Re: [PATCH vs/3/4/ 00/11] Support cooling device with ID in the OF

[Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>]

On 5/29/26 17:29, Lukasz Luba wrote:
> Hi Rafael and Daniel,
> 
> On 5/29/26 13:41, Daniel Lezcano wrote:
>> On 5/29/26 14:35, Rafael J. Wysocki wrote:
>>> Hi Daniel,
>>>
>>> On Fri, May 29, 2026 at 10:35 AM Daniel Lezcano
>>> <daniel.lezcano@oss.qualcomm.com> wrote:
>>>>
>>>>
>>>> Hi Rafael,
>>>>
>>>> On 5/26/26 16:08, Daniel Lezcano wrote:
>>>>
>>>> [ ... ]
>>>>
>>>>> ---
>>>>> Changelog:
>>>>>    - V4
>>>>>      - Reworked splitted functions to register a cooling device and
>>>>>        merged separately
>>>>
>>>> Are you fine with the thermal core changes in this series ?
>>>
>>> Generally, yes, I am, but let me have one more look at it.
>>>
>>>> Is it ok if I pick the series in my branch (and may be send a early 
>>>> PR) ?
>>>
>>> I have no comments, I'll respond with an Acked-by to it later today.
>>>
>>> Thanks!
>>
>> Thanks
> 
> I have re-ordered the patch 4 <-> 5 and the compilation issue goes away.
> If you decide to do that feel free to add my tag to the current patch
> 04/10:
> 
> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>

Thanks Lukasz !