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From: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
To: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>,
	"Rafael J. Wysocki" <rafael@kernel.org>,
	Daniel Lezcano <daniel.lezcano@kernel.org>,
	Zhang Rui <rui.zhang@intel.com>,
	Lukasz Luba <lukasz.luba@arm.com>, Rob Herring <robh@kernel.org>,
	Krzysztof Kozlowski <krzk+dt@kernel.org>,
	Conor Dooley <conor+dt@kernel.org>,
	Jonathan Corbet <corbet@lwn.net>,
	Shuah Khan <skhan@linuxfoundation.org>,
	Randy Dunlap <rdunlap@infradead.org>,
	Amit Kucheria <amitk@kernel.org>,
	Thara Gopinath <thara.gopinath@gmail.com>,
	Bjorn Andersson <andersson@kernel.org>,
	Konrad Dybcio <konradybcio@kernel.org>,
	Abel Vesa <abelvesa@kernel.org>
Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org,
	linux-kernel@vger.kernel.org, linux-doc@vger.kernel.org,
	linux-arm-msm@vger.kernel.org,
	Amit Kucheria <amit.kucheria@oss.qualcomm.com>
Subject: Re: [PATCH 4/6] thermal: qcom: tsens: add hardware-bin trip-point filtering
Date: Tue, 27 Oct 2026 18:29:13 +0530	[thread overview]
Message-ID: <991e6b64-8741-4669-9bbf-e31eed788f42@oss.qualcomm.com> (raw)
In-Reply-To: <e7788a12-3cad-4bd4-9f79-82cd118e0049@oss.qualcomm.com>



On 10/26/2026 5:21 PM, Konrad Dybcio wrote:
> On 10/23/26 12:01 PM, Gaurav Kohli wrote:
>>
>>
>> On 10/22/2026 2:39 PM, Konrad Dybcio wrote:
>>> On 10/2/26 12:46 PM, Gaurav Kohli wrote:
>>>> From: Amit Kucheria <amit.kucheria@oss.qualcomm.com>
>>>>
>>>> Some Qualcomm SoCs are binned at manufacturing time and expose the bin
>>>> in qfprom fuses.  The thermal core's supported_hw_bin mechanism filters
>>>> trip points by hardware version; wire tsens up to feed it.
>>>
>>> [...]
>>>
>>>> +    /* Hardware-bin values for thermal-hw-bin matching in DT. */
>>>> +    const u32 hw_bin_std = 0x1;
>>>> +    const u32 hw_bin_elevated = 0x2;
>>>> +
>>>> +    /* Higher thermal profile identification for qcm6490/sc7280 bins. */
>>>> +    const u32 tsens_chip_id0 = 0x197;
>>>> +    const u32 tsens_chip_id1 = 0x198;
>>>> +    const u32 tsens_chip_id2 = 0x20e;
>>>> +    const u32 tsens_chip_id3 = 0x20f;
>>>> +    const u8 tsens_feat_id2 = 0x2;
>>>> +    const u8 tsens_feat_id3 = 0x3;
>>>> +    const u8 tsens_feat_id4 = 0x4;
>>>
>>> Isn't that (also) exposed over SMEM?
>>
>> Thanks Konrad, for review.
>>
>> SMEM has related socinfo data, but there is no exported helper for the
>> exact fields needed here, such as feat-id, which is also used as the bin
>> value.
> 
> Is that different to qcom_smem_get_feature_code()?

Thanks for review.
I am checking internally and will update with the exact difference from
feat-id. My understanding is that qcom_smem_get_feature_code() returns
the SMEM socinfo feature_code, while this code needs the QFPROM feat-id
field from the JTAG ID fuse word.

For this series, would prefer to keep the fuse-based path. The same
binding is also used by the generic i-temp fuse bit for Hamoa/future
targets, while the jtag-id/feat-id decoding remains only the
Kodiak/QCM6490-specific callback. Please let me know if you are fine 
with this approach.
> 
>> This jtag-id/feat-id decoding is Kodiak/QCM6490-specific, and the
>> thermal-bin mapping needs both values. Other/future targets are expected
>> to use only the generic i-temp fuse bit, like Hamoa.
> 
> So there are variants of kodiak that ""incorrectly"" set the feat_id?

No, Kodiak is not incorrectly setting it.

Kodiak/QCM6490 does not use the generic i-temp bit for this thermal
profile selection, it is using feat id only for high TJ profile. The 
i-temp path is for Hamoa/future targets where the thermal bin is exposed
as single bit.

> 
> Konrad


  reply	other threads:[~2026-10-27 12:59 UTC|newest]

Thread overview: 15+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2026-10-02 10:46 [PATCH 0/6] thermal: Add hardware-binned trip point support Gaurav Kohli
2026-10-02 10:46 ` [PATCH 1/6] dt-bindings: thermal: thermal-zones: add hardware-binning trip properties Gaurav Kohli
2026-10-13  6:24   ` Krzysztof Kozlowski
2026-10-19 14:09     ` Gaurav Kohli
2026-10-02 10:46 ` [PATCH 2/6] thermal: add hardware-binning trip-point filtering support Gaurav Kohli
2026-10-02 10:46 ` [PATCH 3/6] dt-bindings: thermal: qcom-tsens: document qcm6490 tsens Gaurav Kohli
2026-10-02 10:46 ` [PATCH 4/6] thermal: qcom: tsens: add hardware-bin trip-point filtering Gaurav Kohli
2026-10-22  9:09   ` Konrad Dybcio
2026-10-23 10:01     ` Gaurav Kohli
2026-10-26 11:51       ` Konrad Dybcio
2026-10-27 12:59         ` Gaurav Kohli [this message]
2026-10-02 10:47 ` [PATCH 5/6] arm64: dts: qcom: kodiak: use thermal hw-bin trips Gaurav Kohli
2026-10-22  9:09   ` Konrad Dybcio
2026-10-22 13:39     ` Gaurav Kohli
2026-10-02 10:47 ` [PATCH 6/6] arm64: dts: qcom: hamoa: add thermal hw-bin support Gaurav Kohli

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