From: Lukasz Luba <lukasz.luba@arm.com>
To: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>,
rafael@kernel.org, daniel.lezcano@kernel.org
Cc: "Zhang Rui" <rui.zhang@intel.com>,
"Rob Herring" <robh@kernel.org>,
"Krzysztof Kozlowski" <krzk+dt@kernel.org>,
"Conor Dooley" <conor+dt@kernel.org>,
"Lucas Stach" <l.stach@pengutronix.de>,
"Russell King" <linux+etnaviv@armlinux.org.uk>,
"Christian Gmeiner" <christian.gmeiner@gmail.com>,
"David Airlie" <airlied@gmail.com>,
"Simona Vetter" <simona@ffwll.ch>,
"Guenter Roeck" <linux@roeck-us.net>,
"Joel Stanley" <joel@jms.id.au>,
"Andrew Jeffery" <andrew@codeconstruct.com.au>,
"Thomas Weißschuh" <linux@weissschuh.net>,
"Benson Leung" <bleung@chromium.org>,
"Pali Rohár" <pali@kernel.org>,
"Avi Fishman" <avifishman70@gmail.com>,
"Tomer Maimon" <tmaimon77@gmail.com>,
"Tali Perry" <tali.perry1@gmail.com>,
"Patrick Venture" <venture@google.com>,
"Nancy Yuen" <yuenn@google.com>,
"Benjamin Fair" <benjaminfair@google.com>,
"Heiko Stuebner" <heiko@sntech.de>,
"Thierry Reding" <thierry.reding@gmail.com>,
"Jonathan Hunter" <jonathanh@nvidia.com>,
"Bjorn Andersson" <andersson@kernel.org>,
"Konrad Dybcio" <konradybcio@kernel.org>,
"Amit Daniel Kachhap" <amit.kachhap@gmail.com>,
"Viresh Kumar" <viresh.kumar@linaro.org>,
"Neil Armstrong" <neil.armstrong@linaro.org>,
"Amit Kucheria" <amitk@kernel.org>,
linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org,
linux-hwmon@vger.kernel.org,
"Gaurav Kohli" <gaurav.kohli@oss.qualcomm.com>,
"Krzysztof Kozlowski" <krzysztof.kozlowski@oss.qualcomm.com>,
"open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS"
<devicetree@vger.kernel.org>
Subject: Re: [PATCH v4 10/10] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device
Date: Fri, 29 May 2026 16:26:31 +0100 [thread overview]
Message-ID: <bfcfd7c9-8185-4ac5-83ab-3bc3a1a94990@arm.com> (raw)
In-Reply-To: <20260526140802.1059293-22-daniel.lezcano@oss.qualcomm.com>
On 5/26/26 15:08, Daniel Lezcano wrote:
> From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
>
> Extend the thermal cooling device binding to support a 3 cells specifier
> along with the 2 cells format.
>
> Update #cooling-cells property to enum to support both 2 and 3 arguments.
>
> Fix pwm-fan.yaml to restrict the number of cells to 'const: 2'
>
> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
> ---
> Documentation/devicetree/bindings/hwmon/pwm-fan.yaml | 3 ++-
> .../bindings/thermal/thermal-cooling-devices.yaml | 8 ++++++--
> .../devicetree/bindings/thermal/thermal-zones.yaml | 3 ++-
> 3 files changed, 10 insertions(+), 4 deletions(-)
>
> diff --git a/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml b/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
> index a84cc3a4cfdc..6a24851fd80d 100644
> --- a/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
> +++ b/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
> @@ -63,7 +63,8 @@ properties:
> description: The PWM that is used to control the fan.
> maxItems: 1
>
> - "#cooling-cells": true
> + "#cooling-cells":
> + const: 2
>
> required:
> - compatible
> diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> index b9022f1613d8..28f5818f1e60 100644
> --- a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> @@ -44,10 +44,14 @@ select: true
> properties:
> "#cooling-cells":
> description:
> - Must be 2, in order to specify minimum and maximum cooling state used in
> + Must be 2 or 3. If 2, specifies minimum and maximum cooling state used in
> the cooling-maps reference. The first cell is the minimum cooling state
> and the second cell is the maximum cooling state requested.
> - const: 2
> + If 3, the first cell specifies the thermal mitigation device specifier
> + index for devices that support multiple thermal mitigation mechanisms.
> + The two other cells are respectively the minimum cooling state and the
> + maximum cooling state.
> + enum: [2, 3]
>
> additionalProperties: true
>
> diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
> index 07d9f576ffe7..999ad40a20d5 100644
> --- a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
> +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
> @@ -211,7 +211,8 @@ patternProperties:
> device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
> cooling-device phandle limit specifier lets the framework
> use the minimum and maximum cooling state for that cooling
> - device automatically.
> + device automatically. If three arguments are specified,
> + the first argument is the cooling device specifier.
>
> contribution:
> $ref: /schemas/types.yaml#/definitions/uint32
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
next prev parent reply other threads:[~2026-05-29 15:26 UTC|newest]
Thread overview: 27+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-05-26 14:08 [PATCH v3 00/11] Support cooling device with ID in the OF Daniel Lezcano
2026-05-26 14:08 ` [PATCH v4 01/10] thermal/core: Introduce non-OF thermal_cooling_device_register() Daniel Lezcano
2026-05-29 9:47 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 02/10] thermal/core: Add devm_thermal_cooling_device_register() Daniel Lezcano
2026-05-29 12:55 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 03/10] hwmon: Use non-OF thermal cooling device registration API Daniel Lezcano
2026-05-29 12:55 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 04/10] thermal/core: Make cooling device OF node conditional on CONFIG_THERMAL_OF Daniel Lezcano
2026-05-29 13:27 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 05/10] thermal/of: Move cooling device OF helpers out of thermal core Daniel Lezcano
2026-05-29 13:26 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 06/10] thermal/of: Rename the devm_thermal_of_cooling_device_register() function Daniel Lezcano
2026-05-29 15:17 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 07/10] thermal/of: Add cooling device ID support Daniel Lezcano
2026-05-29 15:18 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 08/10] thermal/of: Pass cdev_id and introduce devm registration helper Daniel Lezcano
2026-05-29 15:21 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 09/10] thermal/of: Support cooling device ID in cooling-spec Daniel Lezcano
2026-05-29 15:25 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 10/10] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device Daniel Lezcano
2026-05-29 15:26 ` Lukasz Luba [this message]
2026-05-29 8:35 ` [PATCH vs/3/4/ 00/11] Support cooling device with ID in the OF Daniel Lezcano
2026-05-29 12:35 ` Rafael J. Wysocki
2026-05-29 12:41 ` Daniel Lezcano
2026-05-29 15:29 ` Lukasz Luba
2026-05-29 15:31 ` Daniel Lezcano
2026-05-29 17:34 ` Rafael J. Wysocki
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