
Zhang Rui <rui.zhang@intel.com>,
Lukasz Luba <lukasz.luba@arm.com>, Rob Herring <robh@kernel.org>,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Conor Dooley <conor+dt@kernel.org>,
Jonathan Corbet <corbet@lwn.net>,
Shuah Khan <skhan@linuxfoundation.org>,
Randy Dunlap <rdunlap@infradead.org>,
Amit Kucheria <amitk@kernel.org>,
Thara Gopinath <thara.gopinath@gmail.com>,
Bjorn Andersson <andersson@kernel.org>,
Konrad Dybcio <konradybcio@kernel.org>,
Abel Vesa <abelvesa@kernel.org>
Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org,
linux-kernel@vger.kernel.org, linux-doc@vger.kernel.org,
linux-arm-msm@vger.kernel.org,
Amit Kucheria <amit.kucheria@oss.qualcomm.com>
Subject: Re: [PATCH 4/6] thermal: qcom: tsens: add hardware-bin trip-point filtering
Date: Fri, 23 Oct 2026 15:31:42 +0530 [thread overview]
Message-ID: <e832301a-6129-4697-a5e4-94671072622b@oss.qualcomm.com> (raw)
In-Reply-To: <7cd708de-a58e-47fd-acd4-0e37be77de92@oss.qualcomm.com>
On 10/22/2026 2:39 PM, Konrad Dybcio wrote:
> On 10/2/26 12:46 PM, Gaurav Kohli wrote:
>> From: Amit Kucheria <amit.kucheria@oss.qualcomm.com>
>>
>> Some Qualcomm SoCs are binned at manufacturing time and expose the bin
>> in qfprom fuses. The thermal core's supported_hw_bin mechanism filters
>> trip points by hardware version; wire tsens up to feed it.
>
> [...]
>
>> + /* Hardware-bin values for thermal-hw-bin matching in DT. */
>> + const u32 hw_bin_std = 0x1;
>> + const u32 hw_bin_elevated = 0x2;
>> +
>> + /* Higher thermal profile identification for qcm6490/sc7280 bins. */
>> + const u32 tsens_chip_id0 = 0x197;
>> + const u32 tsens_chip_id1 = 0x198;
>> + const u32 tsens_chip_id2 = 0x20e;
>> + const u32 tsens_chip_id3 = 0x20f;
>> + const u8 tsens_feat_id2 = 0x2;
>> + const u8 tsens_feat_id3 = 0x3;
>> + const u8 tsens_feat_id4 = 0x4;
>
> Isn't that (also) exposed over SMEM?
Thanks Konrad, for review.
SMEM has related socinfo data, but there is no exported helper for the
exact fields needed here, such as feat-id, which is also used as the bin
value.
This jtag-id/feat-id decoding is Kodiak/QCM6490-specific, and the
thermal-bin mapping needs both values. Other/future targets are expected
to use only the generic i-temp fuse bit, like Hamoa.
>
> Konrad
>
>> +
>> + if (nfuse < 2)
>> + return -EINVAL;
>> +
>> + tsens_jtag = fuse[0] & GENMASK(19, 0);
>> + tsens_feat_id = fuse[1] & GENMASK(7, 0);
>> +
>> + elevate_trip =
>> + (tsens_jtag == tsens_chip_id0 && tsens_feat_id == tsens_feat_id3) ||
>> + (tsens_jtag == tsens_chip_id1 && tsens_feat_id == tsens_feat_id4) ||
>> + (tsens_jtag == tsens_chip_id2 && tsens_feat_id == tsens_feat_id3) ||
>> + (tsens_jtag == tsens_chip_id3 && tsens_feat_id == tsens_feat_id2);
>> +
>> + hw[0] = elevate_trip ? hw_bin_elevated : hw_bin_std;
>> + *count = 1;
>> +
>> + dev_dbg(dev,
>> + "qcm6490 hw-bin from jtag-id=0x%x feat-id=0x%x => 0x%x\n",
>> + tsens_jtag, tsens_feat_id, hw[0]);
>> +
>> + return 0;
>> +}
>> +
>> +static int tsens_compute_hw_version_i_temp(struct device *dev,
>> + const u32 *fuse, unsigned int nfuse,
>> + u32 *hw, unsigned int *count)
>> +{
>> + if (nfuse < 1)
>> + return -EINVAL;
>> +
>> + /* Single bit: set bit 1 for high-temp bin, bit 0 for standard bin */
>> + hw[0] = (fuse[0] & BIT(0)) ? 0x2u : 0x1u;
>> + *count = 1;
>> +
>> + dev_dbg(dev, "i-temp hw-bin from i-temp=0x%x => 0x%x\n",
>> + fuse[0], hw[0]);
>> +
>> + return 0;
>> +}
>> +
>> +static const char * const tsens_cells_qcm6490[] = { "jtag-id", "feat-id" };
>> +static const char * const tsens_cells_i_temp[] = { "i-temp" };
>> +
>> +const struct tsens_hw_bin_desc tsens_hw_bin_desc_qcm6490 = {
>> + .cell_names = tsens_cells_qcm6490,
>> + .ncells = ARRAY_SIZE(tsens_cells_qcm6490),
>> + .compute_hw_version = tsens_compute_hw_version_qcm6490,
>> +};
>> +
>> +const struct tsens_hw_bin_desc tsens_hw_bin_desc_i_temp = {
>> + .cell_names = tsens_cells_i_temp,
>> + .ncells = ARRAY_SIZE(tsens_cells_i_temp),
>> + .compute_hw_version = tsens_compute_hw_version_i_temp,
>> +};
>> +
>> +/**
>> + * tsens_populate_hw_bin_info - read fuse cells and populate priv->hw_bin_info
>> + * @priv: tsens private data
>> + * @data: platform data containing the optional hw_bin_desc pointer
>> + *
>> + * If data->hw_bin_desc is NULL, this is a no-op and returns 0. Otherwise,
>> + * reads the nvmem cells named in hw_bin_desc->cell_names, calls the
>> + * compute_hw_version() callback, and stores the result in priv->hw_bin_info
>> + * for later use by tsens_register().
>> + *
>> + * Return: 0 on success, negative errno on failure.
>> + */
>> +static int tsens_populate_hw_bin_info(struct tsens_priv *priv,
>> + const struct tsens_plat_data *data)
>> +{
>> + const struct tsens_hw_bin_desc *desc;
>> + u32 fuse_vals[TSENS_HW_BIN_MAX_CELLS];
>> + u32 hw_versions[THERMAL_HW_BIN_MAX_LEVELS] = { 0 };
>> + unsigned int hw_count = 0;
>> + int i, ret;
>> +
>> + if (!data->hw_bin_desc)
>> + return 0;
>> +
>> + desc = data->hw_bin_desc;
>> +
>> + if (!desc->ncells || desc->ncells > TSENS_HW_BIN_MAX_CELLS) {
>> + dev_err(priv->dev, "hw_bin_desc ncells %u out of range\n",
>> + desc->ncells);
>> + return -EINVAL;
>> + }
>> +
>> + for (i = 0; i < (int)desc->ncells; i++) {
>> + ret = nvmem_cell_read_variable_le_u32(priv->dev,
>> + desc->cell_names[i],
>> + &fuse_vals[i]);
>> + if (ret < 0) {
>> + dev_err(priv->dev,
>> + "failed to read nvmem cell '%s': %d\n",
>> + desc->cell_names[i], ret);
>> + return ret;
>> + }
>> + }
>> +
>> + ret = desc->compute_hw_version(priv->dev, fuse_vals, desc->ncells,
>> + hw_versions, &hw_count);
>> + if (ret) {
>> + dev_err(priv->dev, "compute_hw_version failed: %d\n", ret);
>> + return ret;
>> + }
>> +
>> + if (!hw_count || hw_count > THERMAL_HW_BIN_MAX_LEVELS) {
>> + dev_err(priv->dev,
>> + "compute_hw_version returned invalid hw_count %u\n",
>> + hw_count);
>> + return -EINVAL;
>> + }
>> +
>> + /*
>> + * Store a copy of the hw-version array in priv->hw_bin_info. We can't
>> + * call thermal_zone_set_supported_hw_bin() here because the thermal zones
>> + * haven't been registered yet; tsens_register() will pass &priv->hw_bin_info
>> + * directly to devm_thermal_of_zone_register_with_bin() instead.
>> + *
>> + * Use devm_kmemdup so the copy is freed when the device is unbound.
>> + */
>> + priv->hw_bin_info.supported_hw_bin = devm_kmemdup(priv->dev, hw_versions,
>> + hw_count * sizeof(u32),
>> + GFP_KERNEL);
>> + if (!priv->hw_bin_info.supported_hw_bin)
>> + return -ENOMEM;
>> +
>> + priv->hw_bin_info.supported_hw_bin_count = hw_count;
>> +
>> + return 0;
>> +}
>> +
>> int tsens_read_calibration(struct tsens_priv *priv, int shift, u32 *p1, u32 *p2, bool backup)
>> {
>> u32 mode;
>> @@ -1206,6 +1368,12 @@ static const struct of_device_id tsens_table[] = {
>> }, {
>> .compatible = "qcom,msm8996-tsens",
>> .data = &data_8996,
>> + }, {
>> + .compatible = "qcom,qcm6490-tsens",
>> + .data = &data_sc7280,
>> + }, {
>> + .compatible = "qcom,sc7280-tsens",
>> + .data = &data_sc7280,
>> }, {
>> .compatible = "qcom,tsens-v1",
>> .data = &data_tsens_v1,
>> @@ -1218,6 +1386,9 @@ static const struct of_device_id tsens_table[] = {
>> }, {
>> .compatible = "qcom,sa8255p-tsens",
>> .data = &data_automotive_v2,
>> + }, {
>> + .compatible = "qcom,x1e80100-tsens",
>> + .data = &data_x1e80100,
>> },
>> {}
>> };
>> @@ -1327,12 +1498,18 @@ static int tsens_register(struct tsens_priv *priv)
>> {
>> int i, ret;
>> struct thermal_zone_device *tzd;
>> + const struct thermal_hw_bin_info *bin_info;
>> +
>> + bin_info = priv->hw_bin_info.supported_hw_bin_count ?
>> + &priv->hw_bin_info : NULL;
>>
>> for (i = 0; i < priv->num_sensors; i++) {
>> priv->sensor[i].priv = priv;
>> - tzd = devm_thermal_of_zone_register(priv->dev, priv->sensor[i].hw_id,
>> - &priv->sensor[i],
>> - &tsens_of_ops);
>> + tzd = devm_thermal_of_zone_register_with_bin(priv->dev,
>> + priv->sensor[i].hw_id,
>> + &priv->sensor[i],
>> + &tsens_of_ops,
>> + bin_info);
>> if (IS_ERR(tzd))
>> continue;
>> priv->sensor[i].tzd = tzd;
>> @@ -1425,6 +1602,12 @@ static int tsens_probe(struct platform_device *pdev)
>> priv->feat = data->feat;
>> priv->fields = data->fields;
>>
>> + ret = tsens_populate_hw_bin_info(priv, data);
>> + if (ret)
>> + dev_warn(&pdev->dev,
>> + "thermal-bin failed to read FUSE data (%d): trips with temperature-bin will use first entry\n",
>> + ret);
>> +
>> platform_set_drvdata(pdev, priv);
>>
>> device_init_wakeup(dev, !data->no_irq_wake);
>> diff --git a/drivers/thermal/qcom/tsens.h b/drivers/thermal/qcom/tsens.h
>> index e8376accdff3..496ae6572bb8 100644
>> --- a/drivers/thermal/qcom/tsens.h
>> +++ b/drivers/thermal/qcom/tsens.h
>> @@ -40,6 +40,29 @@ enum tsens_ver {
>> VER_2_X_NO_RPM,
>> };
>>
>> +/**
>> + * struct tsens_hw_bin_desc - per-SoC descriptor for hardware-bin fuse reading
>> + * @cell_names: NULL-terminated array of nvmem cell names to read
>> + * @ncells: number of entries in @cell_names
>> + * @compute_hw_version: callback that converts raw fuse values to hw-version
>> + * bitfields suitable for thermal_zone_set_supported_hw_bin()
>> + *
>> + * Embed a pointer to this struct in tsens_plat_data.hw_bin_desc to enable
>> + * hardware-bin trip filtering for a given SoC. Set to NULL to disable.
>> + */
>> +struct tsens_hw_bin_desc {
>> + const char * const *cell_names;
>> + unsigned int ncells;
>> + int (*compute_hw_version)(struct device *dev,
>> + const u32 *fuse, unsigned int nfuse,
>> + u32 *hw, unsigned int *count);
>> +};
>> +
>> +#define TSENS_HW_BIN_MAX_CELLS 8
>> +
>> +extern const struct tsens_hw_bin_desc tsens_hw_bin_desc_qcm6490;
>> +extern const struct tsens_hw_bin_desc tsens_hw_bin_desc_i_temp;
>> +
>> enum tsens_irq_type {
>> LOWER,
>> UPPER,
>> @@ -533,6 +556,7 @@ struct tsens_features {
>> * @feat: features of the IP
>> * @fields: bitfield locations
>> * @no_irq_wake: if set, TSENS interrupts will not be configured as wakeup sources
>> + * @hw_bin_desc: optional hardware-bin fuse descriptor for trip filtering
>> */
>> struct tsens_plat_data {
>> const u32 num_sensors;
>> @@ -541,6 +565,7 @@ struct tsens_plat_data {
>> struct tsens_features *feat;
>> const struct reg_field *fields;
>> bool no_irq_wake;
>> + const struct tsens_hw_bin_desc *hw_bin_desc;
>> };
>>
>> /**
>> @@ -568,6 +593,7 @@ struct tsens_context {
>> * @feat: features of the IP
>> * @fields: bitfield locations
>> * @ops: pointer to list of callbacks supported by this device
>> + * @hw_bin_info: hardware binning info read from SoC fuse (populated at probe)
>> * @debug_root: pointer to debugfs dentry for all tsens
>> * @debug: pointer to debugfs dentry for tsens controller
>> * @uplow_irq: IRQ number for uplow (upper/lower) threshold interrupts
>> @@ -591,6 +617,8 @@ struct tsens_priv {
>> const struct reg_field *fields;
>> const struct tsens_ops *ops;
>>
>> + struct thermal_hw_bin_info hw_bin_info;
>> +
>> struct dentry *debug_root;
>> struct dentry *debug;
>>
>> @@ -677,6 +705,7 @@ extern const struct tsens_plat_data data_ipq5018;
>> /* TSENS v2 targets */
>> extern struct tsens_plat_data data_8996, data_ipq8074, data_tsens_v2;
>> extern const struct tsens_plat_data data_ipq5332, data_ipq5424;
>> +extern const struct tsens_plat_data data_x1e80100, data_sc7280;
>>
>> /* TSENS automotive targets */
>> extern struct tsens_plat_data data_automotive_v2;
>>
next prev parent reply other threads:[~2026-10-23 10:01 UTC|newest]
Thread overview: 13+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-10-02 10:46 [PATCH 0/6] thermal: Add hardware-binned trip point support Gaurav Kohli
2026-10-02 10:46 ` [PATCH 1/6] dt-bindings: thermal: thermal-zones: add hardware-binning trip properties Gaurav Kohli
2026-10-13 6:24 ` Krzysztof Kozlowski
2026-10-19 14:09 ` Gaurav Kohli
2026-10-02 10:46 ` [PATCH 2/6] thermal: add hardware-binning trip-point filtering support Gaurav Kohli
2026-10-02 10:46 ` [PATCH 3/6] dt-bindings: thermal: qcom-tsens: document qcm6490 tsens Gaurav Kohli
2026-10-02 10:46 ` [PATCH 4/6] thermal: qcom: tsens: add hardware-bin trip-point filtering Gaurav Kohli
2026-10-22 9:09 ` Konrad Dybcio
2026-10-23 10:01 ` Gaurav Kohli [this message]
2026-10-02 10:47 ` [PATCH 5/6] arm64: dts: qcom: kodiak: use thermal hw-bin trips Gaurav Kohli
2026-10-22 9:09 ` Konrad Dybcio
2026-10-22 13:39 ` Gaurav Kohli
2026-10-02 10:47 ` [PATCH 6/6] arm64: dts: qcom: hamoa: add thermal hw-bin support Gaurav Kohli
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