From: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
To: rafael@kernel.org, daniel.lezcano@kernel.org
Cc: "Zhang Rui" <rui.zhang@intel.com>,
"Lukasz Luba" <lukasz.luba@arm.com>,
"Rob Herring" <robh@kernel.org>,
"Krzysztof Kozlowski" <krzk+dt@kernel.org>,
"Conor Dooley" <conor+dt@kernel.org>,
"Lucas Stach" <l.stach@pengutronix.de>,
"Russell King" <linux+etnaviv@armlinux.org.uk>,
"Christian Gmeiner" <christian.gmeiner@gmail.com>,
"David Airlie" <airlied@gmail.com>,
"Simona Vetter" <simona@ffwll.ch>,
"Guenter Roeck" <linux@roeck-us.net>,
"Joel Stanley" <joel@jms.id.au>,
"Andrew Jeffery" <andrew@codeconstruct.com.au>,
"Thomas Weißschuh" <linux@weissschuh.net>,
"Benson Leung" <bleung@chromium.org>,
"Pali Rohár" <pali@kernel.org>,
"Avi Fishman" <avifishman70@gmail.com>,
"Tomer Maimon" <tmaimon77@gmail.com>,
"Tali Perry" <tali.perry1@gmail.com>,
"Patrick Venture" <venture@google.com>,
"Nancy Yuen" <yuenn@google.com>,
"Benjamin Fair" <benjaminfair@google.com>,
"Heiko Stuebner" <heiko@sntech.de>,
"Thierry Reding" <thierry.reding@gmail.com>,
"Jonathan Hunter" <jonathanh@nvidia.com>,
"Bjorn Andersson" <andersson@kernel.org>,
"Konrad Dybcio" <konradybcio@kernel.org>,
"Amit Daniel Kachhap" <amit.kachhap@gmail.com>,
"Viresh Kumar" <viresh.kumar@linaro.org>,
"Neil Armstrong" <neil.armstrong@linaro.org>,
"Amit Kucheria" <amitk@kernel.org>,
linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org,
linux-hwmon@vger.kernel.org
Subject: Re: [PATCH vs/3/4/ 00/11] Support cooling device with ID in the OF
Date: Fri, 29 May 2026 10:35:49 +0200 [thread overview]
Message-ID: <a943706d-d413-4ed8-a0fd-a3234c66cd8d@oss.qualcomm.com> (raw)
In-Reply-To: <20260526140802.1059293-12-daniel.lezcano@oss.qualcomm.com>
Hi Rafael,
On 5/26/26 16:08, Daniel Lezcano wrote:
[ ... ]
> ---
> Changelog:
> - V4
> - Reworked splitted functions to register a cooling device and
> merged separately
Are you fine with the thermal core changes in this series ?
Is it ok if I pick the series in my branch (and may be send a early PR) ?
> - V3
> - Reordered and reworked the patches to be git bisect safe
> - Reworked devm usage by using a more adequate function doing the
> same as the group of calls to devm*
> - Pass an init callback instead of moving
> thermal_cooling_device_init_complete() out of the function and
> calling it in different places
> - Sent separetely changes to the tegra soctherm driver
> - V2
> - Added stubs for OF functions in order to prevent to break the git
> bisectability compilation
> - Added missing call to thermal_cooling_device_init_complete() in
> devm_thermal_of_cooling_device_register()
> - Fixed assymetry in devm_ calls for the tegra/soctherm() driver
> - Fixed kernel documentation for API changes
> - Added missing static inline for a API stub
> - Hardened the test with two or three arguments in the cooling spec
> - Narrowed const: 2 strict in pwm-fan
> ---
>
> Daniel Lezcano (9):
> thermal/core: Introduce non-OF thermal_cooling_device_register()
> thermal/core: Add devm_thermal_cooling_device_register()
> hwmon: Use non-OF thermal cooling device registration API
> thermal/core: Make cooling device OF node conditional on
> CONFIG_THERMAL_OF
> thermal/of: Move cooling device OF helpers out of thermal core
> thermal/of: Rename the devm_thermal_of_cooling_device_register()
> function
> thermal/of: Add cooling device ID support
> thermal/of: Pass cdev_id and introduce devm registration helper
> thermal/of: Support cooling device ID in cooling-spec
>
> Gaurav Kohli (1):
> dt-bindings: thermal: cooling-devices: Update support for 3 cells
> cooling device
>
> .../devicetree/bindings/hwmon/pwm-fan.yaml | 3 +-
> .../thermal/thermal-cooling-devices.yaml | 8 +-
> .../bindings/thermal/thermal-zones.yaml | 3 +-
> drivers/gpu/drm/etnaviv/etnaviv_gpu.c | 5 +-
> drivers/hwmon/amc6821.c | 2 +-
> drivers/hwmon/aspeed-pwm-tacho.c | 5 +-
> drivers/hwmon/cros_ec_hwmon.c | 4 +-
> drivers/hwmon/dell-smm-hwmon.c | 4 +-
> drivers/hwmon/emc2305.c | 6 +-
> drivers/hwmon/gpio-fan.c | 6 +-
> drivers/hwmon/max6650.c | 6 +-
> drivers/hwmon/mlxreg-fan.c | 4 +-
> drivers/hwmon/npcm750-pwm-fan.c | 6 +-
> drivers/hwmon/pwm-fan.c | 5 +-
> drivers/hwmon/qnap-mcu-hwmon.c | 6 +-
> drivers/hwmon/tc654.c | 5 +-
> drivers/memory/tegra/tegra210-emc-core.c | 4 +-
> drivers/soc/qcom/qcom_aoss.c | 2 +-
> drivers/thermal/cpufreq_cooling.c | 2 +-
> drivers/thermal/cpuidle_cooling.c | 2 +-
> drivers/thermal/devfreq_cooling.c | 2 +-
> drivers/thermal/khadas_mcu_fan.c | 7 +-
> drivers/thermal/tegra/soctherm.c | 6 +-
> drivers/thermal/thermal_core.c | 85 ++--------
> drivers/thermal/thermal_core.h | 5 +
> drivers/thermal/thermal_of.c | 148 +++++++++++++++++-
> include/linux/thermal.h | 69 +++++---
> 27 files changed, 273 insertions(+), 137 deletions(-)
>
next prev parent reply other threads:[~2026-05-29 8:35 UTC|newest]
Thread overview: 27+ messages / expand[flat|nested] mbox.gz Atom feed top
2026-05-26 14:08 [PATCH v3 " Daniel Lezcano
2026-05-26 14:08 ` [PATCH v4 01/10] thermal/core: Introduce non-OF thermal_cooling_device_register() Daniel Lezcano
2026-05-29 9:47 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 02/10] thermal/core: Add devm_thermal_cooling_device_register() Daniel Lezcano
2026-05-29 12:55 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 03/10] hwmon: Use non-OF thermal cooling device registration API Daniel Lezcano
2026-05-29 12:55 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 04/10] thermal/core: Make cooling device OF node conditional on CONFIG_THERMAL_OF Daniel Lezcano
2026-05-29 13:27 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 05/10] thermal/of: Move cooling device OF helpers out of thermal core Daniel Lezcano
2026-05-29 13:26 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 06/10] thermal/of: Rename the devm_thermal_of_cooling_device_register() function Daniel Lezcano
2026-05-29 15:17 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 07/10] thermal/of: Add cooling device ID support Daniel Lezcano
2026-05-29 15:18 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 08/10] thermal/of: Pass cdev_id and introduce devm registration helper Daniel Lezcano
2026-05-29 15:21 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 09/10] thermal/of: Support cooling device ID in cooling-spec Daniel Lezcano
2026-05-29 15:25 ` Lukasz Luba
2026-05-26 14:08 ` [PATCH v4 10/10] dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device Daniel Lezcano
2026-05-29 15:26 ` Lukasz Luba
2026-05-29 8:35 ` Daniel Lezcano [this message]
2026-05-29 12:35 ` [PATCH vs/3/4/ 00/11] Support cooling device with ID in the OF Rafael J. Wysocki
2026-05-29 12:41 ` Daniel Lezcano
2026-05-29 15:29 ` Lukasz Luba
2026-05-29 15:31 ` Daniel Lezcano
2026-05-29 17:34 ` Rafael J. Wysocki
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