From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: daniel.lezcano@linaro.org, rafael@kernel.org
Cc: rui.zhang@intel.com, linux-kernel@vger.kernel.org,
linux-pm@vger.kernel.org
Subject: [PATCH v2 0/7] Thermal zone device structure encapsulation
Date: Mon, 10 Apr 2023 22:52:58 +0200 [thread overview]
Message-ID: <20230410205305.1649678-1-daniel.lezcano@linaro.org> (raw)
The thermal zone device structure is defined in the exported thermal
header include/linux/thermal.h
Given the definition being public, the structure is exposed to the
external components other than the thermal framework core code. It
results the drivers are tampering the structure internals like taking
the lock or changing the field values.
Obviously that is bad for several reasons as the drivers can hook the
thermal framework behavior and makes very difficult the changes in the
core code as external components depend on it directly.
Moreover, the thermal trip points being reworked, we don't want the
drivers to access the trips array directly in the thermal zone
structure and doing assumptions on how they are organized.
This series provides a second set of changes moving to the thermal
zone device structure self-encapsulation.
The ACPI and the Menlon drivers are using the thermal zone's device
fields to create symlinks and new attributes in the sysfs thermal zone
directory. These changes provide a hopefully temporary wrapper to
access it in order to allow moving forward in the thermal zone device
self-encapsulation and a Kconfig option to disable by default such a
extra sysfs information.
Changelog:
v2:
- Add the Kconfig option to remove specific attributes
- Add a thermal_zone_device() wrapper to access tz->device
Daniel Lezcano (7):
thermal/drivers/intel_pch_thermal: Use thermal driver device to write
a trace
thermal/core: Encapsulate tz->device field
thermal/drivers/acpi: Use thermal_zone_device()
thermal/drivers/menlow: Use thermal_zone_device()
thermal/core: Prepare sanitizing thermal class sysfs content
thermal/drivers/acpi: Make cross dev link optional by configuration
thermal/drivers/intel_menlow: Make additionnal sysfs information
optional
drivers/acpi/thermal.c | 57 +++++++++++++++++------
drivers/thermal/Kconfig | 12 +++++
drivers/thermal/intel/intel_menlow.c | 12 +++--
drivers/thermal/intel/intel_pch_thermal.c | 5 +-
drivers/thermal/thermal_core.c | 6 +++
include/linux/thermal.h | 1 +
6 files changed, 74 insertions(+), 19 deletions(-)
--
2.34.1
next reply other threads:[~2023-04-10 20:53 UTC|newest]
Thread overview: 18+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-04-10 20:52 Daniel Lezcano [this message]
2023-04-10 20:52 ` [PATCH v2 1/7] thermal/drivers/intel_pch_thermal: Use thermal driver device to write a trace Daniel Lezcano
2023-04-11 18:16 ` Rafael J. Wysocki
2023-04-11 20:10 ` Daniel Lezcano
2023-04-12 18:35 ` Rafael J. Wysocki
2023-04-10 20:53 ` [PATCH v2 2/7] thermal/core: Encapsulate tz->device field Daniel Lezcano
2023-04-11 18:19 ` Rafael J. Wysocki
2023-04-11 20:20 ` Daniel Lezcano
2023-04-12 18:56 ` Rafael J. Wysocki
2023-04-12 19:17 ` Daniel Lezcano
2023-04-10 20:53 ` [PATCH v2 3/7] thermal/drivers/acpi: Use thermal_zone_device() Daniel Lezcano
2023-04-10 20:53 ` [PATCH v2 4/7] thermal/drivers/menlow: " Daniel Lezcano
2023-04-10 20:53 ` [PATCH v2 5/7] thermal/core: Prepare sanitizing thermal class sysfs content Daniel Lezcano
2023-04-11 18:23 ` Rafael J. Wysocki
2023-04-10 20:53 ` [PATCH v2 6/7] thermal/drivers/acpi: Make cross dev link optional by configuration Daniel Lezcano
2023-04-11 18:26 ` Rafael J. Wysocki
2023-04-11 20:21 ` Daniel Lezcano
2023-04-10 20:53 ` [PATCH v2 7/7] thermal/drivers/intel_menlow: Make additionnal sysfs information optional Daniel Lezcano
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