Re: [PATCH 1/6] dt-bindings: thermal: thermal-zones: add hardware-binning trip properties

[Krzysztof Kozlowski <krzk@kernel.org>]

On Fri, Oct 02, 2026 at 04:16:56PM +0530, Gaurav Kohli wrote:
> From: Amit Kucheria <amit.kucheria@oss.qualcomm.com>
> 
> Differences in SoC packaging can be used to provide multiple SoC SKUs at
> different thermal and performance characteristics. The underlying SoC
> remains the same except for how much heat the packaging can dissipate,
> thereby influencing the critical trip point at which an SoC SKU needs to
> be throttled. This SKU-specific data is typically burned into fuses
> during manufacturing and can be read back at runtime.
> 
> Add two optional trip-point properties to describe this:
> 
>   - 'temperature-bin': an array of per-bin trip temperatures, used
>     instead of 'temperature' when the trip depends on the hardware
>     revision encoded in fuses.
> 
>   - 'thermal-hw-bin': one or more bitmask groups describing the hardware
>     revisions for which a trip point is valid, modeled on the
>     'opp-supported-hw' property of the OPP framework.
> 
> Signed-off-by: Amit Kucheria <amit.kucheria@oss.qualcomm.com>
> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
> ---
>  .../devicetree/bindings/thermal/thermal-zones.yaml | 53 +++++++++++++++++++++-
>  1 file changed, 52 insertions(+), 1 deletion(-)

10 days was enough for replies to feedback, so dropping from patchwork.

Best regards,
Krzysztof